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公开(公告)号：US20150068787A1
公开(公告)日：2015-03-12
申请号：US14480250
申请日：2014-09-08
Applicant: INKTEC Co., Ltd.
Inventor： Kwang-Choon Chung , Ji Hoon Yoo , Joonki Seong , Dae Sang Han , Nam-Boo Cho
CPC classification number: H05K3/1258 , H05K1/095 , H05K3/06 , H05K2201/0376 , H05K2201/0382 , H05K2201/09036 , H05K2201/09827 , H05K2203/1173 , Y10T29/49155
Abstract: Provided herein is a conductive pattern making method and conductive pattern, the method including forming a groove such that its width in an inlet area is bigger than its width in an inner area; filling the groove with a conductive ink composition; and drying the conductive ink composition so that a solvent contained in the conductive ink composition inside the groove is volatilized to reduce the volume of the conductive ink composition.
Abstract translation: 这里提供一种导电图案制作方法和导电图案，该方法包括形成一个槽，使得其在入口区域中的宽度大于其在内部区域中的宽度; 用导电油墨组合物填充凹槽; 并干燥导电油墨组合物，使得槽内的导电油墨组合物中所含的溶剂挥发，以减小导电油墨组合物的体积。
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公开(公告)号：US20130156684A1
公开(公告)日：2013-06-20
申请号：US13755101
申请日：2013-01-31
Applicant: Inktec Co., Ltd.
Inventor： Kwang Choon CHUNG , Hyun Nam CHO , Ji Hoon YOO , Kee In SON
IPC: C01G5/00
CPC classification number: C01G5/00 , B82Y30/00 , C01P2004/03 , C01P2004/62 , C01P2004/64
Abstract: A process for preparation of silver oxide with various shape and size using a silver complex compound having a special structure, includes 1) step of preparing a precursor solution including a silver complex compound obtained by reacting a silver compound with one or more mixture selected from the group consisting of an ammonium carbamate-based compound, an ammonium carbonate-based compound or an ammonium bicarbonate-based compound in the presence of a solvent; and 2) step of preparing silver oxide by reacting the precursor solution including the silver complex compound of step 1) with an oxidant. The shape and particle size of the silver oxide prepared according to the preparation process can be changed.
Abstract translation: 使用具有特殊结构的银络合物制备具有各种形状和大小的氧化银的方法包括：1）制备包含银络合物的前体溶液的步骤，所述前体溶液是通过使银化合物与一种或多种选自 在溶剂存在下由氨基甲酸铵类化合物，碳酸铵类化合物或碳酸氢铵类化合物组成的组; 和2）通过使包含步骤1）的络合物的前体溶液与氧化剂反应来制备氧化银的步骤。 根据制备方法制备的氧化银的形状和粒径可以改变。
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公开(公告)号：US09786843B2
公开(公告)日：2017-10-10
申请号：US14107620
申请日：2013-12-16
Applicant: Inktec Co., Ltd.
Inventor： Kwang Choon Chung , Hyun Nam Cho , Ji Hoon Yoo
CPC classification number: H01L51/0004 , C09D11/03 , C09D11/38 , H01L51/0005 , H01L51/0007 , H01L51/0037 , Y02E10/549 , Y02P70/521
Abstract: The invention relates to methods for fabricating an optoelectronic device, including: directly applying a printing ink composition to a patterning process, wherein the printing ink composition includes (1) at least one compound selected from the group of compounds represented by Chemical Formula 1, Chemical Formula 2, Chemical Formula 3, and mixtures thereof as disclosed herein in an amount of 0.01-90 wt % based on the total weight of the composition and (2) at least one material for an optoelectronic device.
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公开(公告)号：US20170127528A1
公开(公告)日：2017-05-04
申请号：US15336221
申请日：2016-10-27
Applicant: INKTEC CO., LTD.
Inventor： Kwang-Choon Chung , Byung Woong Moon
CPC classification number: H05K3/106 , B41F11/00 , H05K1/028 , H05K3/0082 , H05K3/061 , H05K3/064 , H05K3/1275 , H05K2203/0143 , H05K2203/0369 , H05K2203/0557 , H05K2203/056 , H05K2203/107 , H05K2203/1545
Abstract: The present disclosure relates to an apparatus for manufacturing FPCB and method for manufacturing FPCB, having no limitations of length of a circuit pattern being formed on a base film.
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15.发明申请公开(公告)号：US20160234943A1
公开(公告)日：2016-08-11
申请号：US14785281
申请日：2014-04-18
Applicant: INKTEC CO., LTD.
Inventor： Kwang-Choon CHUNG , Ji Hoon Yoo , Joonki SEONG , Dae sang Han
CPC classification number: H05K3/103 , C09D11/52 , H01B1/22 , H05K1/0274 , H05K1/0296 , H05K1/032 , H05K1/09 , H05K3/002 , H05K3/0055 , H05K3/007 , H05K3/12 , H05K2203/06
Abstract: Provided herein is a method for forming a transparent electrode film for display and the transparent electrode film for display, the method comprising forming an electrode pattern by printing a fine electrode pattern on a release film using a conductive ink composition; forming an insulating layer by applying an insulating resin on the release film on which the electrode pattern has been formed; forming a substrate layer by laminating a substrate on the insulating layer; and removing the release film.
Abstract translation: 本发明提供一种形成用于显示的透明电极膜和用于显示的透明电极膜的方法，该方法包括通过使用导电油墨组合物在剥离膜上印刷微细电极图案形成电极图案; 通过在已经形成有电极图案的剥离膜上施加绝缘树脂来形成绝缘层; 通过在绝缘层上层叠衬底来形成衬底层; 并除去脱模膜。
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Patent Agency Ranking
16.发明授权公开(公告)号：US09096737B2
公开(公告)日：2015-08-04
申请号：US14032417
申请日：2013-09-20
Applicant: Inktec Co., Ltd.
