公开(公告)号：US20110071636A1

公开(公告)日：2011-03-24

申请号：US12628133

申请日：2009-11-30

申请人： Yang-Hwei Tsuang ,  Cheng-Kung Cheng ,  Hung-Wen Wei ,  Chang-Jung Chiang ,  Wen-Chuan Chen ,  Yueh-Feng Chiang ,  Wei-Cheng Wang

发明人： Yang-Hwei Tsuang ,  Cheng-Kung Cheng ,  Hung-Wen Wei ,  Chang-Jung Chiang ,  Wen-Chuan Chen ,  Yueh-Feng Chiang ,  Wei-Cheng Wang

IPC分类号： A61F2/44

CPC分类号： A61F2/4425 ,  A61F2002/30387 ,  A61F2002/30505 ,  A61F2002/30604 ,  A61F2002/3065 ,  A61F2002/30654 ,  A61F2002/30879 ,  A61F2002/30883

摘要： A displacement leaf spring and an artificial intervertebral disc containing the same, particularly about the artificial intervertebral disc using the displacement leaf spring to cushion axial compression, wherein the artificial intervertebral disc includes a displacement leaf spring and the displacement leaf spring further includes an upper plate, an inclined plate, and a lower plate. The upper plate has a first breach, and the inclined plate has a first connecting side which connects to one side of the first breach. There is an angle between the inclined plate and the upper plate. The inclined plate has a second breach, and the lower plate has a second connecting side which connects to one side of the second breach. There is an angle between the lower plate and the inclined plate, and the lower plate parallels the upper plate. The artificial intervertebral disc equipped with the displacement leaf spring further comprises a top plate, a bottom plate, a core structure, and a socket structure. The top and bottom plate connect to the bottom of the upper vertebral body and the top of the lower vertebral body respectively. The form of the core structure fits in the socket structure. The core structure and the socket structure are installed between the top and bottom plate to make the artificial intervertebral disc have a wide range of activity angle and capability to cushion the axial compression.

摘要翻译： 位移板簧和包含其的人造椎间盘，特别是关于使用位移板簧缓冲轴向压缩的人造椎间盘，其中人造椎间盘包括位移板簧，并且位移板簧还包括上板， 倾斜板和下板。 上板具有第一突出部，并且倾斜板具有连接到第一突出部的一侧的第一连接侧。 倾斜板和上板之间有一个角度。 倾斜板具有第二突破，下板具有连接到第二突破的一侧的第二连接侧。 下板与倾斜板之间有一角度，下板与上板平行。 配备有位移板簧的人造椎间盘还包括顶板，底板，芯结构和插座结构。 顶板和底板分别连接到上椎体的底部和下椎体的顶部。 核心结构的形式适合插座结构。 核心结构和插座结构安装在顶板和底板之间，使得人造椎间盘具有宽范围的活动角度和缓冲轴向压缩的能力。

公开(公告)号：US06646316B2

公开(公告)日：2003-11-11

申请号：US09770049

申请日：2001-01-24

申请人： Jichen Wu ,  Hsiu Wen Tu ,  Kuo Feng Peng ,  C. H. Chen ,  Wen Chuan Chen

发明人： Jichen Wu ,  Hsiu Wen Tu ,  Kuo Feng Peng ,  C. H. Chen ,  Wen Chuan Chen

IPC分类号： H01L310203

CPC分类号： H01L31/0203 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： A package structure of an image sensor is characterized in that an image sensing chip is directly packaged on a flexible circuit board by way of flip chip bonding. The package structure of an image sensor includes an image sensing chip, a flexible circuit board, and a transparent layer. A plurality of electrical circuits are formed on the image sensing chip. Each of the electrical circuits is formed with bonding pads. A flexible circuit board has an upper surface and a lower surface. Signal input terminals are formed on the lower surface and at positions corresponding to each of the bonding pads of the image sensing chip, respectively, for electrically connecting to the corresponding bonding pads of the image sensing chip. The signal input terminals are electrically connected to signal output terminals, respectively, for electrically connecting to the printed circuit board. The transparent layer is used for covering the upper surface of the flexible circuit board. The image sensing chip receives image signals via the transparent layer, transforms the image signals into electrical signals, and transmits the electrical signals from the flexible circuit board to the printed circuit board.

