公开(公告)号：US20130164647A1

公开(公告)日：2013-06-27

申请号：US13821798

申请日：2011-09-05

申请人： Tomoyoshi Kobayashi

发明人： Tomoyoshi Kobayashi

IPC分类号： H01M8/04 ,  F01D25/00

CPC分类号： H01M8/04089 ,  F04D13/0606 ,  F04D25/0606 ,  H01M8/04029 ,  H01M8/04365 ,  H01M8/04619 ,  H01M8/04768 ,  H01M8/04783 ,  H01M8/0494 ,  H01M8/04947 ,  H01M16/006 ,  H02K1/22 ,  H02K2213/03 ,  Y10T29/49

摘要： A fuel cell system includes a fuel gas supply/discharge mechanism, an oxidative gas supply/discharge mechanism, and a coolant circulation mechanism that cools a fuel cell. A motor employed in an air compressor of the fuel gas supply/discharge mechanism includes a generally circular cylindrical rotor. The axial length of the rotor is related to its diameter such that the ratio is approximately equal to a maximum value satisfying a relationship: Ta≦Tm, where Ta denotes a permissible torque of the motor, and that Tm denotes a maximum torque for which a request is to be made to the motor.

摘要翻译： 燃料电池系统包括燃料气体供给/排出机构，氧化气体供给/排出机构以及冷却燃料电池的冷却剂循环机构。 用于燃料气体供给/排出机构的空气压缩机的电动机包括大致圆形的圆柱形转子。 转子的轴向长度与其直径相关，使得该比率近似等于满足以下关系的最大值：Ta @ Tm，其中Ta表示电动机的允许转矩，Tm表示最大转矩， 要求电机。

公开(公告)号：US20150230362A1

公开(公告)日：2015-08-13

申请号：US14621850

申请日：2015-02-13

申请人： Tomoyoshi Kobayashi

发明人： Tomoyoshi Kobayashi

IPC分类号： H05K7/20 ,  H05K3/30

CPC分类号： H05K7/2039 ,  H05K3/301 ,  H05K7/2049 ,  H05K7/20509 ,  Y10T29/4913

摘要： An electronic component fixing structure includes: a mount; an electronic component mounted on the mount; and a fixing member which is formed of an elastic body and which fixes the electronic component to the mount. The mount includes: a mounting region on which the electronic component is mounted; an engaging surface which engages with the fixing member on a side opposite to a side on which the mounting region is positioned; and a wall which faces the mounting region and which is provided closer to an end surface of the mount than the mounting region. The fixing member includes: a pressing portion which presses the electronic component toward the mounting region; an engaging portion which engages with the engaging surface against a reactive force by the pressing portion; and a connection portion which is brought into contact with the wall between the pressing portion and the engaging portion.

摘要翻译： 电子部件固定结构包括：安装件; 安装在安装座上的电子部件; 以及由弹性体形成并将电子部件固定到安装件的固定部件。 安装座包括：安装电子部件的安装区域; 接合表面，其在与所述安装区域所在的一侧相对的一侧与所述固定构件接合; 以及面向安装区域并且比安装区域更靠近安装座的端面设置的壁。 固定构件包括：将电子部件朝向安装区域按压的按压部; 接合部分，其与接合表面接合抵抗由所述按压部分的反作用力; 以及与按压部和接合部之间的壁接触的连接部。

公开(公告)号：US20080199746A1

公开(公告)日：2008-08-21

申请号：US11579945

申请日：2005-05-26

申请人： Tomoyoshi Kobayashi ,  Norio Yamagishi ,  Takashi Mishima ,  Mumetoshi Kuroyanagi

发明人： Tomoyoshi Kobayashi ,  Norio Yamagishi ,  Takashi Mishima ,  Mumetoshi Kuroyanagi

IPC分类号： H01M8/04

CPC分类号： H01M8/04089 ,  H01M8/04097 ,  H01M8/04201

摘要： An object is to provide a fuel cell system having a simple structure, which is capable of supplying gas appropriately through an ejector in accordance with the load of a fuel cell. The fuel cell system (1) uses an ejector (24) disposed in a gas supply system (4) to combine a new gas to be supplied to the fuel cell (2) with an off-gas discharged from the fuel cell (2) and supply the fuel cell (2) with the resulting combined gas. The ejector (24) includes a nozzle (46) for ejecting the new gas and generating a negative pressure for aspirating the off-gas, and a flow rate control mechanism (47) for controlling the flow rate of the new gas which passes through the nozzle (46). A first flow path (81) for leading the off-gas to the flow rate control mechanism (47) is provided in the gas supply system (4), and the flow rate control mechanism (47) controls the flow rate of the new gas in accordance with the pressure of the off-gas led from the first flow path (81).

