公开(公告)号：US20070148829A1

公开(公告)日：2007-06-28

申请号：US11622950

申请日：2007-01-12

Applicant: Toyokazu YOSHINO ,  Katsuya OKAMOTO ,  Shigeki OGATA ,  Shinji MORIMOTO ,  Kouji NAKASHIMA

Inventor： Toyokazu YOSHINO ,  Katsuya OKAMOTO ,  Shigeki OGATA ,  Shinji MORIMOTO ,  Kouji NAKASHIMA

IPC: H01L21/82

CPC classification number: H05K3/4046 ,  H05K1/0393 ,  H05K3/386 ,  H05K3/4084 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4635 ,  H05K2201/0195 ,  H05K2201/0221 ,  H05K2201/0379 ,  H05K2201/043 ,  H05K2201/096 ,  H05K2201/10234 ,  H05K2201/10416 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/082 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49213

Abstract: Provided is an FPC, which comprises an insulating layer 2, wiring layers 3 and 4 laminated above and under the insulating layer 2, and a layer connection for connecting the wiring layers 3 and 4 electrically. The layer connection is constituted to comprise: a conductor press-fit hole 5 of a cone shape extending through the insulating layer 2 and the upper and lower wiring layers 3 and 4 and expanded to the side of one wiring layer 3; and a conductor 6 filled and press-fitted without any clearance in the conductor press-fit hole such that it is jointed to the wiring upper layer 3 deformed into the cone shape of the conductor press-fit hole 5, and is protruded from the other wiring lower layer 4 to have its surface partially coated and jointed. As a result, the contact area between the wiring layers 3 and 4 and the conductor 6 filled in the conductor press-fit hole 5 can be enlarged to retain the contact strength between the wiring layers 3 and 4 and the conductor 6 sufficiently thereby to provide a high connection reliability for the layer connection.

Abstract translation: 提供一种FPC，其包括绝缘层2，层叠在绝缘层2上方和下方的布线层3和4以及用于电连接布线层3和4的层连接。 层连接构成为包括：延伸穿过绝缘层2和上下布线层3和4的锥形导体压入孔5，并扩展到一个布线层3的侧面; 导体6在导体压配合孔内填充并压配合而没有任何间隙，使其接合到变形为导体压配合孔5的锥形的布线上层3，并从另一个突出 布线下层4以使其表面部分涂覆和接合。 结果，可以扩大布线层3和4与填充在导体压入孔5中的导体6之间的接触面积，以充分地保持布线层3和4与导体6之间的接触强度，从而提供 层连接的高连接可靠性。

公开(公告)号：US20070071984A1

公开(公告)日：2007-03-29

申请号：US10571084

申请日：2004-09-10

Applicant: Yoshiaki Echigo ,  Jusirou Eguchi ,  Akira Shigeta ,  Makoto Uchida ,  Shigeru Moteki

Inventor： Yoshiaki Echigo ,  Jusirou Eguchi ,  Akira Shigeta ,  Makoto Uchida ,  Shigeru Moteki

IPC: B32B27/38 ,  B32B27/28

CPC classification number: H05K1/036 ,  H05K1/0346 ,  H05K1/0393 ,  H05K2201/0195 ,  H05K2201/043 ,  Y10T428/24917 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: The present invention provides a substrate for a flexible printed wiring board including an adhesive layer containing an epoxy resin composition, insulating layers respectively stacked on both sides of the adhesive layer and formed with a pair of films containing a nonthermoplastic polyimide resin, and conductor layers respectively disposed on the outer surfaces of the films. The total thickness of the insulating layers respectively stacked on both sides of the adhesive layer is 10 to 100 μm and 2 to 10 times the thickness of the adhesive layer. The mutual adhesion strength between the insulating layers through the intermediary of the adhesive layer is 7.0 N/cm or more.

Abstract translation: 本发明提供一种柔性印刷电路板用基板，其具有包含环氧树脂组合物的粘合剂层，分别层叠在粘合剂层的两面上的绝缘层，分别形成有一对含有非热塑性聚酰亚胺树脂的膜和导体层 设置在膜的外表面上。 分别层叠在粘合剂层的两面上的绝缘层的总厚度为10〜100μm，粘合剂层的厚度的2〜10倍。 通过粘合剂层中间的绝缘层之间的相互粘附强度为7.0N / cm以上。

公开(公告)号：US20050122428A1

公开(公告)日：2005-06-09

申请号：US10510289

申请日：2003-04-02

Applicant: Satoru Kawakami ,  Tadashi Imai

Inventor： Satoru Kawakami ,  Tadashi Imai

IPC: H04B1/08 ,  H04B1/18 ,  H04N5/50 ,  H04N5/64 ,  H05K1/02 ,  H05K1/14 ,  H04N7/173 ,  H04N5/14 ,  H04N5/44 ,  H04N9/64

CPC classification number: H05K9/006 ,  H04B1/005 ,  H04B1/08 ,  H04B1/18 ,  H04N5/50 ,  H04N5/64 ,  H04N21/4263 ,  H04N21/6143 ,  H05K1/0218 ,  H05K1/0237 ,  H05K1/144 ,  H05K2201/043 ,  H05K2201/0715 ,  H05K2201/0723

