公开(公告)号：US20090200263A1

公开(公告)日：2009-08-13

申请号：US11577494

申请日：2005-10-19

Applicant: Merten Piel ,  Brigitte Steder ,  Rolf Piel ,  Elke Piel ,  Lutz Stamp ,  Christiane Moepert

Inventor： Merten Piel ,  Brigitte Steder ,  Rolf Piel ,  Elke Piel ,  Lutz Stamp ,  Christiane Moepert

IPC: C23C18/22 ,  H05K3/00 ,  H05K3/38

CPC classification number: C23C18/22 ,  C23C18/405 ,  H05K1/0269 ,  H05K3/181 ,  H05K3/381 ,  H05K2203/0796 ,  H05K2203/163

Abstract: The invention relates to a control of etching processes of insulating substrates by means of gloss measurement. By this method a surface roughness can be achieved which leads to good adhesion of metals layers deposited in subsequent metallization steps. This method is particularly suited for the production of printed circuit boards.

Abstract translation: 本发明涉及通过光泽测量来控制绝缘衬底的蚀刻工艺。 通过这种方法，可以实现表面粗糙度，这导致在随后的金属化步骤中沉积的金属层的良好粘附。 该方法特别适用于生产印刷电路板。

公开(公告)号：US20090140199A1

公开(公告)日：2009-06-04

申请号：US12277468

申请日：2008-11-25

Applicant: Hiroyuki KAMIYA ,  Katsuyuki TSUGITA

Inventor： Hiroyuki KAMIYA ,  Katsuyuki TSUGITA

IPC: C09K13/00

CPC classification number: C09G1/02 ,  C09K3/1409 ,  C09K3/1463 ,  H01L21/3212 ,  H05K3/045 ,  H05K3/107 ,  H05K2201/0209 ,  H05K2203/025 ,  H05K2203/0796

Abstract: To provide a polishing compound which can satisfy both high removal rate of an object to be polished and excellent property to eliminate the difference in level, and to provide a polishing method which can polish a wiring metal fast while suppressing increase of a wiring metal resistance and is excellent in the property to eliminate the difference in level.A polishing compound which comprises abrasive particles, an oxidizing agent, ammonium ions, polyvalent carboxylate ions, at least one chelating agent selected from the group consisting of pentaethylenehexamine, triethylenetetramine and tetraethylenepentamine, and an aqueous medium. Further, a polishing method of polishing a wiring metal 3 by using the polishing compound, after providing a wiring trench 2 on a resin substrate 1 and embedding the wiring metal 3 in the wiring trench 2.

Abstract translation: 为了提供能够满足被研磨对象物的高去除率和优异性能以消除水平差的抛光化合物，并且提供能够在抑制布线金属电阻增加的同时快速抛光布线金属的抛光方法，以及 在物业上是优秀的，以消除差距的水平。 一种抛光剂，其包含磨粒，氧化剂，铵离子，多价羧酸根离子，选自五亚乙基六胺，三亚乙基四胺和四亚乙基五胺中的至少一种螯合剂和水性介质。 另外，在将树脂基板1上配置布线沟槽2并且将布线金属3嵌入布线槽2中之后，通过使用研磨用化合物研磨布线金属3的研磨方法。

公开(公告)号：US07351353B1

公开(公告)日：2008-04-01

申请号：US09479089

申请日：2000-01-07

Applicant: Roger Bernards ,  Hector Gonzalez ,  Al Kucera ,  Mike Schanhaar

Inventor： Roger Bernards ,  Hector Gonzalez ,  Al Kucera ,  Mike Schanhaar

IPC: C09K13/00

CPC classification number: C23C22/68 ,  C23C22/52 ,  C23C2222/20 ,  C23F1/18 ,  H05K3/383 ,  H05K3/385 ,  H05K3/389 ,  H05K3/4611 ,  H05K2201/0239 ,  H05K2203/0793 ,  H05K2203/0796 ,  H05K2203/124

Abstract: The invention is directed to a method and composition for providing roughened copper surfaces suitable for subsequent multilayer lamination. A smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition consisting essentially of an oxidizer, a pH adjuster, a topography modifier, and a uniformity enhancer. A coating promoter may be used in place of the uniformity enhancer or in addition to the uniformity enhancer. The adhesion promoting composition does not require a surfactant. The process may further comprise the step of contacting the uniform roughened copper surface with a post-dip, wherein the post-dip comprises an azole or silane compound or a combination of said azole and said silane. The post-dip may further comprise, alone or in combination, a titanate, zirconate, and an aluminate. The pH adjuster is preferably sulfuric acid and the oxidizer is preferably hydrogen peroxide. A hydrogen peroxide stabilizer may be used in the adhesion promoting composition.

