知搜-全球专利检索

  1. 登录
  2. 注册

搜索结果

133 条记录 (耗时 0.023 秒)

    Method of adhering polishing pads and jig for adhering the same
    91.
    发明授权
    Method of adhering polishing pads and jig for adhering the same 失效
    粘贴抛光垫的方法和用于粘附抛光垫的夹具

    公开(公告)号：US07278907B2

    公开(公告)日：2007-10-09

    申请号：US11514180

    申请日：2006-09-01

    申请人： Yoshio Nakamura ,  Harumichi Koyama

    发明人： Yoshio Nakamura ,  Harumichi Koyama

    IPC分类号： B24B1/00

    CPC分类号： B24D9/085 ,  B24B37/08

    摘要： The method of adhering polishing pads is capable of easily adhering the polishing pads without damages. The method comprises the steps of: tentatively adhering the polishing pads to polishing plates; attaching a roller unit having a shaft and a roller member, which is capable of rotating about the shaft and which has a projected section having a prescribed width and spirally formed in an outer circumferential face, on the lower polishing plate in the radial direction; moving the upper polishing plate downward, by the holding unit, until the upper polishing plate contacts the roller member; and simultaneously adhering the polishing pads onto the upper and lower polishing plate by rotating the upper and polishing plates in the opposite directions at the same speed with pressing the roller member by the upper polishing plate.

    摘要翻译： 粘附抛光垫的方法能够容易地粘附抛光垫而不损坏。 该方法包括以下步骤：暂时将抛光垫粘附到抛光板上; 将具有轴和滚子构件的滚子单元沿径向方向安装在下抛光板上，该滚子单元能够围绕轴线旋转并具有规定宽度的突出部分并在外周面上螺旋形成; 通过保持单元向下移动上抛光板，直到上抛光板接触辊构件; 并且通过用上部抛光板按压辊构件以相同的速度旋转上部抛光板和抛光板，同时将抛光垫粘附到上部和下部抛光板上。

    Method of assembling grommet and jig for assembling grommet
    93.
    发明授权
    Method of assembling grommet and jig for assembling grommet 有权
    组装索环的组装方法

    公开(公告)号：US07039998B2

    公开(公告)日：2006-05-09

    申请号：US10736774

    申请日：2003-12-17

    申请人： Yoshio Nakamura

    发明人： Yoshio Nakamura

    IPC分类号： B23Q3/00 ,  B23Q7/00

    CPC分类号： B25B27/28 ,  H02G1/14 ,  H02G15/013 ,  Y10T29/49895 ,  Y10T29/49998 ,  Y10T29/53961

    摘要： A method of assembling a grommet, comprising the steps of: providing a grommet assembling jig which has a mounting portion and a guide portion; providing a first division body which has a seal portion; providing a second division body which has a fixing portion, the first division body and the second division body constituting the grommet; mounting the first division body on the grommet assembling jig so that the seal portion is fitted on the mounting portion; arranging a wire harness on the first division body; and assembling the second division body with the first division body by guiding the guide portion to the fixing portion.

    摘要翻译： 一种组装护环的方法，包括以下步骤：提供具有安装部分和引导部分的索环组装夹具; 提供具有密封部分的第一分割体; 提供具有固定部分的第二分割体，构成索环的第一分割体和第二分割体; 将第一分割体安装在索环组装夹具上，使得密封部分装配在安装部分上; 将线束布置在第一分割体上; 以及通过将所述引导部引导到所述固定部，将所述第二分割体与所述第一分割体组装。

    Vehicle-mounted noise control apparatus
    94.
    发明授权
    Vehicle-mounted noise control apparatus 有权
    车载噪音控制装置

    公开(公告)号：US06891954B2

    公开(公告)日：2005-05-10

    申请号：US09819718

    申请日：2001-03-29

    申请人： Akira Takahashi ,  Toshio Inoue ,  Tsuyoshi Yamashita ,  Hisashi Sano ,  Kenichi Terai ,  Hiroyuki Hashimoto ,  Isao Kakuhari ,  Yoshio Nakamura