摘要翻译： 图像传感器的封装结构的特征在于，通过倒装芯片接合将图像感测芯片直接封装在柔性电路板上。 图像传感器的封装结构包括图像感测芯片，柔性电路板和透明层。 在图像感测芯片上形成多个电路。 每个电路由接合焊盘形成。 柔性电路板具有上表面和下表面。 信号输入端子分别形成在下表面和对应于图像感测芯片的每个接合焊盘的位置处，用于电连接到图像感测芯片的相应接合焊盘。 信号输入端子分别电连接到信号输出端子，用于电连接到印刷电路板。 透明层用于覆盖柔性电路板的上表面。 图像感测芯片通过透明层接收图像信号，将图像信号转换为电信号，并将电信号从柔性电路板传输到印刷电路板。

公开(公告)号：US20160201577A1

公开(公告)日：2016-07-14

申请号：US14821324

申请日：2015-08-07

申请人： Wen-Chuan CHEN

发明人： Wen-Chuan CHEN

IPC分类号： F02D9/10 ,  F16K31/12

CPC分类号： F02D9/10 ,  F02D9/101 ,  F02D9/1065 ,  F02D9/1095 ,  F02D2009/024 ,  F02D2009/0269 ,  F16K15/038 ,  F16K31/12

摘要： A gas flow adjusting device is provided, which includes a tube body, a first horizontal shaft, a second horizontal shaft, two leaf structures, a torsional spring and two linkage assemblies. The first and second horizontal shafts are disposed in an accommodating space of the tube body and spaced apart from each other along an axial direction of the tube body. The leaf structures are pivoted on the first horizontal shaft and have a swinging direction identical to the axial direction. The torsional spring is sleeved around the second horizontal shaft and provides a resilient force along the axial direction. The linkage assemblies are connected to the leaf structures respectively, and each of the linkage assemblies is connected to the second horizontal shaft and the torsional spring. Therefore, when the leaf structures swing to different angles, the twisting amounts of the torsional spring are minimally varied.

摘要翻译： 提供一种气流调节装置，其包括管体，第一水平轴，第二水平轴，两叶结构，扭转弹簧和两个连杆组件。 第一和第二水平轴设置在管体的容纳空间中并且沿管体的轴向彼此间隔开。 叶片结构在第一水平轴上枢转并且具有与轴向相同的摆动方向。 扭转弹簧围绕第二水平轴套管并沿轴向提供弹性力。 连杆组件分别连接到叶片结构，并且每个连杆组件连接到第二水平轴和扭转弹簧。 因此，当叶片结构摆动到不同的角度时，扭转弹簧的扭转量最小化。

公开(公告)号：US20110084289A1

公开(公告)日：2011-04-14

申请号：US12732196

申请日：2010-03-26

申请人： Wen-Hsien Tseng ,  Yen-Heng Huang ,  Chia-Hui Pai ,  Chung-Kai Chen ,  Wei-Yuan Cheng ,  Wen-Chuan Chen

发明人： Wen-Hsien Tseng ,  Yen-Heng Huang ,  Chia-Hui Pai ,  Chung-Kai Chen ,  Wei-Yuan Cheng ,  Wen-Chuan Chen

