摘要:
A substrate structure for an integrated circuit package. The substrate is electrically connected to a circuit board and an integrated circuit. The substrate includes a plurality of metal sheets and glue. The metal sheets are arranged opposite to each other. Each of the metal sheets includes a first surface and a second surface. The glue is used for sealing the plurality of metal sheet to form the substrate. The first surfaces and second surfaces of the metal sheets are exposed to the outside of the glue so as to form a plurality of signal input terminals for electrically connecting to the integrated circuit and a plurality of signal output terminals for electrically connecting to the circuit board. Thus, the signal output terminals of the metal sheets can be electrically connected to the circuit board smoothly. Furthermore, the signal transmission distance between the integrated circuit and the circuit board can be shortened so that better signal transmission effect can be obtained. A method for manufacturing the substrate is also disclosed.
摘要:
A stacked package structure of an image sensor for electrically connecting to a printed circuit board includes a first substrate, a second substrate, an integrated circuit, an image sensing chip, and a transparent layer. The second substrate is mounted on the first substrate so as to a cavity formed between the first substrate and second substrate. The integrated circuit is located within the cavity and electrically connected the first substrate. The image-sensing chip is arranged on the second substrate. The transparent layer covers over the image sensing chip, wherein the image sensing chip receives image signals via the transparent layer and transforms the image signals into electrical signals transmitted to the first substrate. Thus, the image sensing chip of the image sensing product and the integrated circuit can be integrally package.
摘要:
A circular knitted head cover, used to cover the user's bead, has a long cylindrical cap, integrally circular knitted, flexible, and in the shape of a hollow cylinder. The relative two ends of the long cylindrical cap are respectively formed with an upper cap opening and a lower cap opening. At least one eye through-hole is provided, being an opening integrally knitted on one side of the long cylindrical cap. The eye through-hole enables exposure of the user's eyes when wearing the head cover. An interlaced mouth and nose vent is provided in the shape of interval holes, integrally knitted on one side of the long cylindrical cap and located on a position spaced from the eye through-hole. The interlaced mouth and nose vent enables ventilation of the user's mouth and nose when wearing the head cover.
摘要:
When a web page is visited in a browser, the method automatically loads a tool bar so that a user could specify the visited web page to be tracked or one or more regions of the visited web page to be tracked (or excluded). Then, at the specified periods or instants, the method automatically checks to see if the web pages or regions of web pages are updated. If updates are detected, colored and audible notification is provided. A user then can select an updated web page to view and locates the spot(s) where update takes place. The notification of update of a specific web page or region could be provided by the method as a RSS or web service for other third-party applications.
摘要:
A stacked package structure of an image sensor used for electrically connecting to a printed circuit board includes a substrate, an image sensing chip, an integrated circuit, and a transparent layer. The substrate has a first surface and a second surface. The first surface is formed with signal input terminals. The second surface is formed with signal input terminals and signal output terminals for electrically connecting to the printed circuit board. The image sensing chip is mounted on the first surface of the substrate and is electrically to the signal input terminals of the substrate. The integrated circuit is arranged on the second surface of the substrate and is electrically connected to the signal input terminals of the substrate. The transparent layer covers over the image sensing chip, which can receive the image signals via the transparent layer and convert the image signals into electrical signals that are to be transmitted to the substrate. Thus, the image sensing chip of the image sensing product and integrated circuit can be integrally packaged.