公开(公告)号：US20040088416A1

公开(公告)日：2004-05-06

申请号：US10602737

申请日：2003-06-25

申请人： Matsushita Electric Industrial Co., Ltd.

发明人： Seiichi Nakatani ,  Kouichi Hirano

IPC分类号： G06F015/173

CPC分类号： H05K1/187 ,  G06F17/3089 ,  H01L21/56 ,  H01L23/145 ,  H01L23/3121 ,  H01L25/0652 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/19041 ,  H01L2924/3025 ,  H04L69/329 ,  H05K1/188 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0209 ,  H05K2201/10378 ,  Y10S428/901 ,  Y10T156/109 ,  Y10T428/24893 ,  Y10T428/24917 ,  H01L2924/00

摘要： A circuit component built-in module of the present invention includes an insulating substrate formed of a mixture comprising 70 wt % to 95 wt % of an inorganic filler and a thermosetting resin, a plurality of wiring patterns formed on at least a principal plane of the insulating substrate, a circuit component arranged in an internal portion of the insulating substrate and electrically connected to the wiring patterns, and an inner via formed in the insulating substrate for electrically connecting the plurality of wiring patterns. Thus, a highly reliable circuit component built-in module having high-density circuit components can be obtained.

摘要翻译： 本发明的电路部件内置模块包括由包含70重量％至95重量％的无机填料和热固性树脂的混合物形成的绝缘基板，形成在至少一个主面上的多个布线图案 绝缘基板，布置在所述绝缘基板的内部部分中并电连接到所述布线图案的电路部件，以及形成在所述绝缘基板中的用于电连接所述多个布线图案的内部通孔。 因此，可以获得具有高密度电路部件的高可靠性的电路部件内置模块。

公开(公告)号：US20040047118A1

公开(公告)日：2004-03-11

申请号：US10415267

申请日：2003-04-28

发明人： Eduard Bergmann ,  Herwie Rilling ,  Peter Westermayr ,  Clemens Hofbauer ,  Boris Klebensberger ,  Karsten Wambach

IPC分类号： H05K005/00

CPC分类号： H05K3/202 ,  H01L31/02013 ,  H01R13/24 ,  H01R13/665 ,  H01R43/24 ,  H02S40/34 ,  H02S40/345 ,  H05K1/187 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/10651 ,  Y02E10/50 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49169 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/53174 ,  Y10T29/53209 ,  Y10T29/53265

摘要： An arrangement comprising a panel-like electrical/electronic module 7 having a flat surface with openly contactable connecting sections AS as part of an essentially flat printed conductor structure for the electrical connection of the module 7, and comprising a connection unit 1 having electrical/electronic elements D located on a printed conductor structure 2 situated in a plane parallel to the printed conductor structure of the module 7 and provided with means for contacting connecting sections of the module, so that the module is electrically connectable via the connection unit, characterized in that the means for contacting the connecting sections AS of the module 7 are bent out from the plane of the printed conductor structure 2, and a portion of the connecting sections AA representing the printed conductor structure and the connecting sections AS of the module 7 are rigid electrical conductor sections AS which can be bent out of the plane of the printed conductor structure of the module 7, the connecting sections AA of the connection unit 1 being situated corresponding to the arrangement of the connecting sections AS of the module 7, so that for the connection unit 1 connected to the module 7, each connecting section AS of the module 7 is electrically connected to a connecting section of the connection unit 1 and these adjoin one another in one section, and in this adjoining region are situated in a different spatial position than that of the planes of the printed conductor structures 2. The invention further relates to a connection unit for such an arrangement, and to a method of producing such an arrangement. The invention further relates to a method of joining a connection unit to a panel-like module for producing such an arrangement, and to a device for joining a connection unit to a panel-like module for manufacturing such an arrangement.