摘要翻译： 本发明的目的是提供一种具有简单结构的燃料电池系统，其能够根据燃料电池的负载通过喷射器适当地供应气体。 燃料电池系统（1）使用设置在气体供应系统（4）中的喷射器（24）将要供应到燃料电池（2）的新气体与从燃料电池（2）排出的废气组合， 并向燃料电池（2）供应所得到的组合气体。 喷射器（24）包括用于喷射新气体并产生用于吸出废气的负压的喷嘴（46），以及用于控制通过该气体的新气体的流量的流量控制机构（47） 喷嘴（46）。 在气体供给系统（4）中设置用于将废气引导到流量控制机构（47）的第一流路（81），流量控制机构（47）控制新气体的流量 根据从第一流路（81）引出的废气的压力。

公开(公告)号：US20060071193A1

公开(公告)日：2006-04-06

申请号：US11283683

申请日：2005-11-22

申请人： Tomoyoshi Kobayashi ,  Norio Yamagishi

发明人： Tomoyoshi Kobayashi ,  Norio Yamagishi

IPC分类号： F16K1/00

CPC分类号： H01M8/04089 ,  F16K1/385 ,  Y10S251/90

摘要： A valve in which durability of a sealing member made from an elastic material can be increased and sealing capability can be advantageously maintained over a wide range from a large differential pressure to a low differential pressure. A valve (100), in which a valve disc (1) and a valve seat (2) are brought into close contact via a sealing member (5) composed of an elastic material and provided at the valve disc (1) or valve seat (2), comprises a throttle section (30) defined by the shape of at least one of the valve disc (1) and valve seat (2). The throttle section (30) narrows a flow passage formed between the valve disc (1) and valve seat (2) and is provided near the sealing member (5). The flow passage narrowed by the throttle section (30) is so set that narrowing preferentially proceeds in the flow passage in close proximity to the sealing member (5) during the closing operation of the valve disc (1).

摘要翻译： 可以提高由弹性材料制成的密封构件的耐久性并且可以在从大压差到低压差的宽范围内有利地保持密封能力的阀。 其中阀片（1）和阀座（2）通过由弹性材料构成并设置在阀盘（1）或阀座（1）的密封构件（5）紧密接触的阀门（100） （2）包括由所述阀盘（1）和阀座（2）中的至少一个的形状限定的节流部（30）。 节流部（30）使形成在阀盘（1）与阀座（2）之间的流路变窄，并设置在密封部件（5）附近。 通过节流部（30）变窄的流路被设定为在阀盘（1）的关闭动作期间，密闭部件（5）附近的流路优先进行变窄。

公开(公告)号：US20180310396A1

公开(公告)日：2018-10-25

申请号：US15962207

申请日：2018-04-25

申请人： Ryo Kobayashi ,  Tomoyoshi Kobayashi

发明人： Ryo Kobayashi ,  Tomoyoshi Kobayashi

IPC分类号： H05K1/02 ,  H05K1/18 ,  H05K7/20

CPC分类号： H05K1/0204 ,  H05K1/181 ,  H05K1/184 ,  H05K7/20154 ,  H05K7/20409 ,  H05K7/20445 ,  H05K7/20918 ,  H05K2201/066 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10545 ,  H05K2201/10628

摘要： A circuit board module includes: a first electronic component of a surface mounting type; a second electronic component of an insertion mounting type including a lead terminal; a circuit board; and a heat transfer body provided in the circuit board. The first electronic component is mounted on a front surface of the circuit board so as to overlap the heat transfer body in a board thickness direction. The heat transfer body is provided so as to transfer heat generated in the first electronic component to a back surface side of the circuit board. The second electronic component is mounted on a back surface of the circuit board. The second electronic component and the heat transfer body are thermally connected to a heat radiation body provided on the back surface side of the circuit board.