Abstract translation: 本发明涉及一种用于提供适于随后的多层层压的粗糙化铜表面的方法和组合物。 在有效提供粗糙化铜表面的条件下，光滑的铜表面与增粘组合物接触，该粘附促进组合物基本上由氧化剂，pH调节剂，形貌改性剂和均匀性增强剂组成。 可以使用涂层促进剂来代替均匀性增强剂，或者除了均匀性增强剂之外。 粘合促进组合物不需要表面活性剂。 该方法还可以包括使均匀的粗糙化铜表面与浸渍后接触的步骤，其中后浸渍包括唑或硅烷化合物或所述唑和所述硅烷的组合。 后浸渍可以单独地或组合地包含钛酸盐，锆酸盐和铝酸盐。 pH调节剂优选为硫酸，氧化剂优选为过氧化氢。 在粘合促进组合物中可以使用过氧化氢稳定剂。

公开(公告)号：US20070298170A1

公开(公告)日：2007-12-27

申请号：US11756048

申请日：2007-05-31

Applicant: Walter Kronenberg ,  Jurgen Hupe

Inventor： Walter Kronenberg ,  Jurgen Hupe

IPC: B05D3/10

CPC classification number: C25D5/56 ,  H05K1/0346 ,  H05K3/188 ,  H05K2201/0154 ,  H05K2201/0329 ,  H05K2203/0796

Abstract: The present invention relates to an improved method for the direct metallization of non-conductive substrate surfaces, in particular polyimide surfaces, that is characterized by the process steps of etching the substrate surface with an acidic etching solution that contains peroxide; contacting the etched substrate surface with an acidic treatment solution that contains permanganate; activating the treated substrate surface in an acidic activation solution that contains peroxide; contacting the activated substrate surface with an acidic catalytic solution that contains at least a thiophene derivate and at least a sulfonic acid derivate; metallization of the thus treated substrate surface in an acidic galvanic metallization bath.

Abstract translation: 本发明涉及用于直接金属化非导电衬底表面，特别是聚酰亚胺表面的改进方法，其特征在于用含有过氧化物的酸性蚀刻溶液蚀刻衬底表面的工艺步骤; 使蚀刻的基底表面与含有高锰酸盐的酸性处理溶液接触; 在含有过氧化物的酸性活化溶液中活化经处理的底物表面; 使活化的底物表面与至少含有噻吩衍生物和至少一种磺酸衍生物的酸性催化溶液接触; 这样处理的基底表面在酸性电镀金属浴中的金属化。

公开(公告)号：US20070278182A1

公开(公告)日：2007-12-06

申请号：US11445610

申请日：2006-06-02

Applicant: Robert Jeffrey Durante ,  Harvey James Bohn

Inventor： Robert Jeffrey Durante ,  Harvey James Bohn

IPC: B44C1/22

CPC classification number: C03C15/00 ,  C01B15/08 ,  C01B15/085 ,  C09G1/02 ,  C09K13/00 ,  C23F1/18 ,  C23F3/06 ,  H05K3/383 ,  H05K2203/0796

Abstract: A composition comprising a solution of potassium monopersulfate having an active oxygen content of from about 3.4% to about 6.8% and a process for its preparation including neutralization with an alkaline material is disclosed.

Abstract translation: 公开了包含活性氧含量为约3.4％至约6.8％的单过硫酸钾溶液的组合物及其制备方法，包括用碱性材料中和。

公开(公告)号：US20070228333A1

公开(公告)日：2007-10-04

申请号：US11759456

申请日：2007-06-07

Applicant: Abayomi Owei ,  Hiep Nguyen ,  Eric Yakobson

Inventor： Abayomi Owei ,  Hiep Nguyen ,  Eric Yakobson

IPC: C23F11/00

CPC classification number: C09J171/02 ,  C23C22/52 ,  C23F1/18 ,  H05K3/383 ,  H05K2203/0796 ,  H05K2203/122 ,  H05K2203/124 ,  Y10S428/901 ,  Y10T428/12583 ,  Y10T428/12694

Abstract: An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.

公开(公告)号：US20060283625A1

公开(公告)日：2006-12-21

申请号：US11452933

申请日：2006-06-15

Applicant: Shintaro Yamamichi ,  Katsumi Kikuchi ,  Hideya Murai ,  Takuo Funaya ,  Takehiko Maeda ,  Kenta Ogawa ,  Jun Tsukano ,  Hirokazu Honda

Inventor： Shintaro Yamamichi ,  Katsumi Kikuchi ,  Hideya Murai ,  Takuo Funaya ,  Takehiko Maeda ,  Kenta Ogawa ,  Jun Tsukano ,  Hirokazu Honda

IPC: H05K1/11 ,  H05K1/03

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/92125 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K3/0055 ,  H05K3/20 ,  H05K3/421 ,  H05K3/4644 ,  H05K2201/09563 ,  H05K2201/09863 ,  H05K2203/0796 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A wiring board in which lower-layer wiring composed of a wiring body and an etching barrier layer is formed in a concave portion formed on one face of a board-insulating film, upper-layer wiring is formed on the other face of the board-insulating film, and the upper-layer wiring and the wiring body of the lower-layer wiring are connected to each other through a via hole formed in the board-insulating film. The via hole is barrel-shaped, bell-shaped, or bellows-shaped.

