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公开(公告)号:US20190258451A1
公开(公告)日:2019-08-22
申请号:US16278258
申请日:2019-02-18
Applicant: DSP Group Ltd.
Inventor: Michael Gollnick
Abstract: A method for managing audio level within a space the method may include sensing audio signals from multiple location within the space; calculating an audio parameter associated with a person located in the space; calculating a heat map that comprises areas of different voice levels; selecting, for the person, a selected area out of the areas; wherein the selecting is based on (a) the audio parameter associated with the person, and (b) the different voice levels of the areas; and generating at least one out of an audio signal and a video signal that induces the person to move to the selected area.
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公开(公告)号:US20190215608A1
公开(公告)日:2019-07-11
申请号:US16233086
申请日:2018-12-27
Applicant: Onkyo Corporation , DSP Group Ltd.
Inventor: Yoshitada TAKESHIMA , Dmitri LVOV , Yaakov CHEN
Abstract: Provided is a wearable audio input/output device. The wearable audio input/output device is provided with a frame, a first audio collection unit, a second audio collection unit, and a first speaker. The frame can be mounted to a user. The first audio collection unit is provided on the frame. The second audio collection unit is provided on the frame. The second audio collection unit is arranged such that the distance between the first audio collection unit and mouth of the user is less than the distance between the second audio collection unit and the mouth of the user. The first speaker is provided on the frame between the first audio collection unit and the second audio collection unit.
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公开(公告)号:US10034098B2
公开(公告)日:2018-07-24
申请号:US15244058
申请日:2016-08-23
Applicant: DSP GROUP LTD.
Inventor: Haim Kupershmidt , Lior Blanka
Abstract: A MEMS speaker that includes a control unit and multiple MEMS elements that include a membrane positioned in a first plane, a blind that is positioned in a second plane and a shutter that is positioned in a third plane. The control unit is configured to control the multiple MEMS elements to operate in an audio output mode or an ultrasonic output mode. The MEMS speaker is configured, when operating in the ultrasonic output mode, to oscillate at least one of the membrane, blind and shutter thereby generating an ultrasonic signal without audio-modulating the ultrasonic signal. The MEMS speaker is configured, when operating in the audio output mode, to oscillate the membrane thereby generating the ultrasonic signal and oscillate at least one of the shutter and the blind thereby modulating the ultrasonic acoustic signal to generate an audio signal.
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公开(公告)号:US09867012B2
公开(公告)日:2018-01-09
申请号:US15170974
申请日:2016-06-02
Applicant: DSP Group LTD.
Inventor: Yaakov Chen , Doron Koren
Abstract: A method for detecting whispered speech of a user of a mobile computerized device, the method comprises: detecting, by the mobile computerized device, whispered speech context; and attempting to detect, by the mobile computerized device and by using whispered speech detection parameters, the whispered speech; and wherein at least one whispered speech detection parameter of the whispered speech detection parameters differs from at least one corresponding non-whispered speech parameter that is used for detecting non-whispered speech.
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公开(公告)号:US09866178B2
公开(公告)日:2018-01-09
申请号:US15268597
申请日:2016-09-18
Applicant: DSP Group LTD.
Inventor: Sergey Anderson
IPC: H03F3/191 , H03F1/26 , H01L23/66 , H04L27/00 , H04B1/40 , H03F3/213 , H03F3/195 , H03F3/21 , B82Y10/00 , B82Y40/00 , H03F1/02 , H03F3/24
CPC classification number: H03F1/26 , B82Y10/00 , B82Y40/00 , H01L23/66 , H01L2223/6611 , H01L2223/6672 , H01L2224/48091 , H01L2224/49175 , H03F1/0216 , H03F1/0227 , H03F1/0238 , H03F3/195 , H03F3/211 , H03F3/213 , H03F3/245 , H03F2200/294 , H03F2200/451 , H03F2200/504 , H03F2203/21106 , H04B1/40 , H04L27/0002 , H01L2924/00014
Abstract: An integrated circuit that includes a die with an active radio frequency (RF) unit embedded thereon; a first port for receiving an output signal from the active RF unit; a harmonic filter that comprises a first harmonic filter inductor; and a first RF inductive load that is electrically coupled to the first port and is magnetically coupled to the first harmonic filter inductor.