公开(公告)号：US20130092311A1

公开(公告)日：2013-04-18

申请号：US13574763

申请日：2011-10-18

申请人： Tomoyoshi Kobayashi

发明人： Tomoyoshi Kobayashi

IPC分类号： B32B38/10 ,  B65H81/02 ,  B29C70/86

CPC分类号： B29C35/02 ,  B29C37/0064 ,  B29C70/086 ,  B29C70/32 ,  B29C70/326 ,  B29C70/86 ,  B29K2101/10 ,  B29K2307/04 ,  F17C1/06 ,  F17C2201/0109 ,  F17C2203/0607 ,  F17C2203/0619 ,  F17C2203/0665 ,  F17C2203/067 ,  F17C2205/0397 ,  F17C2209/2154 ,  F17C2209/225 ,  F17C2260/012 ,  F17C2270/0184

摘要： A thermal curing device is used to manufacture a high-pressure gas tank by FW method. In the thermal curing device, a tank vessel configured to have a fiber layer formed on its outer surface by winding carbon fibers impregnated with a thermosetting resin is held to be rotatable about a virtual central axis of the tank vessel. In the thermal curing device, the tank vessel is heated by a heating unit during rotation, so as to thermally cure the thermosetting resin in the fiber layer and thereby form a fiber-reinforced resin layer. A bubble removal process for preventing formation of air bubble in the fiber-reinforced resin layer is performed at multiple different stages during such heating.

摘要翻译： 热固化装置用于通过FW方法制造高压气罐。 在热固化装置中，通过缠绕浸渍有热固性树脂的碳纤维，在其外表面上形成有纤维层的罐容器被保持为能够围绕罐容器的虚拟中心轴线旋转。 在热固化装置中，通过加热单元在转动期间对罐容器进行加热，从而热固化纤维层中的热固性树脂，从而形成纤维增强树脂层。 在这样的加热中，在多个不同的阶段进行用于防止在纤维增强树脂层中形成气泡的气泡去除工艺。

公开(公告)号：US10292306B2

公开(公告)日：2019-05-14

申请号：US15427364

申请日：2017-02-08

申请人： Tomoyoshi Kobayashi ,  Koji Hachiya ,  Eiji Shimoyama

发明人： Tomoyoshi Kobayashi ,  Koji Hachiya ,  Eiji Shimoyama

IPC分类号： F28D15/00 ,  F28F13/12 ,  F28F7/00 ,  H05K7/20 ,  F28F1/02 ,  F28F1/40 ,  F28F3/12 ,  F28F9/02 ,  H01L23/473 ,  F28F9/22 ,  F28D21/00

摘要： A cooler includes: a narrow flow path that has a narrow cross-sectional area; a wide flow path that is connected to a downstream side of the narrow flow path, is in thermal contact with a heating body, and has a wide cross-sectional area; and at least one rectifying piece that is provided in an upstream portion of the wide flow path that is an upstream side from a position being in thermal contact with the heating body. A fluid refrigerant flows through the narrow flow path and the wide flow path, and heat generated by the heating body is radiated. The rectifying piece includes: a single first angle portion that protrudes toward the upstream side; and a first surface and a second surface that join at an acute angle to form the first angle portion.

公开(公告)号：US20160345424A1

公开(公告)日：2016-11-24

申请号：US15159393

申请日：2016-05-19

申请人： Tomoyoshi Kobayashi ,  Masato Kasashima

发明人： Tomoyoshi Kobayashi ,  Masato Kasashima

IPC分类号： H05K1/02 ,  H05K1/18 ,  H05K1/05 ,  H05K1/11

CPC分类号： H05K1/0204 ,  H05K1/0271 ,  H05K3/0061 ,  H05K3/4623 ,  H05K3/4697 ,  H05K2201/0129 ,  H05K2201/0187 ,  H05K2201/09036 ,  H05K2201/09145 ,  H05K2201/09227 ,  H05K2201/09854 ,  H05K2201/10166 ,  H05K2201/10416 ,  H05K2203/063

摘要： A printed board includes: a base member; a recess portion provided in the base member; a heat dissipation member fitted into the recess portion; and a wiring pattern provided on an upper side of the base member and the heat dissipation member via an insulator. A contact portion in which an inner circumferential surface of the recess portion and an outer circumferential surface of the heat dissipation member contact each other and a separation portion in which those do contact each other are formed. A gap between the recess portion and the heat dissipation member is filled with thermosetting resin of the base member melted by heating. At least a partial portion in a width direction of the wiring pattern passes through a position vertically overlapping the separation portion while an entire portion thereof does not pass through a position vertically overlapping the contact portion.

