公开(公告)号：US20240351078A1

公开(公告)日：2024-10-24

申请号：US18683735

申请日：2022-08-19

申请人： EBARA CORPORATION

发明人： Naoyuki HANDA ,  Satomi HAMADA

IPC分类号： B08B7/04 ,  B08B1/14 ,  B08B1/34 ,  B08B3/02 ,  B24B37/34

CPC分类号： B08B7/04 ,  B08B1/14 ,  B08B1/34 ,  B08B3/02 ,  B24B37/34

摘要： A substrate cleaning apparatus that brings a cleaning tool into sliding contact with a substrate surface while rotating the substrate to perform scrub-cleaning includes a cleaning liquid supply unit that ejects cleaning liquid onto the surface of the substrate to perform a rinsing process of the substrate after scrub-cleaning, in which a temperature of the cleaning liquid in the rinsing process is set to 0° C. to 20° C. The cleaning liquid supply unit includes a first cleaning liquid supply unit that supplies the cleaning liquid toward the vicinity of the center of the substrate and a second cleaning liquid supply unit that supplies the cleaning liquid in a spray form toward a region between the center and an edge of the substrate, and a first ejection angle by the first cleaning liquid supply unit is smaller than a second ejection angle by the second cleaning liquid supply unit.

公开(公告)号：US20240308024A1

公开(公告)日：2024-09-19

申请号：US18311900

申请日：2023-05-04

申请人： National Taiwan University of Science and Technology

发明人： Chyi-Yeu Lin

IPC分类号： B24B49/12 ,  B24B37/005 ,  B24B37/34 ,  B60S3/06

CPC分类号： B24B49/12 ,  B24B37/005 ,  B24B37/34 ,  B60S3/06

摘要： A vehicle waxing system and a vehicle waxing method. The vehicle waxing system includes one or more waxing movement mechanisms and a controller. Each of the waxing movement mechanisms is provided with a waxing device and configured to move the waxing device of disposition to perform a waxing operation. The controller is coupled to the waxing movement mechanism. The controller is configured to determine a waxing area of a vehicle according to vehicle external outline information and waxing portion information, and determine the movement trajectory of the waxing operation performed on the waxing area by the waxing device disposed by the waxing movement mechanism. Therefore, an autonomous waxing operation may be achieved.

公开(公告)号：US12094740B2

公开(公告)日：2024-09-17

申请号：US17212862

申请日：2021-03-25

申请人： Applied Materials, Inc.

发明人： Manoj A. Gajendra ,  Mahadev Joshi ,  Joseph Antony Jonathan ,  Jamie S. Leighton

IPC分类号： H01L21/67 ,  B08B3/02 ,  B08B5/02 ,  B08B13/00 ,  B24B37/013 ,  B24B37/34 ,  H01L21/02 ,  H01L21/306 ,  H01L21/66 ,  H01L21/687

CPC分类号： H01L21/67253 ,  B08B3/022 ,  B08B5/02 ,  B08B13/00 ,  B24B37/013 ,  B24B37/345 ,  H01L21/02057 ,  H01L21/30625 ,  H01L21/68707 ,  H01L22/12

摘要： A method and apparatus for polishing a substrate is disclosed herein. More specifically, the apparatus relates to an integrated CMP system for polishing substrates. The CMP system has a polishing station configured to polish substrates. A spin rinse dry (SRD) station configured to clean and dry the substrates. A metrology station configured to measure parameters of the substrates. A robot configured to move the substrate in to and out of the SRD station. And an effector rinse and dry (EERD) station configured to clean and dry an end effector of the robot.

公开(公告)号：US12070835B2

公开(公告)日：2024-08-27

申请号：US17842786

申请日：2022-06-17

申请人： SEIKOH GIKEN Co., Ltd.

