公开(公告)号：US06565008B2

公开(公告)日：2003-05-20

申请号：US10018072

申请日：2001-12-04

申请人： Mon Nan Ho ,  Hsiu Wen Tu ,  Kuo Feng Feng ,  Yung Sheng Chiu ,  Joe Liu ,  Nai Hua Yeh ,  Wen Chuan Chen ,  Allis Chen

发明人： Mon Nan Ho ,  Hsiu Wen Tu ,  Kuo Feng Feng ,  Yung Sheng Chiu ,  Joe Liu ,  Nai Hua Yeh ,  Wen Chuan Chen ,  Allis Chen

IPC分类号： G06K1906

CPC分类号： H01L23/49855 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A manufacturing method of a module card comprises steps of: providing a base board having a golden finger; mounting a chip on the base board for electrically connecting to the golden finger; and forming a packing layer on the chip for forming the module card. A module card comprises: a base board; a chip mounting on a surface of the base board; a golden finger on the board and electrically connecting to the chip; and a packing layer forming on the chip for covering the chip.

摘要翻译： 模块卡的制造方法包括以下步骤：提供具有金手指的基板; 在基板上安装芯片以电连接到金手指; 以及在芯片上形成用于形成模块卡的填充层。 模块卡包括：基板; 芯片安装在基板的表面上; 一个金手指在电路板上并与芯片电连接; 以及形成在芯片上用于覆盖芯片的填充层。

公开(公告)号：US06559539B2

公开(公告)日：2003-05-06

申请号：US09770084

申请日：2001-01-24

申请人： Hsiu Wen Tu ,  Wen Chuan Chen ,  Mon Nan Ho ,  Li Huan Chen ,  Nai Hua Yeh ,  Yen Cheng Huang ,  Yung Sheng Chiu ,  Jichen Wu

发明人： Hsiu Wen Tu ,  Wen Chuan Chen ,  Mon Nan Ho ,  Li Huan Chen ,  Nai Hua Yeh ,  Yen Cheng Huang ,  Yung Sheng Chiu ,  Jichen Wu

IPC分类号： H01L2334

CPC分类号： H01L25/0657 ,  H01L31/0203 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/16195 ,  H01L2924/1627 ,  H01L2924/00 ,  H01L2224/0401

摘要： A stacked package structure of an image sensor used for electrically connecting to a printed circuit board includes a substrate, an image sensing chip, an integrated circuit, and a transparent layer. The substrate has a first surface and a second surface. The first surface is formed with signal input terminals. The second surface is formed with signal input terminals and signal output terminals for electrically connecting to the printed circuit board. The image sensing chip is mounted on the first surface of the substrate and is electrically to the signal input terminals of the substrate. The integrated circuit is arranged on the second surface of the substrate and is electrically connected to the signal input terminals of the substrate. The transparent layer covers over the image sensing chip, which can receive the image signals via the transparent layer and convert the image signals into electrical signals that are to be transmitted to the substrate. Thus, the image sensing chip of the image sensing product and integrated circuit can be integrally packaged.

摘要翻译： 用于电连接到印刷电路板的图像传感器的堆叠封装结构包括基板，图像感测芯片，集成电路和透明层。 基板具有第一表面和第二表面。 第一表面由信号输入端子形成。 第二表面形成有用于电连接到印刷电路板的信号输入端子和信号输出端子。 图像感测芯片安装在基板的第一表面上并且电连接到基板的信号输入端子。 集成电路布置在基板的第二表面上并且电连接到基板的信号输入端子。 透明层覆盖图像感测芯片，其可以经由透明层接收图像信号，并将图像信号转换成要传输到基板的电信号。 因此，图像感测产品和集成电路的图像感测芯片可以被整体封装。

公开(公告)号：US06191543B1

公开(公告)日：2001-02-20

申请号：US09301213

申请日：1999-04-28

申请人： Chen-Kuo Lai ,  Wen-Chuan Chen ,  Ying-Min Chen ,  Chang-Yu Ho

发明人： Chen-Kuo Lai ,  Wen-Chuan Chen ,  Ying-Min Chen ,  Chang-Yu Ho

IPC分类号： H02P154

CPC分类号： G05B19/414 ,  G05B2219/34008 ,  G05B2219/34015 ,  G05B2219/34029 ,  G05B2219/34034 ,  G05B2219/34041

摘要： The present invention is an integral-type IC for multiple-axis position control to provide highly integrated and modular design for the positioning control of automatic system. The inventive IC comprises a plurality of digital differential analyzers (DDA) with output pulse circuit which convert the position command to pulse form, a plurality of servo motor position closed loop control positioning circuit, and a plurality of counters that works with motor encoder to precisely control the rotation speed and motion position of the motor. Thus the invention the position control function in a single IC.

