Abstract:
A clamp-type probe device comprises a first pressed member, a second pressed member and a probe head. The first pressed member comprises a first clamping portion and a first mounted portion connected to each other, and has a first and a second assembly holes. The second pressed member comprises a second clamping portion and a second mounted portion connected to each other. The second and the first mounted portions are connected to each other. The second and the first clamping portions are separated from each other. The probe head comprises a plurality of contacting members. Each contacting member comprises two bending portions. Two ends of each contacting member are respectively disposed through the first and the second assembly holes. The two bending portions are respectively pressed against an inner side surface of the first assembly hole and an inner side surface of the second assembly hole.
Abstract:
An electrical probe includes a base body and a probe head. The base body has a main body portion and at least one positioning portion, and the positioning portion protrudes from the main body portion. The probe head is detachably disposed on the main body portion of the base body. The probe head has an outer edge away from a side of a central axis of the main body portion, and the positioning portion protrudes from the outer edge.
Abstract:
A measurement fixture for a battery cell is provided when the battery cell is connected to an apparatus. The measurement fixture comprises a chamber, a pressure sensor and an expansion sensor. The chamber defines a sealed space for receiving the battery cell. The pressure sensor is mounted to the chamber to sense a change of pressure in the sealed space due to a volume change of the battery cell to calculate pressure in the battery cell and the volume change of the battery cell non-contactly. The expansion sensor is mounted to the chamber to sense a deformation of the battery cell to calculate a correlation between the pressure in the battery cell and the volume change of the battery cell non-contactly.
Abstract:
An apparatus for testing a package-on-package semiconductor device comprises a pick and place device for loading a first chip into or unloading the first chip from a test socket and a lifting and rotating arm for moving a chip placement module which receives a second chip to a position between the pick and place device and the test socket. The pick and place device and the chip placement module are lowered, and then a test process is performed. After the test process is completed, the pick and place device and the chip placement module are lifted, and the lifting and rotating arm moves the chip placement module to one side of the pick and place device. Accordingly, a method for testing the semiconductor device could be performed automatically so as to greatly enhance test efficiency and accuracy and to significantly reduce costs.
Abstract:
A test apparatus includes a test site, a buffer carrying device, a transport carrying device, a handling mechanism and a dry air flow guide mechanism. The test site performs a test procedure on the objects. The buffer carrying device is disposed close to a side of the test site, holds the objects and performs a temperature conditioning process. The transport carrying device is disposed close to another side of the test site, moves back and forth along a transporting direction, transports the objects into and out of the test site, and heats up the objects. The handling mechanism carries the objects among the buffer carrying device, the test site and the transport carrying device. The dry air flow guide mechanism guides a dry air to surround the test site, the buffer carrying device, the transport carrying device and the handling mechanism and generates a dry environment to prevent dew condensation.
Abstract:
An automatic test system and method are provided. The automatic test system includes at least one formation apparatus and a test fixture. The formation apparatus receives a first control command from a network and executes a test procedure according to the first control command. The test procedure includes a charging mode and a discharging mode. The test fixture is selectively coupled to the formation apparatus. During the test procedure, when the test fixture is coupled to the formation apparatus, the test fixture generates a first measurement result. The test fixture transmits the first measurement result to the formation apparatus via a wireless communication interface of the test fixture.
Abstract:
A temperature control module for a socket is provided with of an upper docking plate and a lower docking plate. The upper docking plate has a recess for accommodating a socket and two temperature-controlling fluid passages. One end of the passages communicates with the recess, and the other end thereof is connected to a temperature-controlling fluid source. The lower docking plate is disposed under the upper docking plate and covers the recess. A fluid chamber is formed of the recess of the docking plate, the lower docking plate and the socket. The temperature-controlling fluid source outputs a temperature-controlling fluid to the fluid chamber via the temperature-controlling fluid passages for maintaining the socket at a specific temperature.
Abstract:
A calibration board and a timing calibration method thereof are provided. The calibration board for calibrating signal delays of test channels in an automatic test equipment is pluggably disposed in the automatic test equipment and includes calibration groups, a first common node, and a switching module. Each calibration group includes a second common node and conductive pads electrically connecting to the second common node. Each conductive pad selectively and electrically connects to one test channel. The switching module electrically connects to the first common node and each second common node. When a first delay calibration procedure is performed, the connection between the first common node and each second common node is disabled. When a second delay calibration procedure is performed, the connection between the first common node and each second common node is built.
Abstract:
A solar cell testing system includes a multifunctional testing light source, a measuring unit, and an arithmetic unit. The multifunctional testing light source is configured to be switched to output a simulated solar light to a solar cell or asynchronously output a plurality of narrowband lights to the solar cell. The measuring unit is coupled to the solar cell and measures the solar cell's response to the simulated solar light and response to the asynchronously outputted narrowband lights. The arithmetic unit is coupled to the multifunctional testing light source and the measuring unit; it determines the solar cell's conversion efficiency and spectral response based on the solar cell's response to the simulated solar light and response to the asynchronously outputted narrowband lights.
Abstract:
A light-emitting module and a driving method thereof are disclosed. In this method, P light-emitting units are selected as a target group, wherein each of the P light-emitting units has N different power parameters corresponding to N sub-bands. P evaluated current values corresponding to the P light-emitting units are computed according to a target spectrum and the N×P power parameters corresponding to the P light-emitting unit in the target group. An emission-spectrum error is computed according to the target spectrum, the N×P power parameters, and the P evaluated current values. It is determined whether the emission-spectrum error conforms with the determining criteria. When the emission-spectrum error conforms with determining criteria, the P evaluated current values are set to be P driving current values corresponding to the P light-emitting units.