发明人： Yuji Shibutani

IPC分类号： B24B41/06 ,  B24B19/22 ,  B24B27/00 ,  B24B37/27 ,  B24B37/34 ,  G02B6/36 ,  G02B6/38

CPC分类号： B24B41/067 ,  B24B19/226 ,  B24B27/0023 ,  B24B37/27 ,  G02B6/36 ,  B24B37/34 ,  G02B6/3863 ,  G02B6/3866

摘要： Provided is an optical fiber ferrule polishing jig capable of fixing an optical fiber ferrule and releasing the optical fiber ferrule. An optical fiber ferrule polishing jig 10A has; a base 12a having insertion holes 20 into which optical fiber ferrules 51 can be detachably inserted; pivoting rods 13 which are adjacent to the insertion holes 20 of the base 12a and rotatable around lower end portions 36; fixing pieces 14a installed in installation recesses 19a formed in the base 12a to fix the optical fiber ferrules 51 with respect to the insertion holes 20 by being moved as the rods are pivoted; and a plurality of coil springs 15a installed in the installation recesses 19a to bias the fixing pieces 14a so as to release fixing of the optical fiber ferrules 51 with respect to the insertion holes 20.

公开(公告)号：US12033847B2

公开(公告)日：2024-07-09

申请号：US17294212

申请日：2019-10-31

申请人： EBARA CORPORATION

发明人： Toshio Mizuno ,  Yosuke Himori ,  Erina Baba ,  Tomoatsu Ishibashi ,  Itsuki Kobata

IPC分类号： B24B9/06 ,  B24B37/34 ,  B24B41/06 ,  H01L21/02 ,  H01L21/304 ,  H01L21/67 ,  H01L21/677 ,  H01L21/687

CPC分类号： H01L21/02087 ,  B24B9/065 ,  B24B37/345 ,  B24B41/06 ,  H01L21/304 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67092 ,  H01L21/67706 ,  H01L21/68764

摘要： To perform both buff cleaning of a substrate surface and cleaning of an edge part of the substrate, a cleaning module includes: a rotary table configured to support a circular substrate and have a diameter smaller than a diameter of the substrate; a buff cleaning portion configured to buff clean a front side of the substrate while contacting the front side of the substrate supported by the rotary table; a buff cleaning portion movement mechanism configured to move the buff cleaning portion with respect to the substrate; a buff cleaning portion control mechanism configured to control an operation of the buff cleaning portion movement mechanism; and an edge cleaning portion configured to clean an edge part of the substrate while contacting the edge part of the substrate supported by the rotary table.

公开(公告)号：US20240217055A1

公开(公告)日：2024-07-04

申请号：US17790454

申请日：2022-05-16

申请人： ChangXin Memory Technologies, Inc.

发明人： Yu Bao

IPC分类号： B24B37/22 ,  B24B37/005 ,  B24B37/16 ,  B24B37/34

CPC分类号： B24B37/22 ,  B24B37/005 ,  B24B37/16 ,  B24B37/34

摘要： A CMP method includes: provide a substrate with a dielectric layer and a conductive layer, using a mixture of a first polishing liquid and a second polishing liquid to do first CMP polish the substrate placed on the polishing disc to remove the conductive layer covering the upper surface of the intermediate dielectric layer; after the substrate is rinsed with a cleaning solution, the second polishing solution is applied to do second CMP polish on the substrate to remove a part of the dielectric layer, so that the upper surface of the dielectric layer is lower than the upper surface of the conductive layer filled in the groove, so as to ensure that the conductive layer in the groove can protrude from the surface of the dielectric layer. This technique improves product yield for single disc CMP process.