Inventor： Myoung Seon Gong , Kwang Choon Chung , Hyun Nam Cho
Abstract: The present invention relates to synthetic resin composition containing nano silver particles, in which a silver complex having a specific structure that allows formation of the nano silver particles is dissolved in monomer for the resin composition and the organic silver complex is decomposed with polymerization to prepare the synthetic resin composition containing the nano silver particles.The present invention can provide a method for resin compositions, which has simple and economic preparation process and allows uniform dispersion of the nano silver particles in the resin composition.
Abstract translation: 本发明涉及含有纳米银颗粒的合成树脂组合物，其中将具有允许形成纳米银颗粒的特定结构的银络合物溶解在用于树脂组合物的单体中，并且有机银络合物通过聚合分解以制备 含有纳米银粒子的合成树脂组合物。 本发明可以提供一种具有简单且经济的制备方法的树脂组合物的方法，并且允许纳米银颗粒均匀分散在树脂组合物中。
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公开(公告)号：US20150000125A1
公开(公告)日：2015-01-01
申请号：US14370644
申请日：2013-01-04
Applicant: INKTEC CO., LTD.
Inventor： Kwang-Choon Chung , Young-Koo Han , Myung-Bong Yoo , Kwang-Baek Yoon , Bong-Ki Jung
IPC: H05K3/10
CPC classification number: H05K3/4069 , H05K3/12 , H05K3/246 , H05K2201/0154 , H05K2203/1383 , Y10T29/49155
Abstract: Provided is a manufacturing method of a double-sided printed circuit board. In the method, a first conductive circuit pattern configuring a circuit is formed on an upper side of an insulation layer, and a second conductive circuit pattern configuring a circuit is formed on a lower side of the insulation layer. A through hole vertically passing through the insulation layer is formed, and a conductive material is formed on an inner circumferential surface of the through hole such that the first circuit pattern and the second circuit pattern are electrically connected by the through hole.
Abstract translation: 提供一种双面印刷电路板的制造方法。 在该方法中，在绝缘层的上侧形成构成电路的第一导电电路图案，在绝缘层的下侧形成构成电路的第二导电电路图案。 形成垂直穿过绝缘层的通孔，并且在通孔的内圆周表面上形成导电材料，使得第一电路图案和第二电路图案通过通孔电连接。
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公开(公告)号：US20140377455A1
公开(公告)日：2014-12-25
申请号：US14481273
申请日：2014-09-09
Applicant: Inktec Co., Ltd.
Inventor： Kwang Choon Chung , Ji Hoon Yoo , Su-Han Kim , Byung Hun Kim
IPC: H05K3/18
CPC classification number: H05K3/1258 , C23C18/165 , C23C18/1868 , C23C18/204 , H05K1/092 , H05K1/097 , H05K3/0026 , H05K3/107 , H05K3/245 , H05K2201/0112 , H05K2201/0376 , H05K2201/09036 , H05K2203/0568 , H05K2203/072 , H05K2203/0723 , H05K2203/1126
Abstract: The present invention relates to a method for fabricating blackened conductive patterns, which includes (i) forming a resist layer on a non-conductive substrate; (ii) forming fine pattern grooves in the resist layer using a laser beam; (iii) forming a mixture layer containing a conductive material and a blackening material in the fine pattern grooves; and (iv) removing the resist layer remained on the non-conductive substrate.
Abstract translation: 本发明涉及一种制造黑化导电图案的方法，其包括（i）在非导电基底上形成抗蚀剂层; （ii）使用激光束在抗蚀剂层中形成精细图案凹槽; （iii）在精细图案槽中形成含有导电材料和变黑材料的混合层; 和（iv）去除残留在非导电基底上的抗蚀剂层。
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公开(公告)号：US20140338192A1
公开(公告)日：2014-11-20
申请号：US14367492
申请日：2012-12-24
Applicant: INKTEC CO., LTD.
Inventor： Kwang-Choon Chung , Nam Boo Cho , Young-Koo Han , Myung Bong Yoo , Woong Ku On
CPC classification number: H05K3/007 , H05K3/0014 , H05K3/0061 , H05K3/207 , H05K2201/0376 , Y10T29/49155
Abstract: Provided is a method for manufacturing a metal printed circuit board, the method including: printing a circuit pattern on a release film; applying a heat conductive insulating layer on the circuit pattern; laminating a heat conductive base layer on the heat conductive insulating layer and hot pressing the laminated heat conductive base layer and the heat conductive insulating layer; and removing the release film therefrom.
Abstract translation: 提供一种金属印刷电路板的制造方法，该方法包括：将印刷电路图案印刷在剥离膜上; 在电路图案上施加导热绝缘层; 在导热绝缘层上层压导热基层，热压叠层导热基层和导热绝缘层; 并从中去除脱模膜。
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公开(公告)号：US08821753B2
公开(公告)日：2014-09-02
申请号：US13741493
申请日：2013-01-15
Applicant: Inktec Co., Ltd.
Inventor： Kwang-Choon Chung , Hyun-Nam Cho , Young-Kwan Seo
Abstract: The present invention provides an etching solution for silver or silver alloy comprising one at least ammonium compound represented by the formula (1), (2) or (3) below and an oxidant:
Abstract translation: 本发明提供一种用于银或银合金的蚀刻溶液，其包含至少一种由下式（1），（2）或（3）表示的铵化合物和氧化剂：
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