公开(公告)号：US09250292B2

公开(公告)日：2016-02-02

申请号：US13854372

申请日：2013-04-01

Applicant: CHROMA ATE INC.

Inventor： Chien-Ming Chen

IPC: G01R31/28

CPC classification number: G01R31/2896 ,  G01R31/2887

Abstract: A testing system for testing semiconductor package stacking chips is disclosed. The system includes a testing socket, a testing arm, and a testing mechanism. The testing mechanism includes a probe testing device. The probe testing device has a testing chip inside and a plurality of testing probes electrically connected to the testing chip. The plurality of testing probes extends toward the testing socket for contacting a chip-under-test loaded on the testing socket. When the testing mechanism moves to an upper position between the testing socket and the testing arm, the testing arm moves downward in the vertical direction and presses down the testing mechanism thereby coercing the plurality of testing probes in the testing mechanism to closely abut against the chip-under-test, so that the testing chip inside the testing mechanism can electrically connect to the chip-under-test for forming a test loop.

Abstract translation: 公开了一种用于测试半导体封装堆叠芯片的测试系统。 该系统包括测试插座，测试臂和测试机构。 测试机构包括探针测试装置。 探针测试装置内部具有测试芯片，并且多个测试探针电连接到测试芯片。 多个测试探针延伸到测试插座，用于接触加载在测试插座上的芯片下测试。 当测试机构移动到测试插座和测试臂之间的上部位置时，测试臂沿垂直方向向下移动并按压测试机构，从而迫使测试机构中的多个测试探针紧紧靠在芯片上 - 测试，使测试机构内的测试芯片可以电连接到芯片下测试以形成测试回路。

公开(公告)号：US20150066414A1

公开(公告)日：2015-03-05

申请号：US14261427

申请日：2014-04-25

Applicant: CHROMA ATE INC.

Inventor： Chin-Yi Ouyang ,  Liang-Yu Hsu

IPC: G01R31/28

CPC classification number: G01R31/2894 ,  G01R31/287

Abstract: An automatic retest method for a system-level IC test equipment and the IC test equipment is disclosed, wherein the IC test equipment includes multiple testing units, a loading/unloading unit, and a processing unit; each testing unit is capable of testing an IC individually and has a pass rate. When the testing unit finishes a test operation, it will send test report of the IC to the processing unit. The processing unit will determine whether the IC has reached a pass threshold of the testing unit. The processing unit will issue a command, according to a predetermined rule, to transfer the IC that failed to reach the pass threshold to one of the testing units conforming to the predetermined rule to conduct a retest operation. Finally, the processing unit will confirm whether the IC that failed to reach the pass threshold has reached the pass threshold in the retest operation.

Abstract translation: 公开了一种用于系统级IC测试设备和IC测试设备的自动再测试方法，其中IC测试设备包括多个测试单元，加载/卸载单元和处理单元; 每个测试单元都能够单独测试IC并具有合格率。 当测试单元完成测试操作时，它将向处理单元发送IC的测试报告。 处理单元将确定IC是否已达到测试单元的通过阈值。 处理单元将根据预定规则发出命令，将未达到通过阈值的IC传送到符合预定规则的测试单元之一，以进行重新测试操作。 最后，处理单元将确认在重新测试操作中未达到通过阈值的IC是否达到通过阈值。

公开(公告)号：US20140182397A1

公开(公告)日：2014-07-03

申请号：US14108176

申请日：2013-12-16

Applicant: CHROMA ATE INC.

Inventor： Xin-Yi WU ,  Hsuan-Jen SHEN ,  Chien-Ming CHEN ,  Chin-Yi OU YANG

IPC: G01R31/28 ,  G01N1/42

CPC classification number: G01R31/2877 ,  G01N1/42 ,  G01R31/2865

Abstract: A test apparatus includes a test site, a buffer carrying device, a transport carrying device, a handling mechanism and a dry air flow guide mechanism. The test site performs a test procedure on the objects. The buffer carrying device is disposed close to a side of the test site, holds the objects and performs a temperature conditioning process. The transport carrying device is disposed close to another side of the test site, moves back and forth along a transporting direction, transports the objects into and out of the test site, and heats up the objects. The handling mechanism carries the objects among the buffer carrying device, the test site and the transport carrying device. The dry air flow guide mechanism guides a dry air to surround the test site, the buffer carrying device, the transport carrying device and the handling mechanism and generates a dry environment to prevent dew condensation.

