公开(公告)号：US20230021915A1

公开(公告)日：2023-01-26

申请号：US17958504

申请日：2022-10-03

Applicant: Applied Materials, Inc.

Inventor： Levent COLAK ,  Ludovic GODET ,  Andre P. LABONTE

IPC: F21V8/00

Abstract: Embodiments described herein provide for methods of forming optical device structures. The methods utilize rotation of a substrate, to have the optical device structures formed thereon, and tunability of etch rates of a patterned resist disposed over the substrate and one of a device layer or the substrate to form the optical device structures without multiple lithographic patterning steps and angled etch steps.

公开(公告)号：US20230002268A1

公开(公告)日：2023-01-05

申请号：US17836162

申请日：2022-06-09

Applicant: Applied Materials, Inc.

Inventor： Wei-Sheng LEI ,  Mahendran CHIDAMBARAM ,  Kangkang WANG ,  Ludovic GODET ,  Visweswaren SIVARAMAKRISHNAN

IPC: C03B33/02 ,  B23K26/0622 ,  B23K26/55

Abstract: A method and apparatus for substrate dicing are described. The method includes utilizing a laser to dice a substrate along a dicing path to form a perforated line around each device within the substrate. The dicing path is created by exposing the substrate to bursts of laser pulses at different locations around each device. The laser pulses are delivered to the substrate and may have a pulse repetition frequency of greater than about 25 MHz, a pulse width of less than about 15 picoseconds, and a laser wavelength of about 1.0 μm to about 5 μm.

公开(公告)号：US20220291083A1

公开(公告)日：2022-09-15

申请号：US17692573

申请日：2022-03-11

Applicant: Applied Materials, Inc.

Inventor： Jinxin FU ,  Kang LUO ,  Fariah HAYEE ,  Ludovic GODET

IPC: G01M11/02

Abstract: A method of optical device metrology is provided. The method includes introducing a first type of light into a first optical device during a first time period, the first optical device including an optical substrate and an optical film disposed on the optical substrate, the first optical device further including a first surface, a second surface, and one or more sides connecting the first surface with the second surface; and measuring, during the first time period, a quantity of the first type of light transmitted from a plurality of locations on the first surface or the second surface during the first time period, wherein the measuring is performed by a detector coupled to one or more fiber heads positioned to collect the light transmitted from the plurality of locations.

公开(公告)号：US20220122240A1

公开(公告)日：2022-04-21

申请号：US17492905

申请日：2021-10-04

Applicant: Applied Materials, Inc.

Inventor： Yangyang SUN ,  Jinxin FU ,  Kazuya DAITO ,  Ludovic GODET

IPC: G06T7/00 ,  G02B5/00 ,  G01J1/44 ,  H04N5/247 ,  H04N5/225 ,  G06T7/90 ,  G06T7/80

Abstract: Embodiments of the present disclosure relate to optical devices for augmented, virtual, and/or mixed reality applications. In one or more embodiments, an optical device metrology system is configured to measure a plurality of first metrics and one or more second metrics for optical devices, the one or more second metrics including a display leakage metric.

公开(公告)号：US20220082738A1

公开(公告)日：2022-03-17

申请号：US17456507

申请日：2021-11-24

Applicant: Applied Materials, Inc.

Inventor： Michael Yu-tak YOUNG ,  Ludovic GODET ,  Robert Jan VISSER ,  Naamah ARGAMAN ,  Christopher Dennis BENCHER ,  Wayne MCMILLAN

IPC: G02B5/18 ,  G02B26/08 ,  G02B30/26

Abstract: Embodiments herein describe a sub-micron 3D diffractive optics element and a method for forming the sub-micron 3D diffractive optics element. In a first embodiment, a method is provided for forming a sub-micron 3D diffractive optics element on a film stack disposed on a substrate without planarization. The method includes forming a hardmask on a top surface of a film stack. Forming a mask material on a portion of the top surface and a portion of the hardmask. Etching the top surface. Trimming the mask. Etching the top surface again. Trimming the mask a second time. Etching the top surface yet again and then stripping the mask material.

公开(公告)号：US20220057710A1

公开(公告)日：2022-02-24

申请号：US17489551

申请日：2021-09-29

Applicant: Applied Materials, Inc.

