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公开(公告)号:US10536836B2
公开(公告)日:2020-01-14
申请号:US15994607
申请日:2018-05-31
Applicant: STMicroelectronics (Rousset) SAS , STMICROELECTRONICS GMBH
Inventor: Thierry Meziache , Pierre Rizzo , Alexandre Charles , Juergen Boehler
Abstract: A device, including a main element (ME) and a set of at least two auxiliary elements (SEi), said main element including a master SWP interface (MINT), each auxiliary element including a slave SWP interface (SLINTi) connected to said master SWP interface of said NFC element through a controllably switchable SWP link (LK) and management means (PRM, CTLM, AMGi) configured to control said SWP link switching for selectively activating at once only one slave SWP interface on said SWP link.
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公开(公告)号:US10530374B2
公开(公告)日:2020-01-07
申请号:US16289225
申请日:2019-02-28
Applicant: STMicroelectronics (Rousset) SAS
Inventor: Bruno Gailhard
Abstract: A method can be used for managing the operation of a phase-locked loop. The loop includes an oscillator voltage controlled by a control signal and a phase comparator receiving a reference signal and a feedback signal which arises from the output signal of the oscillator. The method includes a detection of a possible absence of transitions on the feedback signal for a first duration and, in response to such an absence, a forcing of the lowering of the voltage of the control signal at least until a reappearance of transitions on the feedback signal.
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公开(公告)号:US10510503B2
公开(公告)日:2019-12-17
申请号:US14985083
申请日:2015-12-30
Applicant: STMicroelectronics (Rousset) SAS
Inventor: Christian Rivero , Pascal Fornara , Antonio di-Giacomo , Brice Arrazat
IPC: H01H59/00 , H01L27/06 , H01L21/822 , H01H1/00 , B81C1/00 , H01H57/00 , H01L23/522
Abstract: Methods of forming and operating a switching device are provided. The switching device is formed in an interconnect, the interconnect including a plurality of metallization levels, and has an assembly that includes a beam held by a structure. The beam and structure are located within the same metallization level. Locations of fixing of the structure on the beam are arranged so as to define for the beam a pivot point situated between these fixing locations. The structure is substantially symmetric with respect to the beam and to a plane perpendicular to the beam in the absence of a potential difference. The beam is able to pivot in a first direction in the presence of a first potential difference applied between a first part of the structure and to pivot in a second direction in the presence of a second potential difference applied between a second part of the structure.
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公开(公告)号:US20190341446A1
公开(公告)日:2019-11-07
申请号:US16400286
申请日:2019-05-01
Applicant: STMicroelectronics (Rousset) SAS
Inventor: Abderrezak MARZAKI
IPC: H01L49/02 , H01L27/11517 , H01L29/06
Abstract: A capacitive element of an integrated circuit includes first and second electrodes. The first electrode is formed by a first electrically conductive layer located above a semiconductor well doped with a first conductivity type. The second electrode is formed by a second electrically conductive layer located above the first electrically conductive layer of the semiconductor well. The second electrode is further formed by a doped surface region within the semiconductor well that is heavily doped with a second conductivity type opposite the first conductivity type, wherein the doped surface region is located under the first electrically conductive layer. An inter-electrode dielectric area electrically separates the first electrode and the second electrode.
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公开(公告)号:US10447345B2
公开(公告)日:2019-10-15
申请号:US16217874
申请日:2018-12-12
Applicant: STMicroelectronics (Rousset) SAS
Inventor: Nathalie Vallespin
IPC: H04B5/00 , G06K7/10 , G06K19/07 , H04L12/933
Abstract: An embodiment near-field communication (NFC) router, includes a first switch coupled between a first terminal of the NFC router and a second terminal of the NFC router; and a rectifier bridge having an output terminal coupled to a control terminal of the first switch, the rectifier bridge being configured to rectify a signal detected by an antenna external to the NFC router.