摘要翻译： 一种包括具有平坦表面的面板式电气/电子模块7的装置，其具有可开放接触的连接部分AS，作为用于模块7的电连接的基本平坦的印刷导体结构的一部分，并且包括具有电气/电子的连接单元1 元件D位于印刷导体结构2上，位于与模块7的印刷导体结构平行的平面中，并且设置有用于接触模块的连接部分的装置，使得模块经由连接单元可电连接，其特征在于： 用于接触模块7的连接部分AS的装置从印刷导体结构2的平面弯曲出来，代表印刷导体结构的连接部分AA的一部分和模块7的连接部分AS是刚性电气 导体部分AS可以弯曲出印刷导体结构的平面 模块7，连接单元1的连接部分AA对应于模块7的连接部分AS的布置，使得对于连接到模块7的连接单元1，模块7的每个连接部分AS是 电连接到连接单元1的连接部分，并且它们在一个部分中彼此相邻，并且在该邻接区域处于与印刷的导体结构2的平面的空间位置不同的空间位置。本发明还涉及 用于这种布置的连接单元，以及制造这种布置的方法。 本发明还涉及将连接单元连接到用于制造这种布置的面板状模块的方法，以及用于将连接单元连接到用于制造这种布置的面板状模块的装置。

公开(公告)号：US20030223205A1

公开(公告)日：2003-12-04

申请号：US10400194

申请日：2003-03-26

发明人： Ralf Jaklin ,  Werner Wallrafen

IPC分类号： H05K007/02 ,  H05K007/06 ,  H05K007/08 ,  H05K007/10

CPC分类号： H05K3/202 ,  B29C45/14639 ,  B29C45/14836 ,  G01P1/026 ,  H05K1/187 ,  H05K5/064 ,  H05K2201/0382 ,  H05K2201/062 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2201/2009

摘要： The subject-matter of the invention is a method of producing an electronic device, with a stamped sheet-metal part loaded with electronic components being encapsulated in a thermoplastic, insulating material to provide protection against environmental influences, and also an electronic device comprising electronic components arranged on a stamped sheet-metal part and electrically connected to one another by said part, the stamped sheet-metal part and the electronic components being encapsulated in a thermoplastic, insulating material by the injection-molding process. To provide a device with which protection of the electronic components during encapsulation is ensured, the stamped sheet-metal part (2) has at least one region (3) similar to a protective shield, under which the electronic components are arranged, and the electronic components (4) are arranged downstream of the stamped sheet-metal part (2) in the direction of injection pressure (9) of the heated, thermoplastic, insulating material (5).

摘要翻译： 本发明的主题是制造电子装置的方法，其中装有电子部件的冲压的金属板部件被封装在热塑性绝缘材料中以提供防止环境影响的保护，以及包括电子部件的电子装置 布置在冲压的金属板上并通过所述部分彼此电连接，冲压的金属板部件和电子部件通过注射成型工艺封装在热塑性绝缘材料中。 为了提供确保在封装期间对电子部件进行保护的装置，冲压的金属板部件（2）具有至少一个类似于保护屏蔽的区域（3），电子部件布置在该保护屏蔽下，电子部件 部件（4）沿被加热的热塑性绝缘材料（5）的注射压力（9）的方向布置在冲压的金属板部分（2）的下游。

公开(公告)号：US6038133A

公开(公告)日：2000-03-14

申请号：US196792

申请日：1998-11-20

申请人： Seiichi Nakatani ,  Kouichi Hirano

发明人： Seiichi Nakatani ,  Kouichi Hirano

IPC分类号： G06F17/30 ,  H01L21/56 ,  H01L23/14 ,  H01L23/31 ,  H01L25/065 ,  H01L25/10 ,  H04L29/08 ,  H05K1/18 ,  H05K3/20 ,  H05K3/40 ,  H05K3/46 ,  H05K1/03