IPC分类号： H01L33/08 ,  H01L21/28

CPC分类号： H01L29/41733 ,  G02F1/136209 ,  G02F2001/13373 ,  G02F2001/136222 ,  H01L27/1248 ,  H01L27/1288

摘要： An active device array substrate including a substrate, a plurality of scan lines, a plurality of data lines, a plurality of active devices, a first passivation layer, a transparent pad layer, a plurality of color filter patterns, a second passivation layer, a plurality of pixel electrodes, and a black matrix layer is provided. Each of the active devices is electrically connected to one of the scan lines and one of the data lines, respectively. The transparent pad layer having a plurality of openings for accommodating the color filter patterns is disposed on the first passivation layer located above the scan lines and the data lines. The first passivation layer, the color filter patterns and the second passivation layer have a plurality of contact windows therein. The black matrix layer is disposed above the transparent pad layer to cover a portion of the pixel electrodes.

摘要翻译： 一种有源器件阵列衬底，包括衬底，多条扫描线，多条数据线，多个有源器件，第一钝化层，透明衬垫层，多个滤色器图案，第二钝化层， 提供多个像素电极和黑矩阵层。 每个有源器件分别电连接到扫描线之一和数据线之一。 具有用于容纳滤色器图案的多个开口的透明垫层设置在位于扫描线和数据线上方的第一钝化层上。 第一钝化层，滤色器图案和第二钝化层在其中具有多个接触窗口。 黑矩阵层设置在透明衬垫层的上方以覆盖像素电极的一部分。

公开(公告)号：US20100217389A1

公开(公告)日：2010-08-26

申请号：US12467878

申请日：2009-05-18

申请人： Cheng-Kung CHENG ,  Chih-Hwa CHEN ,  Hung-Wen WEI ,  Wen-Chuan CHEN ,  Ping-Sheng YU

发明人： Cheng-Kung CHENG ,  Chih-Hwa CHEN ,  Hung-Wen WEI ,  Wen-Chuan CHEN ,  Ping-Sheng YU

IPC分类号： A61F2/08

CPC分类号： A61F2/0811 ,  A61F2/0805 ,  A61F2002/0829 ,  A61F2002/0852 ,  A61F2002/0882

摘要： The present invention discloses a graft attachment device for cruciate ligament reconstruction comprises a body having a screw portion with a threading area on the front end of the body, a connection member disposed on the front end, a gap formed between the front end and a predetermined portion of the body adapted for a rope-type member pass through, a pivoting member pivoted on the rear end of the body with its front end, the rear end of the pivoting member having a juncture portion for fixing a ligament, thereby the device could be screwed and fixed on a bone when rotating the device, and seamed a ligament on the rear end of the device.

摘要翻译： 本发明公开了一种用于十字韧带重建的移植物附着装置，包括：主体，其具有在主体的前端具有螺纹区域的螺纹部分，设置在前端的连接构件，形成在前端和预定 适于绳型构件的主体部分通过，枢转构件在其前端在主体的后端枢转，枢转构件的后端具有用于固定韧带的接合部，从而该装置可以 在旋转装置时拧紧固定在骨头上，并在装置的后端缝合一根韧带。

公开(公告)号：US06521881B2

公开(公告)日：2003-02-18

申请号：US09836160

申请日：2001-04-16

申请人： Hsiu Wen Tu ,  Wen Chuan Chen ,  Mon Nan Ho ,  Li Huan Chen ,  Jichen Wu ,  Meng Ru Tsai

发明人： Hsiu Wen Tu ,  Wen Chuan Chen ,  Mon Nan Ho ,  Li Huan Chen ,  Jichen Wu ,  Meng Ru Tsai

IPC分类号： H01L2700

CPC分类号： H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/00014

摘要： A stacked structure of an image sensor includes a substrate, an integrated circuit, a package layer, an image sensing chip, and a transparent layer. The integrated circuit is formed on the substrate and electrically connected to the substrate. The package layer covers the integrated circuit. The image sensing chip is placed on the package layer to form the stacked structure with the integrated circuit and is electrically connected to the substrate. The transparent layer is arranged above the image sensing chip for the image sensing chip to receive image signals via the transparent layer. According to this structure, the image sensing chip and the integrated circuit can be integrally stacked easily.