摘要翻译： 本发明是用于多轴位置控制的集成型IC，为自动系统的定位控制提供高度集成和模块化的设计。 本发明的IC包括多个数字差分分析器（DDA），其具有将位置命令转换为脉冲形式的输出脉冲电路，多个伺服电动机位置闭环控制定位电路以及与电动机编码器精确地工作的多个计数器 控制电机的转速和运动位置。 因此，本发明在单个IC中的位置控制功能。

公开(公告)号：US08861553B2

公开(公告)日：2014-10-14

申请号：US13209194

申请日：2011-08-12

申请人： Wen-Chuan Chen ,  Ying-Min Chen ,  Chia-Ching Lin ,  Cheng-Xue Wu ,  Jing-Yi Huang

发明人： Wen-Chuan Chen ,  Ying-Min Chen ,  Chia-Ching Lin ,  Cheng-Xue Wu ,  Jing-Yi Huang

IPC分类号： H04J3/06 ,  H04L1/00 ,  H03M5/12 ,  H03M13/09

CPC分类号： H04L1/0061 ,  H03M5/12 ,  H03M13/09

摘要： An asynchronous master-slave serial communication system, a data transmission method, and a control module using the same are disclosed. The asynchronous master-slave serial communication system comprises a master control module and a slave control module. The master control module generates a check code according to an address information and a data information, and generates a data package according to the address information, the data information, the check code and the master clock signal. The slave control module generates a decoding data according to the data package and a slave clock signal, and generates the address information, the data information and the check code according to the decoding data.

摘要翻译： 公开了一种异步主从串行通信系统，数据传输方法和使用其的控制模块。 异步主从串行通信系统包括主控模块和从控制模块。 主控制模块根据地址信息和数据信息生成检查码，并根据地址信息，数据信息，校验码和主时钟信号生成数据包。 从控制模块根据数据包和从时钟信号产生解码数据，并根据解码数据生成地址信息，数据信息和校验码。

公开(公告)号：US20120275454A1

公开(公告)日：2012-11-01

申请号：US13209194

申请日：2011-08-12

申请人： Wen-Chuan Chen ,  Ying-Min Chen ,  Chia-Ching Lin ,  Cheng-Xue Wu ,  Jing-Yi Huang

发明人： Wen-Chuan Chen ,  Ying-Min Chen ,  Chia-Ching Lin ,  Cheng-Xue Wu ,  Jing-Yi Huang

IPC分类号： H04L27/00 ,  H04L25/49 ,  H04L12/56

CPC分类号： H04L1/0061 ,  H03M5/12 ,  H03M13/09

摘要： An asynchronous master-slave serial communication system, a data transmission method, and a control module using the same are disclosed. The asynchronous master-slave serial communication system comprises a master control module and a slave control module. The master control module generates a check code according to an address information and a data information, and generates a data package according to the address information, the data information, the check code and the master clock signal. The slave control module generates a decoding data according to the data package and a slave clock signal, and generates the address information, the data information and the check code according to the decoding data.

摘要翻译： 公开了一种异步主从串行通信系统，数据传输方法和使用其的控制模块。 异步主从串行通信系统包括主控模块和从控制模块。 主控制模块根据地址信息和数据信息生成检查码，并根据地址信息，数据信息，校验码和主时钟信号生成数据包。 从控制模块根据数据包和从时钟信号产生解码数据，并根据解码数据生成地址信息，数据信息和校验码。

公开(公告)号：US08090455B2

公开(公告)日：2012-01-03

申请号：US12466912

申请日：2009-05-15

申请人： Ying-Min Chen ,  Wen-Chuan Chen ,  Jing-Yi Huang ,  Cheng-Xue Wu ,  Chia-Ching Lin ,  Wan-Kai Shen