CPC分类号： H05K1/187 ,  G06F17/3089 ,  H01L21/56 ,  H01L23/145 ,  H01L23/3121 ,  H01L25/0652 ,  H01L25/105 ,  H01L25/16 ,  H04L69/329 ,  H05K1/188 ,  H05K3/4617 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K2201/0209 ,  H05K2201/10378 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4652 ,  H05K3/4658 ,  Y10S428/901 ,  Y10T156/109 ,  Y10T428/24893 ,  Y10T428/24917

摘要： A circuit component built-in module of the present invention includes an insulating substrate formed of a mixture comprising 70 wt % to 95 wt % of an inorganic filler and a thermosetting resin, a plurality of wiring patterns formed on at least a principal plane of the insulating substrate, a circuit component arranged in an internal portion of the insulating substrate and electrically connected to the wiring patterns, and an inner via formed in the insulating substrate for electrically connecting the plurality of wiring patterns. Thus, a highly reliable circuit component built-in module having high-density circuit components can be obtained.

公开(公告)号：US2399753A

公开(公告)日：1946-05-07

申请号：US52628644

申请日：1944-03-13

申请人： INT STANDARD ELECTRIC CORP

发明人： MCLARN ERNEST S

IPC分类号： H01R9/28 ,  H05K1/18 ,  H05K3/20 ,  H05K3/32

CPC分类号： H01R9/28 ,  H05K1/187 ,  H05K3/202 ,  H05K3/328 ,  H05K2201/10318 ,  H05K2203/1115 ,  H05K2203/175 ,  Y10T29/49156

公开(公告)号：US09872393B2

公开(公告)日：2018-01-16

申请号：US14886581

申请日：2015-10-19

申请人： Avary Holding (Shenzhen) Co., Limited ,  HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  GARUDA TECHNOLOGY CO., LTD.

发明人： Tzu-Chien Yeh

IPC分类号： H01K3/10 ,  H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H05K1/09 ,  H05K1/03 ,  H05K3/18 ,  H05K3/46 ,  H05K3/40

CPC分类号： H05K1/184 ,  H05K1/0298 ,  H05K1/0313 ,  H05K1/092 ,  H05K1/111 ,  H05K1/115 ,  H05K1/187 ,  H05K3/0097 ,  H05K3/188 ,  H05K3/4038 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/0203 ,  H05K2201/0391 ,  H05K2201/09545 ,  H05K2203/0278 ,  H05K2203/122 ,  H05K2203/1536 ,  Y10T29/49165

摘要： A circuit board includes a core layer, at least one passive component, a first and a second conductive wire layers, at least one contact pad, and a resin packing layer. The core layer defines at least one through hole to receive the passive component. The first and the second conductive wire layers are connected to two opposite surfaces of the core layer. Each contact pad is positioned between and connected to one passive component and the first conductive wire layer. The resin packing layer is filled among the core layer, each passive component, each contact pad, the first and the second conductive wire layers. The resin packing layer can connect the first and the second conductive wire layers to the core layer, and connect the core layer, each passive component, and each contact pads to each other.

公开(公告)号：US20170171986A1

公开(公告)日：2017-06-15

申请号：US15374233

申请日：2016-12-09

申请人： Invensas Corporation

发明人： Tomoo Iijima ,  Yoshitaka Fukuoka

IPC分类号： H05K3/40 ,  H01L23/00 ,  H05K3/46 ,  H01L23/498 ,  H05K1/16 ,  H05K1/03

CPC分类号： H05K3/4007 ,  H01L23/498 ,  H01L23/49833 ,  H01L24/19 ,  H01L2924/14 ,  H05K1/0393 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K1/182 ,  H05K1/187 ,  H05K1/189 ,  H05K3/06 ,  H05K3/205 ,  H05K3/46 ,  H05K3/4614 ,  H05K3/4635 ,  H05K3/4652 ,  H05K2201/0367 ,  H05K2203/0384 ,  Y10T29/49155 ,  H01L2924/00

摘要： An electronic assembly is disclosed that includes a flexible insulating film, a semiconductor component that has a thickness of less than 50 micrometers, a conductive interconnect extending through the flexible insulating film, a second patterned metal wiring film adjacent, and a third patterned metal wiring film. The second patterned metal wiring film is electrically coupled with the third patterned metal wiring film through the conductive interconnect. The semiconductor component is coupled to the first patterned metal wiring film and at least one of the second patterned metal wiring film or the third patterned metal wiring film.