Abstract translation: 试验装置包括试验部位，缓冲载体装置，输送装置，搬运机构以及干燥空气引导机构。 测试站点对对象执行测试程序。 缓冲载体装置靠近试验部位的一侧设置，保持物体并进行温度调节处理。 运送装置靠近试验场的另一侧，沿运送方向前后移动，运送物体进出试验场地，并加热物体。 处理机构携带缓冲运送装置，试验部位和运送装置中的物体。 干燥空气流动引导机构引导干燥空气围绕测试场所，缓冲装置，输送装置和处理机构，并产生干燥环境以防止结露。

公开(公告)号：US20130271640A1

公开(公告)日：2013-10-17

申请号：US13803553

申请日：2013-03-14

Applicant: CHROMA ATE, INC.

Inventor： CHENG YUEH-HUNG ,  CHENG Hsu-Ting

IPC: H04N5/225

CPC classification number: H04N5/225 ,  H04N9/097

Abstract: An image capturing device includes a cube prism and three image capturing units. The cube prism includes an incident surface, a first exiting surface, a second exiting surface, and a third exiting surface orthogonal to each other, and further includes a first splitting surface, a second splitting surface, a third splitting surface, and a forth splitting surface orthogonal to each other. The light incident into the incident surface is split by the four splitting surfaces into monochromatic lights, and the monochromatic lights respectively exit from the three exiting surfaces to be received by the image capturing units to form images. The images can be combined as a multicolored image. Accordingly, the light-use efficiency and the image resolution can be improved, and the color fault of the image can be avoided.

Abstract translation: 图像捕获装置包括立体棱镜和三个图像捕获单元。 立方棱镜包括彼此正交的入射表面，第一出射表面，第二出射表面和第三出射表面，并且还包括第一分离表面，第二分裂表面，第三分裂表面和第四分离表面 表面彼此正交。 入射到入射表面的光被四个分离表面分成单色光，并且单色光分别从三个离开的表面退出以被图像捕获单元接收以形成图像。 图像可以组合成多色图像。 因此，可以提高光利用效率和图像分辨率，并且可以避免图像的颜色错误。

公开(公告)号：US12196806B2

公开(公告)日：2025-01-14

申请号：US18054197

申请日：2022-11-10

Applicant: CHROMA ATE INC.

Inventor： I-Shih Tseng ,  Xin-Yi Wu ,  Chin-Yi Ouyang

IPC: G01R31/28 ,  G01R1/44 ,  G01R35/00

Abstract: The present invention relates to an aging test system and an aging test method for a thermal interface material and an electronic device testing apparatus having the system, wherein a controller controls a movable carrier to move to a high temperature generating device so that the thermal interface material on the movable carrier is brought into contact with the high temperature generating device; the controller further controls a temperature sensor to detect the temperature of the thermal interface material; the controller compares an output temperature datum of the high temperature generating device with a temperature measurement datum detected by the temperature sensor. Accordingly, the thermal conductivity of the thermal interface material can be obtained for immediately determining the quality and the performance degradation of the thermal interface material, which can be used as a reference for selection or replacement of the thermal interface material.

公开(公告)号：US20240426656A1

公开(公告)日：2024-12-26

申请号：US18659429

申请日：2024-05-09

Applicant: CHROMA ATE INC.

Inventor： Hong-Yau Mong ,  Tsung-Hsien Ou ,  Yu-Shuan Lin ,  Shih-Yao Pan ,  Shih-Min Hsu

IPC: G01J1/44 ,  G01J1/42 ,  G01J3/50 ,  G09G3/00 ,  H04N23/67

Abstract: An automated optical measurement system and method for a near eye display are provided. A controller first controls the near eye display to display a specific pattern, then controls a displacement generation module to drive an image sensing module toward or away from an imaging module, and controls the image sensing module to capture the specific pattern to obtain focus images; and the controller performs focusing according to the focus images. Finally, the controller measures an optical characteristic of the near eye display. Accordingly, the focusing method used is to capture the specific pattern displayed by the near eye display while moving the image sensing module, and perform automatic focusing by comparing the capture results.