发明人： Ying-Min Chen ,  Wen-Chuan Chen ,  Jing-Yi Huang ,  Cheng-Xue Wu ,  Chia-Ching Lin ,  Wan-Kai Shen

IPC分类号： G06F19/00

CPC分类号： G05B11/42 ,  G05B2219/41199 ,  G05B2219/41434

摘要： A motion control servo loop apparatus, comprising: a feed-forward control module, and a proportional-integral-derivative (PID) control loop and a compensation adder. The feed-forward control module is capable of generating a feed-forward compensation. The PID control loop further comprises: a proportional control module, an integral control module and a derivative control module. The proportional control module is capable of generating a proportional compensation. The derivative control module is capable of generating a derivative compensation. The integral control module uses a digital differential analyzer (DDA) algorithm to perform integration for accumulated errors with respect to each sampling clock at each DDA pulse and thus output an accumulated error, which is then processed to generate an integral compensation. Thereafter, the compensation adder receives the feed-forward compensation, the proportional compensation, the integral compensation and the derivative compensation to calculate a position error compensation for a motor driver.

摘要翻译： 一种运动控制伺服环路装置，包括：前馈控制模块和比例积分微分（PID）控制回路和补偿加法器。 前馈控制模块能够产生前馈补偿。 PID控制回路还包括：比例控制模块，积分控制模块和微分控制模块。 比例控制模块能够产生比例补偿。 微分控制模块能够产生微分补偿。 积分控制模块使用数字差分分析器（DDA）算法对每个DDA脉冲处的每个采样时钟执行累积误差的积分，从而输出累积误差，然后对其进行处理以产生积分补偿。 此后，补偿加法器接收前馈补偿，比例补偿，积分补偿和微分补偿，以计算电机驱动器的位置误差补偿。

公开(公告)号：US20070014677A1

公开(公告)日：2007-01-18

申请号：US11230451

申请日：2005-09-21

申请人： Wen-Chuan Chen ,  Hou-Chu Chen ,  Chin-Chu Hsu ,  Wen-Shi Huang

发明人： Wen-Chuan Chen ,  Hou-Chu Chen ,  Chin-Chu Hsu ,  Wen-Shi Huang

IPC分类号： F04B17/00

CPC分类号： F04D13/0673 ,  F04D29/026 ,  F05D2230/54 ,  F05D2300/171 ,  F05D2300/43

摘要： A housing of a pump includes a fluid inlet and a fluid outlet. A rotor of the pump is disposed in the housing and includes a rotating portion, a magnet, and a bearing. The magnet is disposed on one side of the rotating portion. The bearing is disposed in the center of the rotating portion. A stator is disposed in the housing and corresponds to the magnet of the rotor, providing electromagnetic force required for rotation of the rotor. The rotating portion, magnet, and bearing are integrally formed as single unit by injection molding.

摘要翻译： 泵的壳体包括流体入口和流体出口。 泵的转子设置在壳体中并且包括旋转部分，磁体和轴承。 磁体设置在旋转部的一侧。 轴承设置在旋转部分的中心。 定子被布置在壳体中并且对应于转子的磁体，从而提供旋转所需的电磁力。 旋转部分，磁体和轴承通过注射成型一体形成为单个单元。

公开(公告)号：US06627983B2

公开(公告)日：2003-09-30

申请号：US09770083

申请日：2001-01-24

申请人： Hsiu Wen Tu ,  Wen Chuan Chen ,  Mon Nan Ho ,  Li Huan Chen ,  Nai Hua Yeh ,  Yen Cheng Huang ,  Yung Sheng Chiu ,  Jichen Wu ,  Joe Liu ,  Wu Hsiang Lee

发明人： Hsiu Wen Tu ,  Wen Chuan Chen ,  Mon Nan Ho ,  Li Huan Chen ,  Nai Hua Yeh ,  Yen Cheng Huang ,  Yung Sheng Chiu ,  Jichen Wu ,  Joe Liu ,  Wu Hsiang Lee

IPC分类号： H01L2302

CPC分类号： H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/00014

摘要： A stacked package structure of an image sensor for electrically connecting to a printed circuit board includes a first substrate, a second substrate, an integrated circuit, an image sensing chip, and a transparent layer. The second substrate is mounted on the first substrate so as to a cavity formed between the first substrate and second substrate. The integrated circuit is located within the cavity and electrically connected the first substrate. The image-sensing chip is arranged on the second substrate. The transparent layer covers over the image sensing chip, wherein the image sensing chip receives image signals via the transparent layer and transforms the image signals into electrical signals transmitted to the first substrate. Thus, the image sensing chip of the image sensing product and the integrated circuit can be integrally package.