Inventor： Michael Y. YOUNG ,  Ludovic GODET ,  Robert J. VISSER

IPC: G03F7/00

Abstract: Methods and apparatus for stamp generation are disclosed using nano-resist and ultra violet blocking materials. In one non-limiting embodiment, a method of producing a copy of a stamp for generating electrical/optical components is disclosed comprising: providing the stamp; coating a bottom surface of the stamp with a ultra violet blocking material; curing the ultra violet blocking material on the bottom surface; contacting the stamp to a target substrate covered with a layer of imprint resist; curing the imprint resist with ultraviolet blocking material during the contacting of the stamp to the target substrate; and releasing the stamp from the target substrate with the cured layer of imprint resist.

公开(公告)号：US20220004104A1

公开(公告)日：2022-01-06

申请号：US17468536

申请日：2021-09-07

Applicant: Applied Materials, Inc.

Inventor： Viachslav BABAYAN ,  Douglas A. BUCHBERGER, JR. ,  Qiwei LIANG ,  Ludovic GODET ,  Srinivas D. NEMANI ,  Daniel J. WOODRUFF ,  Randy HARRIS ,  Robert B. MOORE

IPC: G03F7/20 ,  G03F7/16 ,  G03F7/26 ,  G03F7/38 ,  H01L21/67 ,  G03F7/40 ,  H01L21/687

Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.

公开(公告)号：US20210180183A1

公开(公告)日：2021-06-17

申请号：US17184085

申请日：2021-02-24

Applicant: Applied Materials, Inc.

Inventor： Jinrui GUO ,  Ludovic GODET ,  Rutger MEYER TIMMERMAN THIJSSEN

IPC: C23C16/04 ,  C23C16/30 ,  C23C16/34 ,  C23C16/32 ,  C23C16/40 ,  C23C16/24 ,  C23C16/455

Abstract: Embodiments of the present disclosure generally relate to processing an optical workpiece containing grating structures on a substrate by deposition processes, such as atomic layer deposition (ALD). In one or more embodiments, a method for processing an optical workpiece includes positioning a substrate containing a first layer within a processing chamber, where the first layer contains grating structures separated by trenches formed in the first layer, and each of the grating structures has an initial critical dimension, and depositing a second layer on at least the sidewalls of the grating structures by ALD to produce corrected grating structures separated by the trenches, where each of the corrected grating structures has a corrected critical dimension greater than the initial critical dimension.

公开(公告)号：US20200326621A1

公开(公告)日：2020-10-15

申请号：US16844636

申请日：2020-04-09

Applicant: Applied Materials, Inc.

Inventor： Ludovic GODET ,  Chien-An CHEN ,  Brian Alexander COHEN ,  Wayne MCMILLAN ,  Ian Matthew MCMACKIN

IPC: G03F7/00 ,  G02B6/34

Abstract: Methods for patterning of multi-depth layers for the fabrication of optical devices are provided. In one embodiment, a method is provided that includes disposing a resist layer over a device layer disposed over a top surface of a substrate, the device layer having a first portion and a second portion, patterning the resist layer to form a first resist layer pattern having a plurality of first openings and a second resist layer pattern having a plurality of second openings, and etching exposed portions of the device layer defined by the plurality of first openings and the plurality of second openings, wherein the plurality of first openings are configured to form at least a portion of a plurality of first structures within the optical device, and the plurality of second openings are configured to form at least a portion of a plurality of second structures within the optical device.

公开(公告)号：US20200309598A1

公开(公告)日：2020-10-01

申请号：US16539930

申请日：2019-08-13

Applicant: Applied Materials, Inc.

Inventor： Jinxin FU ,  Yifei WANG ,  Ian MCMACKIN ,  Rutger MEYER TIMMERMAN THIJSSEN ,  Ludovic GODET

IPC: G01J3/18 ,  G01J3/02 ,  G02B7/04

Abstract: Embodiments of the present disclosure relate to measurement systems and methods for diffracting light. The measurement system includes a stage, an optical arm, and one or more detector arms. The method of diffracting light includes a method of diffracting light is provided, including projecting light beams having wavelength λlaser to a first zone of a first substrate at the fixed beam angle θ0 and the maximum orientation angle ϕmax, obtaining a displacement angle Δθ, determining a target maximum beam angle θt-max, wherein θt-max=θ0=Δθ, and determining a test grating pitch Pt-grating by a modified grating pitch equation Pt-grating=λlaser/(sin θ0). The measurement system and method allow for measurement of nonuniform properties of regions of an optical device, such as grating pitches and grating orientations.