Abstract: The present invention provides a receiver that includes a plurality of tuners for receiving broadcasts such as satellite broadcast. A tuner circuit (1) includes an input terminal (11) for inputting a broadcast wave in which a video signal and/or an audio signal are modulated in a predetermined format, and a mount layer (13) on which a main circuit (12) for selecting, from the broadcast wave, a video signal and/or an audio signal included in a predetermined frequency band is mounted. In the tuner circuit (1), a first ground layer (15) is disposed, through a first dielectric layer (14), on the surface opposite to that on which the main circuit (12) of the mount layer (13) is arranged, and a second ground layer (17) is disposed through a second dielectric layer, thereby suppressing mutual interference between tuners.

Abstract translation: 本发明提供一种接收机，其包括用于接收诸如卫星广播的广播的多个调谐器。 调谐器电路（1）包括用于输入以预定格式调制视频信号和/或音频信号的广播波的输入端（11）和安装层（13），主电路（12） ）用于从广播波选择包括在预定频带中的视频信号和/或音频信号。 在调谐器电路（1）中，第一接地层（15）通过第一电介质层（14）设置在与安装层（13）的主电路（12）相对的表面相对的表面上 并且通过第二介电层设置第二接地层（17），从而抑制调谐器之间的相互干扰。

公开(公告)号：US20050077362A1

公开(公告)日：2005-04-14

申请号：US10683838

申请日：2003-10-09

Applicant: Jackson Hsieh ,  Jichen Wu ,  Abnet Chen

Inventor： Jackson Hsieh ,  Jichen Wu ,  Abnet Chen

IPC: G06K19/02 ,  G06K19/077 ,  H05K1/02 ,  H05K1/14 ,  H05K3/28 ,  G06K19/06

CPC classification number: G06K19/0773 ,  G06K19/02 ,  G06K19/077 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0206 ,  H05K1/144 ,  H05K3/0061 ,  H05K3/284 ,  H05K2201/043 ,  H01L2924/00014

Abstract: A stacked small memory card includes an upper memory card and a lower memory card, the upper memory card and the lower memory card respectively formed a first heat sink and a second heat sink, the first heat sink and the second heat sink are stacked together, so that, the heat of the upper memory card and the lower memory card may be dispersed via the first heat sink and the second heat sink. Thus, the stacked small memory card of present invention having high function of disperses heat to promote its durability and lifetime effectively.

Abstract translation: 堆叠式小存储卡包括上存储卡和下存储卡，上存储卡和下存储卡分别形成第一散热器和第二散热器，第一散热器和第二散热器堆叠在一起， 使得上存储卡和下存储卡的热量可以经由第一散热器和第二散热器分散。 因此，本发明的堆叠式小型存储卡具有高散热功能，有效地提高了其耐久性和寿命。

公开(公告)号：US20050047103A1

公开(公告)日：2005-03-03

申请号：US10840051

申请日：2004-05-06

Applicant: Michael Bothe ,  Stefan Morbe ,  Michael Becks ,  Peter Grad

Inventor： Michael Bothe ,  Stefan Morbe ,  Michael Becks ,  Peter Grad

IPC: H02M3/28 ,  H01F27/28 ,  H05K1/03 ,  H05K1/14 ,  H05K1/16 ,  H05K1/18 ,  H05K7/06

CPC classification number: H05K1/144 ,  H01F27/2804 ,  H05K1/0306 ,  H05K1/142 ,  H05K1/162 ,  H05K1/167 ,  H05K1/181 ,  H05K2201/0187 ,  H05K2201/043 ,  H05K2201/1003 ,  H05K2201/10083

Abstract: The present invention relates to a power supply circuit comprising at least one transformer which is connected to a primary side circuit and to a secondary side circuit. The present invention further relates to a method for producing such a power supply circuit. To provide an improved power supply circuit which has a reduced size and increased power density and offers more flexibility in the formation of the safety distances between primary side and secondary side, the primary side circuit and the secondary side circuit are each mounted on at least one separate circuit carrier, said circuit carriers being mechanically and electrically coupled to one another and arranged in at least two different planes. According to advantageous embodiments, said circuit carriers may be arranged in planes that are either parallel with or transverse to one another.

Abstract translation: 本发明涉及一种电源电路，其包括连接到初级侧电路和次级侧电路的至少一个变压器。 本发明还涉及这种电源电路的制造方法。 为了提供一种改进的电源电路，其具有减小的尺寸和增加的功率密度，并且在形成初级侧和次级侧之间的安全距离方面提供更大的灵活性，初级侧电路和次级侧电路分别安装在至少一个 单独的电路载体，所述电路载体彼此机械地和电耦合并且布置在至少两个不同的平面中。 根据有利的实施例，所述电路载体可以布置在彼此平行或相互平行的平面中。

公开(公告)号：US20040212965A1

公开(公告)日：2004-10-28

申请号：US10801697

申请日：2004-03-17

Inventor： Toshiaki Ishii ,  Nobutake Tsuyuno ,  Mitsuhiro Masuda ,  Noriyoshi Urushiwara ,  Akira Matsushita