公开(公告)号：US12142868B2

公开(公告)日：2024-11-12

申请号：US17548655

申请日：2021-12-13

Applicant: CHROMA ATE INC.

Inventor： Hui-Jung Wu ,  Tsung-I Lin ,  Shou-Sheng Hsu

IPC: H01R13/24 ,  G01R1/04 ,  H05K7/10

Abstract: The present invention relates to a chip-fixing device for a socket, which comprises a fixing base body and a movable stop. The socket is assembled in a socket-accommodating recess of the fixing base body. The movable stop is assembled in the fixing base body and controlled in such a manner that a stopper is moved between a first position and a second position, wherein the first position refers to a position where the stopper is located right above the socket, and the second position refers to a position where the stopper is not located right above the socket. Accordingly, the socket-accommodating recess can be used to install sockets of different sizes, and the movable stop can drive the stopper to restrict a chip from falling off the socket or drive the stopper to release the chip, depending on presence or absence of an external force.

公开(公告)号：US20240237824A1

公开(公告)日：2024-07-18

申请号：US18414549

申请日：2024-01-17

Applicant: Chroma ATE INC.

Inventor： SHENG-CHING CHUANG ,  Tung-Hsing Wu

IPC: A47B97/00 ,  B60B33/00

CPC classification number: A47B97/00 ,  B60B33/0002 ,  A47B2097/008

Abstract: An anti-overturning device for cabinet and its cabinet structure is disclosed in the present invention. The anti-overturning device comprises a first fixing member, a second fixing component and a connecting part. The first fixing component is used for arranging detachably on the outside of the cabinet bottom. The second fixing component includes at least a second opening, and the second opening is used for fixing on the auxiliary wheel or on the ground. The anti-overturning devices are provided evenly on the periphery of the cabinet bottom. The anti-overturning devices change the horizontal position of the original overturning pivot of the cabinet and enlarge the overturning angle to prevent from overturning the cabinet.

公开(公告)号：US20240219447A1

公开(公告)日：2024-07-04

申请号：US18129907

申请日：2023-04-03

Applicant: CHROMA ATE INC.

Inventor： WEI-CHIH CHEN ,  SHEN-HAO TSAI ,  YI-YEN LIN

IPC: G01R31/26 ,  G01R1/067

CPC classification number: G01R31/2601 ,  G01R1/06716 ,  G01R1/06761

Abstract: A wafer inspection system includes a carrier device, a probe card, a first metal kit and a surround separating unit. The probe card includes a detection portion and a conductive layer surrounding the detection portion and configured at a bottom surface of the probe card. The first metal kit is configured at a bottom portion of the probe card and coupled to the conductive layer and includes a first window and a first ring piece extending from a periphery of the first window. The first window is for the detection portion to extend out. The surround separating unit is configured as an electrically conductive wraparound unit surrounding and laterally enclosing the detection portion and a wafer to be inspected when the probe card performs a probe procedure on the wafer to be inspected. Thus, a probe procedure of the detection portion and the wafer to be inspected can be performed in an environment shielded from external noise or interference sources, thereby improving inspection accuracy.

公开(公告)号：US20240192268A1

公开(公告)日：2024-06-13

申请号：US18511638

申请日：2023-11-16

Applicant: CHROMA ATE INC.

Inventor： Yu-Wei Chuang ,  Xin-Yi Wu ,  Jui-Che Chou

IPC: G01R31/28 ,  G05D23/20 ,  H01L21/66

CPC classification number: G01R31/2874 ,  G01R31/2863 ,  G05D23/20 ,  H01L22/12

Abstract: A multiphase thermal interface component, a method of forming the same, and an electronic device testing apparatus provided with the same are provided. The multiphase thermal interface component includes a thermal interface solid element and a thermal interface fluid material. The thermal conductive surface of the thermal interface solid element has an accommodation space, and the thermal interface fluid material is accommodated in the accommodation space. Therefore, the multiphase thermal interface component combines solid-phase and fluid-phase thermal interface materials. Since fluids have the properties of changing shape, flowing, and splitting arbitrarily, the thermal interface fluid material can completely fill up the air gaps between the thermal interface solid element and the thermal control device/the temperature-controlled component, so that the full surface temperature control of the contact interface can be achieved, thereby effectively improving the thermal conduction performance.