公开(公告)号：US06939735B2

公开(公告)日：2005-09-06

申请号：US10235102

申请日：2002-09-05

申请人： John W. Smith ,  Mitchell Koblis

发明人： John W. Smith ,  Mitchell Koblis

IPC分类号： H01L23/31 ,  H01L23/498 ,  H01R12/57 ,  H01L21/48 ,  H01L21/302 ,  H01L21/44 ,  H01L23/48 ,  H01L23/52

CPC分类号： H01L23/49816 ,  H01L23/3114 ,  H01L23/4985 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48472 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/19107 ,  H01L2924/3025 ,  Y10T29/49126 ,  Y10T29/49144 ,  H01L2924/00014

摘要： A first microelectronic element is provided with leads having anchor ends connected to contacts and tip ends moveable with respect to the first microelectronic element. The leads can be provided on a carrier sheet that is assembled to the first microelectronic element, or may be formed in situ on the surface of the first element. The leads may be unitary strips of a conductive material, and the anchor ends of the leads may be bonded to the contacts of the first microelectronic element by processes such as thermosonic or ultrasonic bonding. Alternatively, stub leads may be provided on a separate carrier sheet or formed in situ on the front surface of the first microelectronic element, and these stub leads may be connected by wire bonds to the contacts of the first microelectronic element so as to form composite leads. The tip ends of the leads are joined to a second microelectronic element that is moved away from the first microelectronic element so as to deform the leads.

公开(公告)号：US06821815B2

公开(公告)日：2004-11-23

申请号：US10353737

申请日：2003-01-29

申请人： John W. Smith ,  Joseph Fjelstad

发明人： John W. Smith ,  Joseph Fjelstad

IPC分类号： H01L2144

CPC分类号： H01L23/3107 ,  H01L21/56 ,  H01L24/37 ,  H01L24/40 ,  H01L24/73 ,  H01L24/81 ,  H01L24/84 ,  H01L24/92 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/4024 ,  H01L2224/92122 ,  H01L2224/84 ,  H01L2924/00014

摘要： A method of encapsulating a microelectronic assembly comprises providing a microelectronic assembly having an element defining exterior surfaces and an array of terminals exposed at the exterior surfaces. The element defines an aperture through the exterior surfaces. A layer of a curable barrier material is screen printed onto a supporting element. The supporting element is assembled with the microelectronic assembly so that the layer of curable barrier material contacts the exterior surfaces and covers said one or more apertures. An encapsulant is applied to the microelectronic assembly.

摘要翻译： 封装微电子组件的方法包括提供具有限定外表面的元件和暴露在外表面处的端子阵列的微电子组件。 该元件通过外表面限定孔。 将一层可固化的阻挡材料丝网印刷到支撑元件上。 支撑元件与微电子组件组装，使得可固化阻挡材料层与外表面接触并覆盖所述一个或多个孔。 将密封剂施加到微电子组件。

公开(公告)号：US06518662B1

公开(公告)日：2003-02-11

申请号：US09713527

申请日：2000-11-15

申请人： John W. Smith ,  Joseph Fjelstad

发明人： John W. Smith ,  Joseph Fjelstad

IPC分类号： H01L2334

CPC分类号： H01L23/3107 ,  H01L21/56 ,  H01L24/37 ,  H01L24/40 ,  H01L24/73 ,  H01L24/81 ,  H01L24/84 ,  H01L24/92 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/4024 ,  H01L2224/92122 ,  H01L2224/84 ,  H01L2924/00014

摘要： A method of encapsulating a microelectronic assembly comprises providing a microelectronic assembly having an element defining exterior surfaces and an array of terminals exposed at the exterior surfaces. The element defines an aperture through the exterior surfaces. A layer of a curable barrier material is screen printed onto a supporting element. The supporting element is assembled with the microelectronic assembly so that the layer of curable barrier material contacts the exterior surfaces and covers said one or more apertures. An encapsulant is applied to the microelectronic assembly.

摘要翻译： 封装微电子组件的方法包括提供具有限定外表面的元件和暴露在外表面处的端子阵列的微电子组件。 该元件通过外表面限定孔。 将一层可固化的阻挡材料丝网印刷到支撑元件上。 支撑元件与微电子组件组装，使得可固化阻挡材料层与外表面接触并覆盖所述一个或多个孔。 将密封剂施加到微电子组件。

公开(公告)号：US06294040B1

公开(公告)日：2001-09-25

申请号：US08879922

申请日：1997-06-20

申请人： Kurt Raab ,  John W. Smith

发明人： Kurt Raab ,  John W. Smith

IPC分类号： B32B3100

CPC分类号： H01L21/6835 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/4985 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/8319 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802

