Imaging device and imaging system
    91.
    发明授权

    公开(公告)号:US11723225B2

    公开(公告)日:2023-08-08

    申请号:US18066675

    申请日:2022-12-15

    IPC分类号: H10K39/32 H01L27/146

    摘要: An imaging device including a semiconductor substrate including a first surface that receives light from outside, and a second surface opposite to the first surface; a first transistor located on the second surface; and a photoelectric converter that faces the second surface and that receives light transmitted through the semiconductor substrate. The semiconductor substrate is a silicon substrate or a silicon compound substrate, and the photoelectric converter includes a first electrode electrically connected to the first transistor, a second electrode, and a photoelectric conversion layer that is located between the first electrode and the second electrode and that contains a material which absorbs light having a first wavelength longer than or equal to 1.1 μm, and the material has a quantum nanostructure.

    PHOTOELECTRIC CONVERTER AND IMAGING DEVICE
    95.
    发明公开

    公开(公告)号:US20230207598A1

    公开(公告)日:2023-06-29

    申请号:US17928862

    申请日:2021-05-28

    摘要: A photoelectric converter includes: a first electrode; a second electrode; a first photoelectric conversion layer; a second photoelectric conversion layer; a first buffer layer; and a second buffer layer. The second electrode is disposed to be opposed to the first electrode. The first photoelectric conversion layer is provided between the first electrode and the second electrode. The first photoelectric conversion layer includes a first dye material and a first carrier transport material. The second photoelectric conversion layer is stacked on the second electrode side of the first photoelectric conversion layer between the first electrode and the second electrode. The second photoelectric conversion layer includes a second dye material and a second carrier transport material. The second dye material has a light absorption waveform different from a light absorption waveform of the first dye material. The first buffer layer has a first electrical conduction type. The first buffer layer is provided between the first electrode and the first photoelectric conversion layer. The second buffer layer has a second electrical conduction type different from the first electrical conduction type. The second buffer layer is provided between the second electrode and the second photoelectric conversion layer.

    Optical fingerprint identification system

    公开(公告)号:US11670109B2

    公开(公告)日:2023-06-06

    申请号:US17738999

    申请日:2022-05-06

    IPC分类号: G06V40/13 G06F3/042

    摘要: An optical fingerprint identification system includes a cover, a light emitting layer, an optical layer, an image sensor and a base that are sequentially disposed from top to bottom. The cover has a fingerprint contact surface on top. The image sensor has an image surface. The optical layer includes a first array layer and a second array layer, and the first array layer is stacked on top of the second array layer. The first array layer and the second array layer respectively include a plurality of first array lens elements and a plurality of second array lens elements respectively arranged at equal intervals in a first direction. Each of the first array lens elements and a corresponding second array lens element of the second array layer are coaxial along an optical axis and form an imaging unit.

    DETECTION DEVICE
    98.
    发明公开
    DETECTION DEVICE 审中-公开

    公开(公告)号:US20230165019A1

    公开(公告)日:2023-05-25

    申请号:US18101183

    申请日:2023-01-25

    IPC分类号: H10K39/32

    CPC分类号: H10K39/32

    摘要: A detection device is a detection device including a plurality of optical sensors arranged on a substrate. In each of the optical sensors, a lower electrode, an electron transport layer, an active layer, a hole transport layer, and an upper electrode are stacked in a direction orthogonal to a surface of the substrate in the order as listed. The active layer contains an organic semiconductor. The hole transport layer includes a metal oxide layer and is provided on the active layer so as to be in contact therewith.