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公开(公告)号:US09813031B2
公开(公告)日:2017-11-07
申请号:US14952939
申请日:2015-11-26
Applicant: DSP Group LTD.
Inventor: Sergey Anderson , Alexander Mostov , Eli Schwartz , Ron Pongratz
IPC: H01L27/08 , H03F1/56 , H01F38/14 , H03F3/213 , H03F3/195 , H02M3/156 , H02M3/04 , H01F27/28 , H01F27/29 , H01F38/00 , H03F3/19 , H03F3/21 , H03F3/68 , H03F3/193 , H04B1/44 , H01F19/04 , H03F1/02 , H03F3/45 , H01L23/522 , H01L23/64 , H01L23/66 , H02M1/00
CPC classification number: H03F1/565 , H01F19/04 , H01F27/2804 , H01F27/29 , H01F38/00 , H01F38/14 , H01L23/5227 , H01L23/645 , H01L23/66 , H01L2223/6655 , H01L2223/6672 , H01L2924/0002 , H02M3/04 , H02M3/1563 , H02M2001/0012 , H03F1/0227 , H03F1/0261 , H03F3/19 , H03F3/193 , H03F3/195 , H03F3/21 , H03F3/211 , H03F3/213 , H03F3/45179 , H03F3/68 , H03F2200/102 , H03F2200/105 , H03F2200/387 , H03F2200/451 , H03F2200/534 , H03F2200/537 , H03F2200/541 , H04B1/44 , Y02D70/00 , H01L2924/00
Abstract: A novel and useful radio frequency (RF) front end module (FEM) circuit that provides high linearity and power efficiency and meets the requirements of modern wireless communication standards such as 802.11 wireless local area network (WLAN), third generation (3G) and fourth generation (4G) cellular standards, BLUETOOTH™, ZIGBEE™, etc. The configuration of the FEM circuit permits the use of common, relatively low cost semiconductor fabrication techniques such as standard Complementary metal-oxide-semiconductor (CMOS) processes. The FEM circuit includes a power amplifier made up of one or more sub-amplifiers having high and low power circuits and whose outputs are combined to yield the total desired power gain. An integrated multi-tap transformer having primary and secondary windings arranged in a novel configuration provide efficient power combining and transfer to the antenna of the power generated by the individual sub-amplifiers.
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公开(公告)号:US20170104458A1
公开(公告)日:2017-04-13
申请号:US15286616
申请日:2016-10-06
Applicant: DSP Group LTD.
Inventor: Avi Cohen , Ron Pongratz
CPC classification number: H03F1/301 , H03F1/0216 , H03F1/223 , H03F3/193 , H03F3/245 , H03F3/345 , H03F2200/451 , H03F2200/453
Abstract: A biasing device for direct current (DC) biasing a linear power amplifier that comprises multiple linear power amplifier circuits that are ideally identical to each other; wherein the biasing device may include a replica circuit that is a replica of a linear power amplifier circuit of the multiple linear power amplifier circuits; and a bias control circuit; wherein the bias control circuit is configured to feed the replica circuit with one or more DC biasing signals thereby maintaining at a constant value a replica DC current that is consumed by the replica circuit, and maintaining at a fixed value a replica DC voltage of a replica output node of the replica circuit; and wherein the replica circuit is coupled the multiple linear power amplifier circuits and is configured to supply DC voltage bias signals that force each linear power amplifier circuit of the multiple linear power amplifier circuits to consume a linear power amplifier circuit DC current that equals the replica DC current, when the linear power amplifier circuit is fed with a linear power amplifier DC voltage that either equals the replica DC voltage or differs from the replica DC voltage by a fraction of the replica DC voltage.
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公开(公告)号:US20160277845A1
公开(公告)日:2016-09-22
申请号:US15071230
申请日:2016-03-16
Applicant: DSP Group LTD.