摘要： A method for making a microelectronic package includes providing first and second microelectronic elements having electrically conductive parts, juxtaposing the first and second microelectronic elements with one another, bonding electrically conductive parts of the microelectronic elements together to form electrical interconnection, providing a resilient element having one or more tacky surface regions in contact with one or more liners separately from the first and second microelectronic elements, assembling the resilient element with at least one of said microelectronic elements, and removing the resilient element from the one or more liners prior to the juxtaposing step so that the resilient element is disposed between the microelectronic elements after the juxtaposing and bonding steps. In other embodiments, the method of making a microelectronic package includes providing a resilient element having one or more tacky surface regions separately from the first and second microelectronic elements, and assembling the resilient elements with at least one of the microelectronic elements prior to the juxtaposing step so that the resilient element is disposed between the microelectronic elements after the juxtaposing and bonding steps, wherein the step of assembling the resilient element with at least one of the microelectronic elements is performed less than 24 hours prior to the bonding step. In certain embodiments the resilient elements include an adhesive at one or more tacky surface regions thereof. In other embodiments, the resilient elements include partially-cured surfaces at the one or more tacky surface regions. Also disclosed is a method of fabricating a resilient element of a microelectronic package having one or more tacky surface regions. The method includes the steps of providing a first liner, providing a mass of a curable material on the liner, and curing the mass so that a region of the mass in contact with the liner is tacky.

公开(公告)号：US06228686B1

公开(公告)日：2001-05-08

申请号：US09140589

申请日：1998-08-26

申请人： John W. Smith ,  Joseph Fjelstad

发明人： John W. Smith ,  Joseph Fjelstad

IPC分类号： H01L2144

CPC分类号： H01L23/3107 ,  H01L23/49572 ,  H01L24/01 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/3011 ,  H01L2924/00

摘要： A sheet such as a polymeric dielectric has elongated lead regions partially separated from the main region of the sheet by gaps in the sheet, and has conductors extending along the lead regions. The lead regions are connected to contacts on a microelectronic element, and the microelectronic element is moved away from the main region of the sheet, thereby bending the lead regions downwardly to form leads projecting from the main region of the sheet.

摘要翻译： 诸如聚合物电介质的片材具有通过片材中的间隙与片材的主要区域部分地分离的细长引线区域，并且具有沿引线区域延伸的导体。 引线区域连接到微电子元件上的触点，并且微电子元件移动离开片材的主要区域，从而将引线区域向下弯曲以形成从片材的主要区域突出的引线。

公开(公告)号：US5808874A

公开(公告)日：1998-09-15

申请号：US641698

申请日：1996-05-02

申请人： John W. Smith

发明人： John W. Smith

IPC分类号： H01L21/56 ,  H01L23/055 ,  H01L23/48 ,  H01L23/485 ,  H01L23/498 ,  H05K1/09 ,  H01R3/08 ,  H01R4/00 ,  H05K1/11

CPC分类号： H01L24/10 ,  H01L21/563 ,  H01L23/055 ,  H01L23/48 ,  H01L23/49816 ,  H01L24/13 ,  H01L2224/02333 ,  H01L2224/0401 ,  H01L2224/13 ,  H01L2224/13022 ,  H01L2224/14181 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/17051 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/8192 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T29/49126 ,  Y10T29/49135 ,  Y10T29/49144 ,  Y10T29/49146

摘要： A microelectronic assembly including elements such as a semiconductor chip and substrate has electrical connections between the elements incorporating fusible conductive metal masses. The fusible masses are surrounded and contained by a compliant material such as an elastomer or gel. The fusible material may melt during operation or processing of the device to relieve thermal cycling stress in the electrical connections.

公开(公告)号：US5164145A

公开(公告)日：1992-11-17

申请号：US595039

申请日：1990-10-10

申请人： John W. Smith

发明人： John W. Smith

IPC分类号： C21D9/00 ,  C23C8/20 ,  F27B9/04 ,  F27B9/06 ,  F27B9/16 ,  F27B9/18

CPC分类号： C21D9/0037 ,  C23C8/20 ,  F27B9/045 ,  F27B9/068 ,  F27B9/16

摘要： A rotary oil seal gas purge system for a rotary carburizing furnace, having a rotatable hearth in a furnace chamber containing a high carbon-potential furnace atmosphere comprising an endothermic carrier gas enriched with a hydrocarbon gas, features gas purge ports located adjacent to the oil seal(s) of the hearth for injecting non-carbon-enriched endothermic gas to purge the high carbon-potential furnace atmosphere from the area adjacent the seal(s) and prevent carbon precipitation into the seal(s). Also disclosed is an oil seal management system for a rotary carburizing furnace including a settling tank for accepting seal oil from the furnace oil seal(s), a pump supply tank for receiving oil from the settling tank, a pump for pumping oil from the pump supply tank through a heat exchanger and to the furnace oil seal(s), and a centrifuge for cleaning seal oil coming from the heat exchanger before returning it to the pump supply tank.