摘要翻译： 图像传感器的堆叠结构包括基板，集成电路，封装层，图像感测芯片和透明层。 集成电路形成在基板上并电连接到基板。 封装层覆盖集成电路。 将图像感测芯片放置在封装层上，以形成具有集成电路的堆叠结构，并与基板电连接。 透明层设置在用于图像感测芯片的图像感测芯片上方以经由透明层接收图像信号。 根据该结构，可以容易地整合图像感测芯片和集成电路。

公开(公告)号：US06489572B2

公开(公告)日：2002-12-03

申请号：US09768981

申请日：2001-01-23

申请人： Mon Nan Ho ,  Chih-Hong Chen ,  Yen Cheng Huang ,  Li Huan Chen ,  Kuo Feng Peng ,  Jichen Wu ,  Allis Chen ,  Wen Chuan Chen

发明人： Mon Nan Ho ,  Chih-Hong Chen ,  Yen Cheng Huang ,  Li Huan Chen ,  Kuo Feng Peng ,  Jichen Wu ,  Allis Chen ,  Wen Chuan Chen

IPC分类号： H05K103

CPC分类号： H01L23/49861 ,  H01L2224/48091 ,  H01L2224/48465 ,  Y10T29/49128 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T156/109 ,  H01L2924/00014 ,  H01L2924/00

摘要： A substrate structure for an integrated circuit package. The substrate is electrically connected to a circuit board and an integrated circuit. The substrate includes a plurality of metal sheets and glue. The metal sheets are arranged opposite to each other. Each of the metal sheets includes a first surface and a second surface. The glue is used for sealing the plurality of metal sheet to form the substrate. The first surfaces and second surfaces of the metal sheets are exposed to the outside of the glue so as to form a plurality of signal input terminals for electrically connecting to the integrated circuit and a plurality of signal output terminals for electrically connecting to the circuit board. Thus, the signal output terminals of the metal sheets can be electrically connected to the circuit board smoothly. Furthermore, the signal transmission distance between the integrated circuit and the circuit board can be shortened so that better signal transmission effect can be obtained. A method for manufacturing the substrate is also disclosed.

摘要翻译： 一种用于集成电路封装的衬底结构。 基板电连接到电路板和集成电路。 基板包括多个金属片和胶。 金属板彼此相对布置。 每个金属片包括第一表面和第二表面。 胶被用于密封多个金属片以形成基底。 金属板的第一表面和第二表面暴露于胶的外部，以形成用于电连接到集成电路的多个信号输入端子和用于电连接到电路板的多个信号输出端子。 因此，金属片的信号输出端子可以平滑地电连接到电路板。 此外，可以缩短集成电路和电路板之间的信号传输距离，从而可以获得更好的信号传输效果。 还公开了一种用于制造衬底的方法。

公开(公告)号：US09664119B2

公开(公告)日：2017-05-30

申请号：US14821324

申请日：2015-08-07

申请人： Wen-Chuan Chen

发明人： Wen-Chuan Chen

IPC分类号： F02D9/10 ,  F16K31/12 ,  F16K15/03 ,  F02D9/02

CPC分类号： F02D9/10 ,  F02D9/101 ,  F02D9/1065 ,  F02D9/1095 ,  F02D2009/024 ,  F02D2009/0269 ,  F16K15/038 ,  F16K31/12

摘要： A gas flow adjusting device is provided, which includes a tube body, a first horizontal shaft, a second horizontal shaft, two leaf structures, a torsional spring and two linkage assemblies. The first and second horizontal shafts are disposed in an accommodating space of the tube body and spaced apart from each other along an axial direction of the tube body. The leaf structures are pivoted on the first horizontal shaft and have a swinging direction identical to the axial direction. The torsional spring is sleeved around the second horizontal shaft and provides a resilient force along the axial direction. The linkage assemblies are connected to the leaf structures respectively, and each of the linkage assemblies is connected to the second horizontal shaft and the torsional spring. Therefore, when the leaf structures swing to different angles, the twisting amounts of the torsional spring are minimally varied.