公开(公告)号：US09668351B2

公开(公告)日：2017-05-30

申请号：US14686785

申请日：2015-04-15

申请人： Subtron Technology Co., Ltd.

发明人： Chao-Min Wang

IPC分类号： H05K3/00 ,  H05K1/18 ,  H01L23/498 ,  H01L21/683 ,  H01L21/48

CPC分类号： H05K1/187 ,  B32B2439/00 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/49822 ,  H01L2221/68318 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2924/0002 ,  H05K3/007 ,  H01L2924/00

摘要： A manufacturing method of a package carrier is provided. A carrier having a connecting surface is provided. A releasable solder resist layer is formed on the connecting surface of the carrier and completely covers the connecting surface. A substrate having an upper surface and a lower surface opposite to each other is provided. A first patterned solder resist layer is formed on the lower surfaces of the substrate and exposes a portion of the lower surface. The carrier and the substrate are laminated, the releasable solder resist layer directly contacts the first patterned solder resist layer, and the carrier is temporarily bonded to the first patterned solder resist layer through the releasable solder resist layer.

公开(公告)号：US20170091517A1

公开(公告)日：2017-03-30

申请号：US14991550

申请日：2016-01-08

申请人： J-METRICS TECHNOLOGY Co., Ltd.

发明人： Wei-Ting Lin

IPC分类号： G06K9/00 ,  H05K1/18 ,  H05K3/32

CPC分类号： G06K9/00053 ,  G06K9/0004 ,  H05K1/181 ,  H05K1/187 ,  H05K3/32 ,  H05K2201/10151 ,  H05K2203/1305

摘要： A fingerprint sensor packaging module includes a light-pervious cover layer, a conductive pattern layer on the light-pervious cover layer, a finger sensing chip on the conductive pattern layer, a circuit board on the light-pervious cover layer, and a package member. The conductive pattern layer includes a plurality of pads. The fingerprint sensing chip is electrically connected to the conductive pattern layer by contacting to the pads. The circuit board is electrically connected to the conductive pattern layer and has a hole and the hole exposes the fingerprint sensing chip. The fingerprint sensing chip is disposed in the hole. The package member disposed in the hole and at least cover the fingerprint sensing chip.

公开(公告)号：US09491865B1

公开(公告)日：2016-11-08

申请号：US14695057

申请日：2015-04-24

申请人： Unimicron Technology Corp.

发明人： Yin-Ju Chen ,  Ming-Hao Wu ,  Cheng-Po Yu

IPC分类号： H01L35/30 ,  H05K1/18 ,  H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H05K3/30 ,  H05K3/40

CPC分类号： H05K3/4647 ,  G06F1/206 ,  H01L23/12 ,  H01L23/13 ,  H01L23/4275 ,  H01L23/49827 ,  H01L35/30 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/15153 ,  H01L2924/15313 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/113 ,  H05K1/14 ,  H05K1/181 ,  H05K1/185 ,  H05K1/187 ,  H05K3/36 ,  H05K3/4697 ,  H05K2201/048 ,  H05K2201/10219 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10734

摘要： A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.

摘要翻译： 具有热恢复功能的电路板包括基板，储热装置和热电装置。 储热装置嵌入在基板中并与处理器连接，以与处理器进行热交换。 嵌入在基板中的热电装置包括第一金属结表面和第二金属结表面。 第一金属接合面与蓄热装置连接，与蓄热装置进行热交换。 第二金属结表面与第一金属结表面接合，其中热电装置通过第一金属接合表面和第二金属结表面之间的温度差产生电位。