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公开(公告)号：US09736947B1
公开(公告)日：2017-08-15
申请号：US14572636
申请日：2014-12-16
Applicant: Multek Technologies Ltd.
Inventor： Mark Bergman , Joan K. Vrtis , Michael James Glickman
CPC classification number: H05K3/42 , G01M5/0041 , G01M5/0083 , G06F1/16 , G08B21/182 , G08B23/00 , H05K1/0201 , H05K1/115 , H05K2201/0302 , H05K2203/0338 , H05K2203/0723
Abstract: A process of constructing a filled via of a printed circuit board comprises drilling a via hole through a body of the printed circuit board, desmearing a barrel of the via hole, metallizing a outer surface of the via barrel, electroplating the via barrel, pushing nano-copper solder into the via hole and heating the circuit board in order to melt the nano-copper solder within the via hole. The nano-copper solder improves the thermal conductivity of the printed circuit board for applications when heat needs to be conducted from one side of the printed circuit board to another.
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公开(公告)号：US09661743B1
公开(公告)日：2017-05-23
申请号：US14565247
申请日：2014-12-09
Applicant: Multek Technologies Ltd.
Inventor： Mark Bergman , Joan K. Vrtis
CPC classification number: H01M6/40 , A41D1/002 , A41D1/005 , D05B17/00 , H01M2/08 , H01M6/12 , H01M10/0436 , H01R4/00 , H01R4/02 , H01R4/029 , H01R43/005 , H01R43/02 , H01R43/0235 , H05K1/0271 , H05K1/0296 , H05K1/0298 , H05K1/0306 , H05K1/0366 , H05K1/0373 , H05K1/038 , H05K1/0393 , H05K1/09 , H05K1/11 , H05K1/111 , H05K1/112 , H05K1/115 , H05K1/18 , H05K1/181 , H05K1/189 , H05K3/284 , H05K3/30 , H05K3/305 , H05K3/32 , H05K3/4015 , H05K3/42 , H05K3/4644 , H05K7/02 , H05K9/009 , H05K13/04 , H05K2201/0154 , H05K2201/0158 , H05K2201/0162 , H05K2201/0287 , H05K2201/05 , H05K2201/09418 , H05K2201/09818
Abstract: A flexible circuit board includes a center “rigid” section, such as a printed circuit stack, and an adjoining flexible multi-layer body that are fabricated from a common interconnect layer. A transition material is included at the interface between the center rigid section and the flexible multi-layer body to minimize ripping and cracking of the interconnect layer. The transition material can also be added at stress areas not related to the interface. The transition material is attached at the interface and stress areas of the flexible circuit board in order to strengthen the flexible circuit board in general and in particular the transition material included therein. The transition material layer is formed and deposited at one or more locations on or within the flexible circuit board in order to minimize, reduce, if not prevent cracking and ripping of the flexible circuit board as it is bent, flexed and/or twisted.
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公开(公告)号：US20160278207A1
公开(公告)日：2016-09-22
申请号：US14834180
申请日：2015-08-24
Applicant: Multek Technologies Ltd.
Inventor： Kwan Pen , Pui Yin Yu
CPC classification number: H05K1/115 , H05K1/0216 , H05K1/0298 , H05K1/112 , H05K3/0058 , H05K3/06 , H05K3/181 , H05K3/188 , H05K3/42 , H05K3/422 , H05K3/424 , H05K3/429 , H05K3/4602 , H05K3/4623 , H05K3/4638 , H05K2201/095 , H05K2201/09545 , H05K2201/09554 , H05K2201/10303
Abstract: A selective segment via plating process for manufacturing a circuit board selectively interconnects inner conductive layers as separate segments within the same via. Plating resist is plugged into an inner core through hole and then stripped off after an electroless plating process. Stripping of the electroless plating on the plating resist results in a plating discontinuity on the via wall. In a subsequent electroplating process, the inner core layer can not be plated due to the plating discontinuity. The resulting circuit board structure has separate electrically interconnected segments within the via.
Abstract translation: 用于制造电路板的选择性段通过电镀工艺选择性地将内部导电层互连在相同的通孔内的单独的段。 电镀抗蚀剂插入内芯通孔，然后在化学镀处理后剥离。 在电镀抗蚀剂上剥离化学镀导致通孔壁上的电镀不连续。 在随后的电镀工艺中，由于电镀不连续，内芯层不能镀覆。 所得到的电路板结构在通孔内具有单独的电互连段。
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