IPC: H05K007/20

CPC classification number: H05K1/144 ,  H01L23/3107 ,  H01L23/473 ,  H01L23/49531 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H05K1/0203 ,  H05K3/0061 ,  H05K5/0082 ,  H05K2201/043 ,  H05K2201/10924 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A resin-sealed electronic circuit apparatus capable of maintaining a high heat-dissipating property and packaging density in applications where high hermetic-sealing property and durability are required. The electronic circuit apparatus comprises at least two wiring circuit boards 12 and 13 on which electronic components are mounted. The wiring circuit boards 12 and 13 are fixed to a heat sink 14 having a high heat conductivity via an adhesive 9 and 10. The entirety of the wiring circuit boards 12 and 13 and heat sink 14, as well as a part of an external connection terminal 8 are hermetically sealed and integrally molded by a thermosetting resin composition 7. The electronic circuit apparatus is small and highly reliable and can be provided at low cost.

Abstract translation: 一种在需要高密封性和耐久性的应用中能够保持高散热性和封装密度的树脂密封电子电路装置。 电子电路装置包括安装有电子部件的至少两个布线电路板12和13。 布线电路板12和13通过粘合剂9和10固定到具有高导热性的散热器14上。布线电路板12和13以及散热片14的整体以及外部连接的一部分 端子8被密封并通过热固性树脂组合物7整体模制。电子电路装置小而高度可靠，并且可以以低成本提供。

公开(公告)号：US06510053B1

公开(公告)日：2003-01-21

申请号：US09663736

申请日：2000-09-15

Applicant: Kaveh Azar

Inventor： Kaveh Azar

IPC: H05K720

CPC classification number: H05K7/20636 ,  H05K1/0203 ,  H05K1/144 ,  H05K2201/043 ,  H05K2201/09745 ,  H05K2201/1056

Abstract: A circuit board cooling system includes a thermally conductive element sandwiched between two circuit boards. The thermally conductive element of this thermal sandwich conducts heat away from both of the attached circuit cards. The thermally conductive element may be a solid slab of thermally conductive material, such as copper, it may be a hollow, substantially planar thermal conductor with an internally circulating cooling fluid, or it may be a substantially planar heat pipe, for example.

Abstract translation: 电路板冷却系统包括夹在两个电路板之间的导热元件。 该热夹层的导热元件将热量从两个连接的电路卡导出。 导热元件可以是诸如铜的导热材料的实心板，它可以是具有内部循环冷却流体的中空的，基本上平面的热导体，或者它可以是例如基本上平面的热管。

公开(公告)号：USRE34179E

公开(公告)日：1993-02-16

申请号：US538932

申请日：1990-06-15

Applicant: Larry E. Eccleston

Inventor： Larry E. Eccleston

IPC: G05D23/24 ,  H01L25/16 ,  H05K1/02 ,  H05K1/03 ,  H05K1/14 ,  H05K1/16

CPC classification number: H01L25/167 ,  G05D23/1919 ,  G05D23/24 ,  H05K1/0212 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/144 ,  H05K1/167 ,  H05K2201/043 ,  H05K2201/10151 ,  H05K2203/1115 ,  H05K2203/1581 ,  H05K2203/165

Abstract: A hybrid circuit structure includes an electrical circuit and a heating circuit therefor, both mounted on a single substrate. Valuable substrate space is saved by mounting the electrical circuit components on one surface of the substrate and the heating circuit elements on the opposite surface. A temperature control circuit is included, preferably mounted on the same surface as the electrical circuit components. Precision resistors for gain control and other functions may be provided on a separate substrate which may be mounted directly to the single substrate or to a separator therebetween. The precision resistors are in thermal contact with the temperature controlled heating circuit, thereby further increasing the stability of the circuit.

公开(公告)号：US4449769A

公开(公告)日：1984-05-22

申请号：US387497

申请日：1982-06-11

Applicant: Mikio Kobayashi ,  Kingo Kuritani

Inventor： Mikio Kobayashi ,  Kingo Kuritani

IPC: H05K3/34 ,  H05K1/03 ,  H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H05K3/40

CPC classification number: H05K1/145 ,  H05K1/184 ,  H05K3/305 ,  H05K1/036 ,  H05K2201/043 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2203/0191 ,  H05K2203/0195 ,  H05K2203/1189 ,  H05K3/4046 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913

Abstract: Two substrates carrying printed circuit patterns are coupled together back-to-back with an adhesive tape interposed therebetween. A plurality of holes are formed through the substrates, and apertures of small diameter are punched in the portions of the adhesive tape backing these holes. Electric components to be held to the substrate are then inserted through the holes punched in the adhesive tape and soldered firmly into portion by an automatic soldering apparatus.

Abstract translation: 携带印刷电路图案的两个基板被背对背地连接在一起。 通过基板形成多个孔，并且在这些孔背面的胶带的部分中冲压小直径的孔。 然后将被保持在基板上的电气部件插入穿过胶带的孔中，并通过自动焊接装置牢固地焊接到部分中。