Method for fabricating a semiconductor device using a metal catalyst and high temperature crystallization
    110.
    发明授权
    Method for fabricating a semiconductor device using a metal catalyst and high temperature crystallization 失效
    使用金属催化剂制造半导体器件和高温结晶的方法

    公开(公告)号:US06465287B1

    公开(公告)日:2002-10-15

    申请号:US08784292

    申请日:1997-01-16

    IPC分类号: H01L2184

    摘要: Concentration of metal element which promotes crystallization of silicon and which exists within a crystalline silicon film obtained by utilizing the metal element is reduced. A first heat treatment for crystallization is performed in temperature above 750° C. after introducing elemental nickel to an amorphous silicon film 103 disposed on a quartz substrate 101. Then, after obtaining the crystalline silicon film 105, it is patterned to obtain a pattern 106. Then, another heat treatment is performed within an oxidizing atmosphere at a temperature higher than that of the previous heat treatment. A thermal oxide film 107 is formed in this step. At this time, the elemental nickel is gettered to the thermal oxide film 107. Next, the thermal oxide film 107 is removed. Thereby, a crystalline silicon film 106 having low concentration of the metal element and a high crystallinity can be obtained.

    摘要翻译: 通过利用金属元素获得的结晶硅膜中存在促进硅结晶的金属元素的浓度降低。 在将元素镍引入设置在石英衬底101上的非晶硅膜103之后,在750℃以上的温度下进行第一次结晶热处理。然后,在获得晶体硅膜105之后,对其进行图案化以获得图案106 然后,在比以前的热处理温度高的氧化气氛中进行另一热处理。 在该步骤中形成热氧化膜107。 此时,元素镍被吸收到热氧化膜107上。接下来,去除热氧化膜107。 由此,可以得到金属元素浓度低,结晶性高的结晶硅膜106。