公开(公告)号：US12002688B2

公开(公告)日：2024-06-04

申请号：US18328626

申请日：2023-06-02

申请人： EBARA CORPORATION

发明人： Haiyang Xu ,  Mitsuhiko Inaba

IPC分类号： H01L21/67 ,  B08B1/14 ,  B08B1/32 ,  B24B37/04 ,  B24B37/34 ,  H01L21/02

CPC分类号： H01L21/67046 ,  B08B1/143 ,  B08B1/145 ,  B08B1/32 ,  B24B37/04 ,  B24B37/34 ,  H01L21/02096 ,  H01L21/67219

摘要： A substrate cleaning device includes: a pressing member that cleans a substrate by contacting the substrate; a load measurement unit that measures a pressing load of the cleaning member; and a control unit that repeats an operation of comparing the measurement value of the load measurement unit with the setting load, changing the pressing amount of the cleaning member by a first movement amount so that a difference value decreases, when the difference value is larger than a first threshold value and equal to or smaller than a second threshold value, and changing the pressing amount of the cleaning member by a second movement amount larger than the first movement amount so that the difference value decreases, when the difference value is larger than the second threshold value, until the difference value becomes equal to or smaller than the first threshold value.

公开(公告)号：US11980998B2

公开(公告)日：2024-05-14

申请号：US16796903

申请日：2020-02-20

申请人： EBARA CORPORATION

发明人： Itsuki Kobata ,  Takashi Yamazaki ,  Ryuichi Kosuge ,  Tadakazu Sone

IPC分类号： B24B57/02 ,  B24B37/005 ,  B24B37/34 ,  B24B55/02 ,  B24D13/14 ,  B24D13/20

CPC分类号： B24B57/02 ,  B24B37/005 ,  B24B37/34 ,  B24B55/02 ,  B24D13/147 ,  B24D13/20

摘要： An operation control unit includes a storage device storing a program which includes commands of: obtaining a correlation between a supply position of the polishing liquid in the radial direction of the polishing pad using the liquid injection nozzle and an average polishing rate of the substrate and an distribution of the polishing rate within the substrate; determining a movable range of the liquid injection nozzle according to a predetermined range of an allowable average polishing rate and the correlation between the supply position of the polishing liquid and the average polishing rate; determining an optimal supply position of the polishing liquid from the correlation between the supply position of the polishing liquid and the distribution of the polishing rate within the substrate within the determined movable range of the liquid injection nozzle; and moving the liquid injection nozzle to the determined supply position to polish the substrate.

公开(公告)号：US11846536B2

公开(公告)日：2023-12-19

申请号：US16532493

申请日：2019-08-06

申请人： EBARA CORPORATION

发明人： Naoki Toyomura ,  Mitsuru Miyazaki

IPC分类号： G01F23/292 ,  B24B37/34 ,  B08B3/02 ,  B08B3/04 ,  B24B37/005

CPC分类号： G01F23/2921 ,  B08B3/02 ,  B08B3/04 ,  B24B37/005 ,  B24B37/34

摘要： A sensor target cover capable of preventing an optical liquid level detection sensor from erroneously detecting a rise in a liquid level is provided. A sensor target cover is used in combination with an optical liquid level detection sensor. The sensor target cover includes a reflecting plate, an inner wall structure surrounding the reflecting plate, and an outer wall structure surrounding the inner wall structure. A gap is formed between the inner wall structure and the outer wall structure.

公开(公告)号：US11791173B2

公开(公告)日：2023-10-17

申请号：US16741002

申请日：2020-01-13

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Seung Hoon Choi ,  Ja Eung Koo ,  No Ui Kim ,  Hyun Kyo Seo ,  Tae Min Earmme ,  Bo Un Yoon ,  Youn Cheol Jeong

IPC分类号： H01L21/67 ,  H01L21/02 ,  B24B37/34

CPC分类号： H01L21/67051 ,  B24B37/34 ,  H01L21/02057 ,  H01L21/02096 ,  H01L21/67046

摘要： Substrate cleaning equipment includes a substrate holder which supports a substrate, a swing body, a head, a first cleaning liquid supply structure, and a second cleaning liquid supply structure. The swing body moves along a sweep line on a main surface of the substrate. The head is coupled to the swing body and includes a pad attachment surface facing the substrate holder. The first cleaning liquid supply structure is coupled to the swing body and sprays a first cleaning liquid onto the main surface of the substrate. The second cleaning liquid supply structure sprays a second cleaning liquid onto the main surface of the substrate. A buffing pad is attached to the pad attachment surface.