公开(公告)号：US08421961B2

公开(公告)日：2013-04-16

申请号：US12732196

申请日：2010-03-26

申请人： Wen-Hsien Tseng ,  Yen-Heng Huang ,  Chia-Hui Pai ,  Chung-Kai Chen ,  Wei-Yuan Cheng ,  Wen-Chuan Chen

发明人： Wen-Hsien Tseng ,  Yen-Heng Huang ,  Chia-Hui Pai ,  Chung-Kai Chen ,  Wei-Yuan Cheng ,  Wen-Chuan Chen

IPC分类号： G02F1/1333

CPC分类号： H01L29/41733 ,  G02F1/136209 ,  G02F2001/13373 ,  G02F2001/136222 ,  H01L27/1248 ,  H01L27/1288

摘要： An active device array substrate including a substrate, a plurality of scan lines, a plurality of data lines, a plurality of active devices, a first passivation layer, a transparent pad layer, a plurality of color filter patterns, a second passivation layer, a plurality of pixel electrodes, and a black matrix layer is provided. Each of the active devices is electrically connected to one of the scan lines and one of the data lines, respectively. The transparent pad layer having a plurality of openings for accommodating the color filter patterns is disposed on the first passivation layer located above the scan lines and the data lines. The first passivation layer, the color filter patterns and the second passivation layer have a plurality of contact windows therein. The black matrix layer is disposed above the transparent pad layer to cover a portion of the pixel electrodes.

摘要翻译： 一种有源器件阵列衬底，包括衬底，多条扫描线，多条数据线，多个有源器件，第一钝化层，透明衬垫层，多个滤色器图案，第二钝化层， 提供多个像素电极和黑矩阵层。 每个有源器件分别电连接到扫描线之一和数据线之一。 具有用于容纳滤色器图案的多个开口的透明垫层设置在位于扫描线和数据线上方的第一钝化层上。 第一钝化层，滤色器图案和第二钝化层在其中具有多个接触窗口。 黑矩阵层设置在透明衬垫层的上方以覆盖像素电极的一部分。

公开(公告)号：US08293572B2

公开(公告)日：2012-10-23

申请号：US13010192

申请日：2011-01-20

申请人： Wen-Chuan Chen ,  Nan-Chun Lin

发明人： Wen-Chuan Chen ,  Nan-Chun Lin

IPC分类号： H01L21/00

CPC分类号： H01L21/565 ,  B29C45/14639 ,  H01L23/3121 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/00

摘要： The injection molding system comprises a substrate, an inner cover, a molding tool, and a bottom plate. The substrate is used to locate at least one semiconductor device under molding and the inner cover with at least one first injection via, cavity and runner placed over the substrate. In addition, the molding tool includes at least one second injecting via aligned with the runner and the bottom plate is placed under the substrate. Furthermore, a filling material is filled into the cavity and runner of the inner cover during molding. In order to avoid overflowing the filling material, the system further comprises an O-ring placed between the molding tool and the inner cover. The inner radius of the O-ring corresponds with the inner radius of the injection via and is aligned with it.

摘要翻译： 注塑系统包括基底，内盖，模制工具和底板。 衬底用于在模制下定位至少一个半导体器件，并且内盖具有放置在衬底上的至少一个第一注入通孔，空腔和流道。 此外，成型工具包括至少一个与流道对准的第二注射孔，并且底板被放置在基底之下。 此外，在成型期间，将填充材料填充到内盖的空腔和流道中。 为了避免填充材料溢出，系统还包括置于模制工具和内盖之间的O形环。 O形环的内半径对应于注射通孔的内半径并与其对准。