公开(公告)号：US06460092B1

公开(公告)日：2002-10-01

申请号：US09320243

申请日：1999-05-26

申请人： Chen-Kuo Lai ,  Wen-Chuan Chen ,  Ying-Min Chen ,  Chang-Yu Ho

发明人： Chen-Kuo Lai ,  Wen-Chuan Chen ,  Ying-Min Chen ,  Chang-Yu Ho

IPC分类号： G06F1314

CPC分类号： G06F13/4282 ,  G06F13/10

摘要： A distributed-type input/output control IC is proposed to provide an integrated type improvement to the conventional remote control system. The distributed-type input/output control IC comprises a plurality of local digital IO and a plurality of remote IO master to control a plurality sets of local and remote systems and to simplify wiring.

摘要翻译： 提出了一种分布式输入/输出控制IC，以提供对传统遥控系统的集成式改进。 分布式输入/输出控制IC包括多个本地数字IO和多个远程IO主机，以控制多组本地和远程系统并简化布线。

公开(公告)号：US06441496B1

公开(公告)日：2002-08-27

申请号：US09768987

申请日：2001-01-23

申请人： Wen Chuan Chen ,  Kuo Feng Peng ,  Jichen Wu ,  Chia Jung Chang

发明人： Wen Chuan Chen ,  Kuo Feng Peng ,  Jichen Wu ,  Chia Jung Chang

IPC分类号： H01L23495

CPC分类号： H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83139 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00014

摘要： The structure of stacked integrated circuits includes a substrate, a lower integrated circuit, a plurality of wirings, an adhesive layer, and an upper integrated circuit. The substrate has a first surface formed with signal input terminals, and a second surface formed with signal output terminals. The lower integrated circuit has a first surface and a second surface. The first surface is adhered to the first surface of the substrate while the second surface is formed with a plurality of bonding pads. The wirings have first ends and second ends. The first ends are electrically connected to the bonding pads of the lower integrated circuit while the second ends are electrically connected to the signal input terminals of the substrate. The adhesive layer is coated on the second surface of the lower integrated circuit and includes adhesive agent and filling elements. The upper integrated circuit is stacked above the second surface of the lower integrated circuit with the adhesive layer inserted between the upper and lower integrated circuit. The lower integrated circuit is adhered to the upper integrated circuit by the adhesive agent. A predetermined gap is formed between the lower and upper integrated circuit by the filling elements. According to this structure, the wirings located under the lower integrated circuit are free from being pressed and damaged by the upper integrated circuit when stacking a plurality of integrated circuits. Thus, the stacking processes can be facilitated and the manufacturing costs can also be lowered.

摘要翻译： 堆叠集成电路的结构包括基板，下部集成电路，多个布线，粘合层和上部集成电路。 衬底具有形成有信号输入端的第一表面和形成有信号输出端的第二表面。 下集成电路具有第一表面和第二表面。 第一表面粘附到基板的第一表面，而第二表面形成有多个接合焊盘。 布线具有第一端和第二端。 第一端电连接到下集成电路的接合焊盘，而第二端电连接到衬底的信号输入端。 粘合剂层涂覆在下部集成电路的第二表面上并且包括粘合剂和填充元件。 上集成电路堆叠在下集成电路的第二表面上方，粘合层插入在上下集成电路之间。 下集成电路通过粘合剂粘附到上集成电路。 通过填充元件在下集成电路和上集成电路之间形成预定的间隙。 根据该结构，当堆叠多个集成电路时，位于下部集成电路下方的配线不受上部集成电路的压制和损坏。 因此，可以促进堆叠处理，并且还可以降低制造成本。