    发明人： Akira Takahashi ,  Toshio Inoue ,  Tsuyoshi Yamashita ,  Hisashi Sano ,  Kenichi Terai ,  Hiroyuki Hashimoto ,  Isao Kakuhari ,  Yoshio Nakamura

    IPC分类号： B60R11/02 ,  G10K11/178 ,  H04B1/08 ,  H04R3/00 ,  A61F11/06 ,  H04B1/00 ,  H04R29/00 ,  H03G3/20

    CPC分类号： H04B1/082 ,  G10K11/178

    摘要： In an active noise control apparatus in which an audio signal and a noise control signal are mixed to thereby sound a loudspeaker inside a motor vehicle, a general-purpose audio head unit cannot conventionally be freely changed for the one already mounted on the motor vehicle. As a solution, an active noise control unit is provided with a buffer amplifier and a mixer. An audio signal amplified by a power amplifier in an audio head unit is adjusted in level by the buffer amplifier such that a level of an audio signal outputted after amplification by the first amplifier becomes substantially equal to a level of the audio signal outputted from the audio head unit. Then, at the mixer, a noise control signal outputted from an active noise controller is added to an audio signal outputted from the buffer amplifier. Therefore, any audio head unit can be freely changed for the one already mounted on the vehicle as long as the audio head unit contains therein a power amplifier.

    摘要翻译： 在其中混合有音频信号和噪声控制信号从而在汽车内部发出扬声器的有源噪声控制装置中，通用音频头单元对于已经安装在机动车辆上的扬声器通常不能自由地改变。 作为解决方案，主动噪声控制单元设置有缓冲放大器和混频器。 由音频头单元中的功率放大器放大的音频信号由缓冲放大器调节，使得由第一放大器放大后输出的音频信号的电平基本上等于从音频输出的音频信号的电平 头单位 然后，在混频器中，将从有源噪声控制器输出的噪声控制信号加到从缓冲放大器输出的音频信号中。 因此，只要音频头单元包含功率放大器，任何音频头单元可以自由地改变已经安装在车辆上的音频头单元。

    Method of cleaning abrasive plates of abrasive machine and cleaning device
    97.
    发明授权
    Method of cleaning abrasive plates of abrasive machine and cleaning device 失效
    清洗研磨机研磨板和清洗装置的方法

    公开(公告)号：US06807701B2

    公开(公告)日：2004-10-26

    申请号：US09992191

    申请日：2001-11-06

    申请人： Yasuhide Denda ,  Yoshio Nakamura ,  Yoshinobu Nishimoto ,  Makoto Nakajima ,  Tsuyoshi Hasegawa ,  Norihiko Moriya

    发明人： Yasuhide Denda ,  Yoshio Nakamura ,  Yoshinobu Nishimoto ,  Makoto Nakajima ,  Tsuyoshi Hasegawa ,  Norihiko Moriya

    IPC分类号： B08B1100

    CPC分类号： B24B37/08 ,  B08B3/024 ,  B08B15/04 ,  B08B2203/0229 ,  B24B53/017 ,  Y10S134/902

    摘要： The method of the present invention cleans abrasive faces of an upper abrasive plate and a lower abrasive plate of an abrasive machine. The method is executed by a cleaning device including: a nozzle for jetting water; a brush for preventing the jetted water from scattering in the air, the brush enclosing the nozzle; and another brush for closing a gap between the preventing brush and an outer edge of the upper abrasive plate, the method is characterized by the steps of: jetting water from the nozzle toward the abrasive face of the upper abrasive plate; moving the nozzle toward the outer edge of the upper abrasive plate; and closing the gap by the closing brush when the gap is formed between the preventing brush and the outer edge of the upper abrasive plate.