摘要翻译： 印刷电路板包括：基底构件; 设置在所述基座部件中的凹部; 安装在所述凹部中的散热构件; 以及经由绝缘体设置在基座构件的上侧和散热构件上的布线图案。 形成有凹部的内周面和散热构件的外周面彼此接触的接触部以及彼此接触的分离部。 凹部与散热构件之间的间隙填充有通过加热熔化的基底构件的热固性树脂。 布线图案的宽度方向的至少一部分通过与分离部垂直重叠的位置，其整个部分未穿过与接触部分垂直重叠的位置。

公开(公告)号：US09480159B2

公开(公告)日：2016-10-25

申请号：US14520481

申请日：2014-10-22

申请人： Koji Hachiya ,  Tomoyoshi Kobayashi ,  Koichi Nakabayashi

发明人： Koji Hachiya ,  Tomoyoshi Kobayashi ,  Koichi Nakabayashi

IPC分类号： H05K1/16 ,  H05K1/18

CPC分类号： H05K1/165 ,  H05K1/181 ,  H05K2201/0355 ,  H05K2201/0391 ,  H05K2201/086 ,  H05K2201/09063

摘要： A coil-integrated printed circuit board includes: a first outer layer which includes a first outer thick electric conductor made of a thick metallic foil and a first outer thin electric conductor made of a thin metallic foil having a thickness smaller than that of the first outer thick electric conductor, and which is exposed to an outside; and a first inner layer which includes an inner thick electric conductor made of a thick metallic foil, and which is not exposed to the outside. Coil patterns are respectively formed by the first outer thick electric conductor and the inner thick electric conductor. A first electronic component is surface-mounted on the first outer thin electric conductor provided on the outer layer.

摘要翻译： 线圈集成印刷电路板包括：第一外层，其包括由厚金属箔制成的第一外部厚电导体和由薄金属箔制成的第一外部薄导电体，该薄金属箔的厚度小于第一外部厚度 厚电导体，暴露于外部; 以及第一内层，其包括由厚金属箔制成且不暴露于外部的内部厚电导体。 线圈图案分别由第一外部厚电导体和内部厚电导体形成。 第一电子部件被表面安装在设置在外层上的第一外部薄导电导体上。

公开(公告)号：US20160192473A1

公开(公告)日：2016-06-30

申请号：US14980395

申请日：2015-12-28

申请人： Masato Kasashima ,  Tomoyoshi Kobayashi ,  Satoru Sasaki ,  Yoshihiro Ikushima

发明人： Masato Kasashima ,  Tomoyoshi Kobayashi ,  Satoru Sasaki ,  Yoshihiro Ikushima

IPC分类号： H05K1/02 ,  H05K1/11

CPC分类号： H05K1/0204 ,  H05K3/0061 ,  H05K3/4697 ,  H05K2201/10409 ,  H05K2201/10416

摘要： A circuit board includes a first insulating layer having an upper surface on which mounting regions of electronic components and wiring patterns are provided, a metal core provided on the lower surface of the first insulating layer, in such a way as to vertically overlap with the mounting regions, and a second insulating layer provided on the lower surface of the first insulating layer, around the metal core. The lower surface of the metal core is exposed from the second insulating layer, the thermal conductivities of the first insulating layer and the metal core are higher than the thermal conductivity of the second insulating layer, and the hardness of the first insulating layer is higher than the hardness of the second insulating layer. Through holes that penetrate the insulating layers and that connect wiring patterns of the insulating layers are provided.

摘要翻译： 电路板包括具有上表面的第一绝缘层，电子部件和布线图案的安装区域设置在其上，设置在第一绝缘层的下表面上的金属芯，以与安装件垂直重叠的方式 以及设置在第一绝缘层的下表面上的金属芯周围的第二绝缘层。 金属芯的下表面从第二绝缘层露出，第一绝缘层和金属芯的热导率高于第二绝缘层的导热率，第一绝缘层的硬度高于 第二绝缘层的硬度。 提供穿透绝缘层并连接绝缘层的布线图案的通孔。