WIPING DEVICE AND LIQUID DISCHARGE APPARATUS

    公开(公告)号:US20240316588A1

    公开(公告)日:2024-09-26

    申请号:US18431114

    申请日:2024-02-02

    IPC分类号: B05B15/50 B08B1/14

    CPC分类号: B05B15/50 B08B1/14

    摘要: A wiping device includes a web, multiple pressing mechanisms, and circuitry. The web is windable in a winding direction and a rewinding direction, to wipe nozzle faces of multiple liquid discharge heads arranged in a width direction. The multiple pressing mechanisms are arranged in the width direction corresponding to the multiple liquid discharge heads. Each of the multiple pressing mechanisms is movable between a wiping position and a retracted position. The circuitry stores unused portion of the web at which a part of the multiple pressing mechanisms is at the retracted position during wiping, rewinds the web in the rewinding direction to cause the unused portion to face a part of the nozzle faces unwiped, and causes the part of the multiple pressing mechanisms corresponding to the unused portion to move to the wiping position to bring the unused portion into contact with the part of the nozzle faces unwiped.

    SUBSTRATE CLEANING DEVICE, SUBSTRATE CLEANING METHOD, AND SUBSTRATE POLISHING APPARATUS

    公开(公告)号:US20240351078A1

    公开(公告)日:2024-10-24

    申请号:US18683735

    申请日:2022-08-19

    申请人: EBARA CORPORATION

    摘要: A substrate cleaning apparatus that brings a cleaning tool into sliding contact with a substrate surface while rotating the substrate to perform scrub-cleaning includes a cleaning liquid supply unit that ejects cleaning liquid onto the surface of the substrate to perform a rinsing process of the substrate after scrub-cleaning, in which a temperature of the cleaning liquid in the rinsing process is set to 0° C. to 20° C. The cleaning liquid supply unit includes a first cleaning liquid supply unit that supplies the cleaning liquid toward the vicinity of the center of the substrate and a second cleaning liquid supply unit that supplies the cleaning liquid in a spray form toward a region between the center and an edge of the substrate, and a first ejection angle by the first cleaning liquid supply unit is smaller than a second ejection angle by the second cleaning liquid supply unit.