公开(公告)号：US20150206914A1

公开(公告)日：2015-07-23

申请号：US14420010

申请日：2013-08-19

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann

IPC: H01L27/146 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/58

CPC classification number: H01L25/165 ,  B29D11/00307 ,  B29D11/00375 ,  H01L25/167 ,  H01L27/14625 ,  H01L27/14632 ,  H01L27/14683 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/02325 ,  H01L31/167 ,  H01L31/18 ,  H01L31/1876 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2933/0058 ,  H01L2924/00

Abstract: Fabricating an optics wafer includes providing a wafer comprising a core region composed of a glass-reinforced epoxy, the wafer further comprising a first resin layer on a top surface of the core region and a second resin layer on a bottom surface of the core region. The core region and first and second resin layers are substantially non-transparent for a specific range of the electromagnetic spectrum. The wafer further includes vertical transparent regions that extend through the core region and the first and second resin layers and are composed of a material that is substantially transparent for the specific range of the electromagnetic spectrum. The wafer is thinned, for example by polishing, from its top surface and its bottom surface so that a resulting thickness is within a predetermined range without causing glass fibers of the core region to become exposed. Respective optical structures are provided on one or more exposed surfaces of at least some of the transparent regions.

Abstract translation: 制造光学晶片包括提供包括由玻璃增强环氧树脂构成的芯区域的晶片，晶片还包括在芯区域的顶表面上的第一树脂层和在芯区域的底表面上的第二树脂层。 核心区域和第一和第二树脂层对于电磁谱的特定范围基本上是不透明的。 晶片还包括垂直透明区域，其延伸穿过芯区域和第一和第二树脂层，并且由对于电磁波谱的特定范围基本透明的材料构成。 例如通过抛光将晶片从其顶表面及其底部表面变薄，使得所得到的厚度在预定范围内，而不会导致芯部区域的玻璃纤维暴露。 各个光学结构设置在至少一些透明区域的一个或多个暴露的表面上。

公开(公告)号：US20150179827A1

公开(公告)日：2015-06-25

申请号：US14413890

申请日：2013-07-09

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Markus Rossi

IPC: H01L31/0232 ,  H01L27/144

CPC classification number: G01D5/30 ,  G01L9/0077 ,  G01S7/4813 ,  G01S17/88 ,  H01L27/144 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/02325 ,  H01L31/173 ,  H01L31/1876 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The opto-electronic module (1) comprises a first substrate member (P); a third substrate member (B); a second substrate member (O) arranged between said first and third substrate members and comprising one or more transparent portions (ta, tb) through which light can pass, said at least one transparent portion comprising at least a first optical structure (5a;5a′;5b;5b′); a first spacer member (S1) comprised in said first substrate member (P) or comprised in said second substrate member (O) or distinct from and located between these, which comprises at least one opening (4a;4b); a second spacer member (S2) comprised in said second substrate member (O) or comprised in said third substrate member (B) or distinct from and located between these, which comprises at least one opening (3); a light detecting element (D) arranged on and electrically connected to said first substrate member (P); a light emission element (E) arranged on and electrically connected to said first substrate member (P); and a sensing element (8) comprised in or arranged at said third substrate member (B). Such modules (1) are particularly suitable as sensor modules for sensing a magnitude such as a pressure.

Abstract translation: 光电模块（1）包括第一衬底构件（P）; 第三基板部件（B）; 布置在所述第一和第三基板构件之间并包括一个或多个透光部分（ta，tb）的第二基板构件（O），所述透光部分（ta，tb）通过所述透光部分，所述至少一个透明部分至少包括第一光学结构 '; 5b; 5b'）; 包括在所述第一衬底构件（P）中或包含在所述第二衬底构件（O）中或与之不同的第一间隔构件（S1），其包括至少一个开口（4a; 4b）; 包括在所述第二衬底构件（O）中或包括在所述第三衬底构件（B）中或与之不同的第二间隔构件（S2），其包括至少一个开口（3）; 布置在电连接到所述第一衬底构件（P）上的光检测元件（D）; 布置在电连接到所述第一衬底构件（P）上的发光元件（E）; 以及包含在所述第三衬底构件（B）中或布置在所述第三衬底构件 这种模块（1）特别适用于用于感测诸如压力的量值的传感器模块。