Inventor: Haim Kupershmidt , Moti Margalit , Adi Baram
CPC classification number: H04R19/02 , H04R19/005 , H04R31/00 , H04R2201/003 , H04R2217/03
Abstract: A micro-electromechanical system (MEMS) device that comprises a substrate, support structures, functional elements and conductive paths that comprise conductive elements; wherein the functional elements are included in a plurality of functional layers, the plurality of functional layers are spaced apart from each other; wherein the support structures are configured to provide structural support to the plurality of functional layers; wherein each functional layer is coupled to a conducting interface via a conductive path that is associated with the functional layer; and wherein the support structures comprise lateral etch stop elements.
Abstract translation: 一种微机电系统(MEMS)装置,其包括基板,支撑结构,功能元件和包括导电元件的导电路径; 其中所述功能元件包括在多个功能层中,所述多个功能层彼此间隔开; 其中所述支撑结构被配置为向所述多个功能层提供结构支撑; 其中每个功能层经由与所述功能层相关联的导电路径耦合到导电接口; 并且其中所述支撑结构包括横向蚀刻停止元件。
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公开(公告)号:US20160277838A1
公开(公告)日:2016-09-22
申请号:US15072379
申请日:2016-03-17
Applicant: DSP Group LTD.
Inventor: Haim Kupershmidt , Moti Margalit , Adi Baram
IPC: H04R7/16
CPC classification number: H04R31/00 , H04R1/403 , H04R19/005 , H04R19/02
Abstract: A micro-electromechanical system (MEMS) device that may include a substrate, support structures and functional elements; wherein the functional elements are included in a plurality of functional layers, the plurality of functional layers are spaced apart from each other; wherein the support structures are conductive and are configured to provide structural support to the plurality of functional layers; wherein each functional element is electrically coupled to at least one of the support structures; and wherein the support structures are spaced apart from each other.
Abstract translation: 可以包括衬底,支撑结构和功能元件的微机电系统(MEMS)装置; 其中所述功能元件包括在多个功能层中,所述多个功能层彼此间隔开; 其中所述支撑结构是导电的并且被配置成向所述多个功能层提供结构支撑; 其中每个功能元件电耦合到所述支撑结构中的至少一个; 并且其中所述支撑结构彼此间隔开。
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公开(公告)号:US20160149543A1
公开(公告)日:2016-05-26
申请号:US14952939
申请日:2015-11-26
Applicant: DSP Group LTD.
Inventor: Sergey Anderson , Alexander Mostov , Eli Schwartz , Ron Pongratz
CPC classification number: H03F1/565 , H01F19/04 , H01F27/2804 , H01F27/29 , H01F38/00 , H01F38/14 , H01L23/5227 , H01L23/645 , H01L23/66 , H01L2223/6655 , H01L2223/6672 , H01L2924/0002 , H02M3/04 , H02M3/1563 , H02M2001/0012 , H03F1/0227 , H03F1/0261 , H03F3/19 , H03F3/193 , H03F3/195 , H03F3/21 , H03F3/211 , H03F3/213 , H03F3/45179 , H03F3/68 , H03F2200/102 , H03F2200/105 , H03F2200/387 , H03F2200/451 , H03F2200/534 , H03F2200/537 , H03F2200/541 , H04B1/44 , Y02D70/00 , H01L2924/00
Abstract: A novel and useful radio frequency (RF) front end module (FEM) circuit that provides high linearity and power efficiency and meets the requirements of modern wireless communication standards such as 802.11 WLAN, 3G and 4G cellular standards, Bluetooth, ZigBee, etc. The configuration of the FEM circuit permits the use of common, relatively low cost semiconductor fabrication techniques such as standard CMOS processes. The FEM circuit includes a power amplifier made up of one or more sub-amplifiers having high and low power circuits and whose outputs are combined to yield the total desired power gain. An integrated multi-tap transformer having primary and secondary windings arranged in a novel configuration provide efficient power combining and transfer to the antenna of the power generated by the individual sub-amplifiers.
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