公开(公告)号：US5030672A

公开(公告)日：1991-07-09

申请号：US593390

申请日：1990-10-01

申请人： Richard A. Hann ,  David R. Holmes ,  John W. Smith

发明人： Richard A. Hann ,  David R. Holmes ,  John W. Smith

IPC分类号： C08J5/18 ,  B01D65/10 ,  B01D67/00 ,  B01D71/68 ,  B01D71/82 ,  C08G65/48 ,  C08J3/09

CPC分类号： C08J3/095 ,  B01D67/0011 ,  B01D69/02 ,  B01D71/68 ,  C08G65/48 ,  B01D2323/08 ,  B01D2323/12 ,  B01D2323/30 ,  C08J2381/06

摘要： An asymmetric membrane formed from a sulphonated polyarylethersulphone has a salt rejection of at least 99%. Alternatively, a membrane has a good salt rejection and an acceptable water flux such that the ratio ##EQU1## has the value of at least 0.7. The membranes can be obtained using barium salts of the sulphonated polyarylethersulphone, with the proportion of barium being controlled to be at least 85%, preferably at least 86%, and not more than 91%, preferably not more than 90% of the barium required to react with the sulphonic acid groups on the sulphonated polymer.

公开(公告)号：US5016860A

公开(公告)日：1991-05-21

申请号：US472978

申请日：1990-01-31

申请人： John W. Smith

发明人： John W. Smith

IPC分类号： C21D1/63 ,  C21D9/00

CPC分类号： C21D1/63 ,  C21D9/0018

摘要： Disclosed is a part-handling apparatus for a heat-treating furnace system and its use in transferring parts such as bearing races into, through, and out of a quench tank while avoiding any part-to-part contact and thus preventing nicking of parts. The apparatus includes a charge elevator formed of closely-spaced rails divided into lanes and which lowers parts into a quench fluid. A walking beam system for moving parts along the tank has movable rails which mesh with stationary rails and with the rails of the charge and discharge elevators when the elevators are located in their lowermost positions and includes a frame which is movable vertically and longitudinally. A push-off device near the tank discharge end pushes parts from the discharge elevator either directly onto an in-line conveyor of a washer or tempering furnace or onto a rotatable arm which alters the travel path of the parts a selected angle such as 90 degrees before delivering the parts to the conveyor of the washer to temper furnace.

摘要翻译： 公开了一种用于热处理炉系统的部件处理装置及其用于将诸如轴承座之类的部件转移到通过和从淬火罐中排出的部件，同时避免任何部件间接触，从而防止部件的切口。 该装置包括一个充电电梯，其形成为分隔成通道的紧密间隔的导轨，并且将部件降低成骤冷流体。 用于沿着罐移动部件的步进梁系统具有当电梯位于其最低位置时与静止轨道和充放电电梯的轨道啮合的活动导轨，并且包括可垂直和纵向移动的框架。 罐排出端附近的推出装置将排出电梯的部件直接推入洗衣机或回火炉的直列式输送机或旋转臂上，该可旋转臂改变部件的行进路径，例如90度 在将零件交付给洗衣机的输送机以回火炉之前。

公开(公告)号：US4714725A

公开(公告)日：1987-12-22

申请号：US35235

申请日：1987-04-06

申请人： Brian N. Hendy ,  John W. Smith

发明人： Brian N. Hendy ,  John W. Smith

IPC分类号： C08L71/00 ,  B01D67/00 ,  B01D71/52 ,  B01D71/82 ,  C08J3/09 ,  C08K5/15 ,  C08L71/04

CPC分类号： C08J3/091 ,  B01D67/0011 ,  B01D67/0016 ,  B01D69/02 ,  B01D71/52 ,  B01D2325/022 ,  C08J2371/00

摘要： Solutions of sulphonated polyaryletherketones in a solvent mixture of at least three liquids or low melting solids which are non-solvents or poor solvents for the polymer, can be used to produce asymmetric semi-permeable membranes. The polymer may be a polymer of(Ph.sup.1 --O--Ph.sup.2 --O--Ph.sup.1 --CO)and optionally(Ph.sup.1 --O--Ph.sup.1 --CO)and(Ph.sup.1 --O--Ph.sup.1 --O--Ph.sup.1 --CO)wherein Ph.sup.1 and Ph.sup.2 are respectively unsulphonated and sulphonated phenylene residues. The components of the solvent mixture have specified solubility parameters. A suitable solvent mixture is one formed from water, 1,4-dioxane and acetonitrile.

摘要翻译： 磺化聚芳醚酮在至少三种液体或低熔点固体的溶剂混合物中的溶液，其为非溶剂或聚合物的不良溶剂，可用于制备不对称半透膜。 聚合物可以是（Ph1-O-Ph2-O-Ph1-CO）和任选的（Ph1-O-Ph1-CO）和（Ph1-O-Ph1-O-Ph1-CO）的聚合物，其中Ph1和Ph2是 分别为未磺化和磺化的亚苯基残基。 溶剂混合物的组分具有规定的溶解度参数。 合适的溶剂混合物是由水，1,4-二恶烷和乙腈形成的混合物。