    摘要翻译： 本发明的方法清洗研磨机的上磨料板和下研磨板的磨料面。 该方法由清洁装置执行，该清洁装置包括：用于喷射水的喷嘴; 用于防止喷射水在空气中飞散的刷子，刷子包围喷嘴; 以及用于封闭防磨刷和上磨料板的外边缘之间的间隙的另一刷子，其特征在于以下步骤：从喷嘴向上磨料板的研磨面喷射水; 将喷嘴移向上磨料板的外边缘; 并且当在防磨刷和上磨料板的外边缘之间形成间隙时，通过闭合刷闭合间隙。

    Wafer abrasive machine
    98.
    发明授权
    Wafer abrasive machine 有权
    晶圆磨机

    公开(公告)号：US06692342B2

    公开(公告)日：2004-02-17

    申请号：US10081493

    申请日：2002-02-22

    申请人： Yoshio Nakamura ,  Tsuyoshi Hasegawa ,  Susumu Onishi

    发明人： Yoshio Nakamura ,  Tsuyoshi Hasegawa ,  Susumu Onishi

    IPC分类号： B24B2500

    CPC分类号： B24B37/30

    摘要： In the wafer abrasive machine of the present invention, a gravity center and a rotational axis of a wafer can be corresponded while abrading the wafer and a holding plate can be smoothly moved in a head member. The abrasive machine comprises: the head member including a concave section, in which the holding plate is accommodated; an elastic sheet member suspending the holding plate and being reinforced by a cloth-formed reinforcing member; a space for storing pressure fluid which pushes the holding plate toward the abrasive plate, the space being formed between the elastic sheet member and the concave section; and a plurality of spherical bodies being provided between an outer circumferential face of the holding plate and an inner circumferential face of the concave section, the spherical bodies simultaneously point-contact the both circumferential faces.

    摘要翻译： 在本发明的晶片研磨机中，在研磨晶片的同时可以使晶片的重心和旋转轴对应，并且保持板能够平滑地移动到头部构件中。 所述研磨机包括：所述头部构件包括凹部，所述保持板容纳在所述凹部中; 弹性片构件，其将所述保持板悬挂并由布形加强构件加强; 用于存储将所述保持板向研磨板推动的压力流体的空间，所述空间形成在所述弹性片构件和所述凹部之间; 并且在所述保持板的外周面与所述凹部的内周面之间设置有多个球状体，所述球状体同时与所述两个圆周面进行点接触。

    Polishing system for polishing wafer
    99.
    发明授权
    Polishing system for polishing wafer 失效
    抛光晶圆抛光系统

    公开(公告)号：US5908347A

    公开(公告)日：1999-06-01

    申请号：US838636

    申请日：1997-04-11

    申请人： Makoto Nakajima ,  Yoshio Nakamura ,  Yasuhide Denda ,  Toshihisa Yanagisawa ,  Toshiaki Seki ,  Satoru Arakawa ,  Masahiro Takeuchi ,  Mitsue Ogawa ,  Masanori Fukushima

    发明人： Makoto Nakajima ,  Yoshio Nakamura ,  Yasuhide Denda ,  Toshihisa Yanagisawa ,  Toshiaki Seki ,  Satoru Arakawa ,  Masahiro Takeuchi ,  Mitsue Ogawa ,  Masanori Fukushima

    IPC分类号： B23Q41/04 ,  B24B37/00 ,  B24B37/04 ,  B24B49/00

    CPC分类号： B24B37/345 ,  B23Q41/04

    摘要： In the polishing system of the present invention, a adhering unit adheres a wafer on a carrying plate using liquid. A polishing unit polishes the wafer using a polishing plate. A feeding unit conveys the carrying plate from the adhering unit to the polishing unit. A dismounting unit removes the wafer from the carrying plate. A first discharging unit conveys the carrying plate from the polishing unit to the dismounting unit. A cleaning unit cleans the vacant carrying plate. A second discharging unit conveys the carrying plate from the dismounting unit to the cleaning unit. A third discharging unit conveys the carrying plate from the cleaning unit to the adhering unit. The units are formed into a loop lines so that the carrying plate is circulated in the loop line and the wafers are polished therein.

    摘要翻译： 在本发明的抛光系统中，粘合单元使用液体将晶片粘附在承载板上。 抛光单元使用抛光板抛光晶片。 馈送单元将承载板从粘合单元传送到抛光单元。 拆卸单元从承载板上取下晶片。 第一排放单元将承载板从抛光单元传送到拆卸单元。 清洁单元清洁空载板。 第二排放单元将搬运单元从拆卸单元传送到清洁单元。 第三排放单元将承载板从清洁单元传送到粘附单元。 这些单元形成为环线，使得承载板在环线中循环并且晶片在其中被抛光。