公开(公告)号：US09063005B2

公开(公告)日：2015-06-23

申请号：US13804303

申请日：2013-03-14

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Alexander Bietsch

IPC: H01J3/14 ,  G01J1/04 ,  B32B38/00 ,  G01V8/12 ,  H01L25/16 ,  H01L31/12 ,  G01J1/02

CPC classification number: H04M1/72527 ,  B32B38/0004 ,  G01J1/0271 ,  G01J1/0407 ,  G01S7/4813 ,  G01S17/026 ,  G01V8/12 ,  H01L25/167 ,  H01L25/50 ,  H01L27/14643 ,  H01L27/14649 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/12 ,  H01L2924/0002 ,  H03K17/941 ,  H03K2017/9455 ,  H03K2217/94108 ,  Y10T156/1052 ,  H01L2924/00

Abstract: An optical proximity sensor module includes a substrate, a light emitter mounted on a first surface of the substrate, the light emitter being operable to emit light at a first wavelength, and a light detector mounted on the first surface of the substrate, the light detector being operable to detect light at the first wavelength. The module includes an optics member disposed substantially parallel to the substrate, and a separation member, wherein the separation member is disposed between the substrate and the optics member. Multiple modules can be fabricated in a wafer-level process and can be composed of reflowable materials so that the modules can be incorporated more easily into devices whose manufacture occurs, at least in part, at elevated temperatures when the module is integrated into the device or during subsequent manufacturing processes.

Abstract translation: 光学接近传感器模块包括基板，安装在基板的第一表面上的光发射器，所述发光器可操作以发射第一波长的光;以及光检测器，安装在基板的第一表面上，光检测器 可操作以检测第一波长的光。 该模块包括基本上平行于基板设置的光学部件和分离部件，其中分离部件设置在基板和光学部件之间。 可以在晶片级工艺中制造多个模块，并且可以由可回流材料组成，使得模块可以更容易地结合到其制造发生的装置中，至少部分地在升高的温度下将模块集成到装置中或者 在后续制造过程中。

公开(公告)号：US20140339664A1

公开(公告)日：2014-11-20

申请号：US14366770

申请日：2012-12-18

Applicant: Heptagon Micro Optics Pte. Ltd. ,  Heptagon Oy

Inventor： Markus Rossi ,  Hartmut Rudmann ,  Stephan Heimgartner ,  Alexander Bietsch ,  Robert Lenart

IPC: H01L27/146

CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14683 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H01L27/14818 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The optical device comprises a first substrate (SI) comprising at least one optical structure (1) comprising a main portion (2) and a surrounding portion (3) at least partially surrounding said main portion. The device furthermore comprises non-transparent material (5, 5a, 5b) applied onto said surrounding portion. The opto-electronic module comprises a plurality of these optical devices comprised in said first substrate. The method for manufacturing an optical device comprises the steps of a) providing a first substrate comprising at least one optical structure comprising a main portion and a surrounding portion at least partially surrounding said main portion; and b) applying a non-transparent material onto at least said surrounding portion. Said non-transparent material is present on at least said surrounding portion still in the finished optical device.

Abstract translation: 光学装置包括包括至少一个光学结构（1）的第一基板（S1），该至少一个光学结构（1）包括主要部分（2）和至少部分地围绕所述主要部分的环绕部分（3）。 该装置还包括施加到所述周围部分上的不透明材料（5,5a，5b）。 所述光电模块包括包含在所述第一衬底中的多个这些光学器件。 制造光学器件的方法包括以下步骤：a）提供包括至少一个光学结构的第一衬底，该至少一个光学结构包括至少部分地围绕所述主要部分的主要部分和环绕部分; 以及b）将不透明材料施加到至少所述周围部分上。 所述不透明材料存在于仍在最终光学装置中的至少所述周围部分上。

公开(公告)号：US20140295122A1

公开(公告)日：2014-10-02

申请号：US14346804

申请日：2012-10-01

Applicant: Heptagon Micro Optics Pte. Ltd

Inventor： Peter Riel ,  Hartmut Rudmann ,  Markus Rossi

IPC: B81B7/04 ,  B81C1/00

CPC classification number: B81B7/04 ,  B81C1/00904 ,  H01L27/14618 ,  H01L27/14685 ,  H01L27/14696 ,  H01L2924/0002 ,  Y10T29/49002 ,  Y10T428/18 ,  H01L2924/00

Abstract: The method for manufacturing an object comprises the steps of (a) providing a wafer comprising a multitude of semi-finished objects; (b) separating said wafer into parts referred to as sub- wafers, at least one of said sub-wafers comprising a plurality of said semi-finished objects; (c) processing at least a portion of said plurality of semi-finished objects by subjecting said at least one sub-wafer to at least one processing step; and preferably also the step of (d) separating said at least one sub-wafer into a plurality of parts.