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公开(公告)号:US10446235B2
公开(公告)日:2019-10-15
申请号:US15984779
申请日:2018-05-21
Applicant: STMicroelectronics (Rousset) SAS
Inventor: François Tailliet
IPC: G11C16/04 , G11C16/10 , G11C16/14 , H01L27/11521 , H01L27/11526 , H01L29/788
Abstract: A method can be used for writing in a memory location of the electrically-erasable and programmable memory type. The memory location includes a first memory cell with a first transistor having a first gate dielectric underlying a first floating gate and a second memory cell with a second transistor having a second gate dielectric underlying a second floating gate that is connected to the first floating gate. In a first writing phase, an identical tunnel effect is implemented through the first gate dielectric and the second gate dielectric. In a second writing phase, a voltage across the first gate dielectric but not the second gate dielectric is increased.
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公开(公告)号:US10418322B2
公开(公告)日:2019-09-17
申请号:US14956903
申请日:2015-12-02
Applicant: STMICROELECTRONICS (ROUSSET) SAS
Inventor: Guilhem Bouton , Patrick Regnier
IPC: H01L23/528 , H01L21/768 , H01L21/033 , H01L23/522 , H01L21/311 , G03F1/50 , H01L23/00 , G03F1/38
Abstract: A method for making a photolithography mask for formation of electrically conducting contact pads between tracks of a metallization level and electrically active zones of integrated circuits formed on a semiconductor wafer includes forming a first mask region including first opening zones intended for the formation of the contact pads. The first opening zone has a first degree of opening that is below a threshold. A second mask region including additional opening zones is formed, with the overall degree of opening of the mask being greater than or equal to the threshold.
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公开(公告)号:US10403730B2
公开(公告)日:2019-09-03
申请号:US15914846
申请日:2018-03-07
Applicant: STMicroelectronics (Rousset) SAS
Inventor: Francesco La Rosa , Stephan Niel , Arnaud Regnier , Julien Delalleau
IPC: H01L29/788 , H01L29/423 , H01L21/28 , H01L29/66 , H01L27/11521 , G11C16/14 , H01L21/3205 , H01L21/3213 , H01L27/11524 , H01L29/78 , G11C16/04 , H01L21/306
Abstract: The present disclosure relates to a memory cell comprising a vertical selection gate extending in a trench made in a substrate, a floating gate extending above the substrate, and a horizontal control gate extending above the floating gate, wherein the floating gate also extends above a portion of the vertical selection gate over a non-zero overlap distance. Application mainly to the production of a split gate memory cell programmable by hot-electron injection.
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公开(公告)号:US20190267922A1
公开(公告)日:2019-08-29
申请号:US16281604
申请日:2019-02-21
Inventor: Gwenael MAILLET , Jean-Louis LABYRE , Gilles BAS
IPC: H02P7/29 , G06K19/07 , G05B19/042
Abstract: Control over the operation of an electrically-controlled motor is supported by an interface circuit between the electrically-controlled motor and a near-field radio frequency communication controller. The interface circuit includes a first circuit that receives at least one control set point through a near-field radio frequency communication issued by the near-field radio frequency communication controller. A second circuit of the interface generates one or more electric signals in pulse width modulation based on the control set point.
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公开(公告)号:US20190237589A1
公开(公告)日:2019-08-01
申请号:US16259424
申请日:2019-01-28
Applicant: STMicroelectronics (Rousset) SAS
Inventor: Abderrezak MARZAKI
CPC classification number: H01L29/945 , H01L27/0629 , H01L27/0733 , H01L29/66181
Abstract: A standard integrated cell includes a semiconductor region with a functional domain for logic circuits including a transistor and an adjacent continuity domain that extends out to an edge of the standard integrated cell. The edge is configured to be adjacent to another continuity domain of another standard integrated cell. The standard integrated cell further includes at capacitive element. This capacitive element may be housed in the continuity domain, for example at or near the edge. Alternatively, the capacitive element may be housed at a location which extends around a substrate region of the transistor.
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