Abstract translation: 在由板状绝缘膜的一面形成的凹部形成有由布线体和蚀刻阻挡层构成的下层布线的布线基板，在基板绝缘膜的另一面形成有上层布线， 绝缘膜，上层布线和下层布线的布线体通过形成在基板绝缘膜上的通孔相互连接。 通孔为桶形，钟形或波纹管状。

公开(公告)号：US20060226115A1

公开(公告)日：2006-10-12

申请号：US11449349

申请日：2006-06-08

Applicant: Roger Bernards ,  Joseph Bowers ,  Benjamin Carroll ,  Alvin Kucera

Inventor： Roger Bernards ,  Joseph Bowers ,  Benjamin Carroll ,  Alvin Kucera

IPC: C09K13/00 ,  C09K13/06 ,  C23F1/00

CPC classification number: B32B38/00 ,  B32B2038/0052 ,  B32B2311/12 ,  B32B2457/08 ,  C23C22/52 ,  C23F1/18 ,  H05K3/282 ,  H05K3/383 ,  H05K3/385 ,  H05K3/389 ,  H05K2201/0239 ,  H05K2203/0796 ,  H05K2203/121 ,  H05K2203/124

Abstract: The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.

公开(公告)号：US07063800B2

公开(公告)日：2006-06-20

申请号：US10705026

申请日：2003-11-10

Applicant: Ying Ding ,  Ronald N. Redline ,  Richard C. Retallick ,  Mark Wojtaszek

Inventor： Ying Ding ,  Ronald N. Redline ,  Richard C. Retallick ,  Mark Wojtaszek

IPC: C03C15/00

CPC classification number: H05K3/383 ,  C23F1/18 ,  C23G1/103 ,  H05K2203/0796

Abstract: The present invention sets forth an improved method of microetching a metal substrate by contacting the substrate with an aqueous composition comprising a sodium persulfate or hydrogen peroxide oxidizing agent, acid, and one or more additives. When the oxidizing agent is sodium persulfate, the one or more additives generally comprise an aliphatic saturated dicarboxylic acid. When the oxidizing agent is hydrogen peroxide, the one or more additives generally comprise a stabilizer and amino tris(methylene phosphonic acid).

Abstract translation: 本发明提出了通过使基材与包含过硫酸钠或过氧化氢氧化剂，酸和一种或多种添加剂的水性组合物接触来对金属基材进行微蚀刻的改进方法。 当氧化剂是过硫酸钠时，一种或多种添加剂通常包括脂肪族饱和二羧酸。 当氧化剂是过氧化氢时，一种或多种添加剂通常包含稳定剂和氨基三（亚甲基膦酸）。

公开(公告)号：US20060073315A1

公开(公告)日：2006-04-06

申请号：US11239320

申请日：2005-09-30

Applicant: Hiroshi Orikabe

Inventor： Hiroshi Orikabe

IPC: B32B3/00

CPC classification number: C25D5/40 ,  C23C18/1641 ,  C23C18/1644 ,  C23C18/1653 ,  C23C18/1692 ,  C23C18/2086 ,  C23C18/22 ,  C25D5/50 ,  H05K1/0346 ,  H05K1/0373 ,  H05K1/0393 ,  H05K3/181 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2203/0796 ,  Y10T428/24917 ,  Y10T428/252

Abstract: Metallized polyamideimide films for use as a substrate, in which a conductive layer is adhered to a polyamideimide film at high peel strength, may be prepared in a relatively small number of steps without using a special material by treating an inorganic filler-containing polyamideimide film with an alkaline permanganate solution, and subjecting the treated surface to electroless copper plating, or successive electroless copper plating and electrolytic copper plating. Preferably, a potassium permanganate solution or a sodium permanganate solution is used as the alkaline permanganate solution.

Abstract translation: 金属化的聚酰胺酰亚胺膜，其中导电层以高剥离强度粘附到聚酰胺酰亚胺膜上，可以以相对较少的步骤制备用作基材的金属化聚酰胺酰亚胺膜，而不使用特殊的材料，通过将含有无机填料的聚酰胺酰亚胺膜与 碱性高锰酸盐溶液，并对经处理的表面进行化学镀铜，或连续的无电镀铜和电解镀铜。 优选使用高锰酸钾溶液或高锰酸钠溶液作为碱金属高锰酸盐溶液。