Abstract translation: 制造物体的方法包括以下步骤：（a）提供包括多个半成品的晶片; （b）将所述晶片分离成称为子晶片的部件，所述子晶片中的至少一个包括多个所述半成品; （c）通过对所述至少一个子晶片进行至少一个处理步骤来处理所述多个半成品的至少一部分; 并且还优选地（d）将所述至少一个子晶片分成多个部分的步骤。

公开(公告)号：US20140167196A1

公开(公告)日：2014-06-19

申请号：US14177552

申请日：2014-02-11

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Stephan Heimgartner ,  Ville Kettunen ,  Nicola Spring ,  Alexander Bietsch ,  Mario Cesana ,  Hartmut Rudmann ,  Jukka Alasirnio ,  Robert Lenart

IPC: H01L27/146 ,  H01L31/18

CPC classification number: H01L27/14625 ,  G02B27/0025 ,  H01L27/14627 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/02162 ,  H01L31/02164 ,  H01L31/02325 ,  H01L31/18 ,  H04N5/2254 ,  Y10T29/49826

Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.

公开(公告)号：US20140049687A1

公开(公告)日：2014-02-20

申请号：US14064745

申请日：2013-10-28

Applicant: HEPTAGON Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann

IPC: H04N5/225 ,  G02B3/00

CPC classification number: H04N5/2254 ,  G02B3/00 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14685 ,  H01L2924/0002 ,  H04N5/2257 ,  Y10T29/49 ,  Y10T29/49982 ,  H01L2924/00

Abstract: An optical module for an electro-optical device with a functional element, in particular for a camera device, and to an electro-optical device with such a module. The optical module includes a lens substrate portion with at least one lens element, and a spacer. The spacer serves to keep the lens substrate at a well defined axial distance from a base substrate portion of the fully assembled electro-optical device. In order to ensure improved performance of the functional element, an EMC shield is provided. The spacer is at least in parts electrically conductive and thus forms the EMC shield or a part thereof. A method of manufacturing a plurality of such modules on a wafer scale is also provided.

Abstract translation: 一种用于具有功能元件的电光装置的光学模块，特别是用于相机装置的光学装置以及具有这种模块的电光装置。 光学模块包括具有至少一个透镜元件的透镜基底部分和间隔物。 间隔件用于将透镜基板保持在与完全组装的电光器件的基底部分良好限定的轴向距离上。 为了确保提高功能元件的性能，提供EMC屏蔽。 间隔件至少部分导电，从而形成EMC屏蔽或其一部分。 还提供了在晶片规模上制造多个这样的模块的方法。

公开(公告)号：US20130264586A1

公开(公告)日：2013-10-10

申请号：US13827264

申请日：2013-03-14

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Alexander Bietsch ,  Susanne Westenhoefer ,  Simon Gubser

IPC: H01L31/12

CPC classification number: H01L31/167 ,  G01S7/4813 ,  G01S17/026 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/12 ,  H01L31/173

Abstract: An optical proximity sensor module includes a substrate, a light emitter mounted on a first surface of the substrate, the light emitter being operable to emit light at a first wavelength, and a light detector mounted on the first surface of the substrate, the light detector being operable to detect light at the first wavelength. The module includes an optics member disposed substantially parallel to the substrate, and a separation member disposed between the substrate and the optics member. The separation member may surround the light emitter and the light detector, and may include a wall portion that extends from the substrate to the optics member and that separates the light emitter and the light detector from one another. The separation member may be composed, for example, of a non-transparent polymer material containing a pigment, such as carbon black.

Abstract translation: 光学接近传感器模块包括基板，安装在基板的第一表面上的光发射器，所述发光器可操作以发射第一波长的光;以及光检测器，安装在基板的第一表面上，光检测器 可操作以检测第一波长的光。 该模块包括基本上平行于基板设置的光学部件，以及设置在基板和光学部件之间的分离部件。 分离构件可以围绕光发射器和光检测器，并且可以包括从基板延伸到光学构件并将光发射器和光检测器彼此分离的壁部分。 分离构件可以由例如碳黑等含有颜料的不透明聚合物材料构成。