公开(公告)号：US20100170953A1

公开(公告)日：2010-07-08

申请号：US12294658

申请日：2006-04-03

Applicant: Stephan Schaade

Inventor： Stephan Schaade

IPC: G06K19/077 ,  H05K7/00 ,  B23P19/00

CPC classification number: H05K1/0266 ,  H05K1/0293 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09927 ,  H05K2201/09936 ,  H05K2201/10098 ,  H05K2201/10159 ,  H05K2201/10212 ,  H05K2203/175 ,  Y10T29/49815

Abstract: The electronic module (BG) incorporates a specified separation edge (SAK, SAK1, SAK2, SAK3) for the mechanical, irreversible separation of a separable part (AT, AT1, AT2, AT3) of the module (BG) from the remainder of the module (BGR), both the separable part (AT, AT1, AT2, AT3) and the module remainder (BGR) incorporating essentially interacting circuit components (ST1, ST2) for an intended electrotechnical operation of the module (BG). By separating the separable part (AT, AT1, AT2, AT3) the electrotechnical operation of the module (BG) can be permanently deactivated.

Abstract translation: 电子模块（BG）包含用于将模块（BG）的可分离部分（AT，AT1，AT2，AT3）与其余部分（AT，AT1，AT2，AT3）的机械不可逆分离的指定分离边缘（SAK，SAK1，SAK2，SAK3） 模块（BGR），可分离部分（AT，AT1，AT2，AT3）和包含基本上相互作用的电路部件（ST1，ST2）的模块余量（BGR），用于模块（BG）的预期电工操作。 通过分离可分离部分（AT，AT1，AT2，AT3），模块（BG）的电工操作可以永久停用。

公开(公告)号：US20090101391A1

公开(公告)日：2009-04-23

申请号：US11999819

申请日：2007-12-06

Applicant: Christina Shu-Ming Yang ,  Feng Hu

Inventor： Christina Shu-Ming Yang ,  Feng Hu

IPC: H05K1/00 ,  H05K3/02

CPC classification number: H05K9/00 ,  H05K1/0266 ,  H05K3/064 ,  H05K2201/09781 ,  H05K2201/09927 ,  Y10T29/49155

Abstract: A circuit board having barcode and fabrication method thereof are disclosed. The method of the present invention includes the steps of providing a substrate body that has an insulation layer covered with a copper foil; forming a dry film on the copper foil; disposing a film having a circuit pattern and a barcode pattern on the dry film and performing an exposure process so as to harden portions of the dry film at positions corresponding to the circuit pattern and the barcode pattern; performing a development process such that non-hardened portions of the dry film are removed and portions of the dry film that are hardened are remained as an etch mask; and performing an etch process so as to remove portions of the copper foil that are exposed from the dry film. Thus, circuit and barcode are formed in the copper foil at the same time, thereby saving cost and eliminating time for manually attaching barcode.

Abstract translation: 公开了具有条形码及其制造方法的电路板。 本发明的方法包括提供具有被铜箔覆盖的绝缘层的基体的步骤; 在铜箔上形成干膜; 将具有电路图案和条形码图案的膜设置在干膜上并执行曝光处理，以使干膜的部分在与电​​路图案和条形码图形相对应的位置处硬化; 进行显影处理，使得去除干膜的未硬化部分，并且残留硬化部分的干膜作为蚀刻掩模; 并进行蚀刻处理以除去从干膜暴露出的部分铜箔。 因此，电路和条形码同时形成在铜箔中，从而节省了成本并消除了手动附加条形码的时间。

公开(公告)号：US20070220742A1

公开(公告)日：2007-09-27

申请号：US11467568

申请日：2006-08-28

Applicant: Kuang-Lin Lo ,  Yung-Hui Wang

Inventor： Kuang-Lin Lo ,  Yung-Hui Wang

IPC: H01R43/00 ,  G08B13/14 ,  G06K7/00

CPC classification number: H01R13/465 ,  H05K1/0266 ,  H05K1/0269 ,  H05K3/027 ,  H05K3/4644 ,  H05K2201/09781 ,  H05K2201/09927 ,  H05K2201/09936 ,  Y10T29/49117

Abstract: A method for fabricating an identification code is provided. First, a metallic film is provided for fabricating a circuit on a substrate, and a circuit area and a non-circuit area are formed on the metallic film after a patterning process. Next, an identification code is formed on the non-circuit area for the basis of production management and quality control.

Abstract translation: 提供了一种制造识别码的方法。 首先，在基板上设置用于制造电路的金属膜，并且在图案化工艺之后在金属膜上形成电路区域和非电路区域。 接下来，在生产管理和质量控制的基础上，在非电路区域上形成识别码。

公开(公告)号：US20050284941A1

公开(公告)日：2005-12-29

申请号：US10878963

申请日：2004-06-28

Applicant: Allen Lubow

Inventor： Allen Lubow

IPC: G06K7/10 ,  G06K19/06 ,  G06K19/077 ,  G06K19/08 ,  H05K1/02 ,  H05K1/16

CPC classification number: G06K19/07769 ,  G06K19/06018 ,  G06K19/07749 ,  G06K19/083 ,  H05K1/0266 ,  H05K1/165 ,  H05K2201/09781 ,  H05K2201/09927 ,  H05K2201/09936 ,  H05K2201/10098

Abstract: A communication system is provided that includes both an electromagnetic (“EM”) communication device and an optical communication device including at least a machine readable symbol where at least a portion of the EM communication device and at least a portion of the machine readable symbol are formed from the same material. This material may be, for example, a conductable ink or a conductable foil. If desired, the EM communication device may include an antenna where at least a portion of the antenna includes at least a portion of the machine readable symbol.

Abstract translation: 提供了一种通信系统，其包括电磁（“EM”）通信设备和至少包括机器可读符号的光通信设备，其中EM通信设备的至少一部分和机器可读符号的至少一部分是 由相同的材料形成。 该材料可以是例如可导电油墨或可导电箔。 如果需要，EM通信设备可以包括天线，其中天线的至少一部分包括机器可读符号的至少一部分。

公开(公告)号：US20050274802A1

公开(公告)日：2005-12-15

申请号：US10863211

申请日：2004-06-09

Applicant: Wei-Chi Yang

Inventor： Wei-Chi Yang

IPC: G06K7/00 ,  H05K1/02 ,  H05K3/00 ,  H05K13/08

CPC classification number: H05K1/0266 ,  H05K1/0269 ,  H05K3/0052 ,  H05K13/08 ,  H05K2201/09927

Abstract: A circuit board inspection apparatus aims to inspect a circuit board panel which contains a plurality of sub-panels. The panel is bonded with a panel barcode and each sub-panel is bonded with a different sub-panel barcode. The circuit board inspection apparatus includes an automatic optic inspection (AOI) system to inspect the circuit board panel and read the panel barcode and the sub-panel barcode, a data link module to link data contained in the panel barcode and the sub-panel barcode and generate linkage data, and a database to store the linkage data. The relationship of the panel and the sub-panel may still be maintained through the linkage data provided by the data link module even after the panel and the sub-panel have been separated.

Abstract translation: 电路板检查装置旨在检查包含多个子面板的电路板面板。 面板与面板条形码结合，每个子面板用不同的子面板条形码粘合。 电路板检查装置包括自动光学检测（AOI）系统，用于检查电路板面板并读取面板条形码和子面板条形码，数据链接模块，用于链接包含在面板条形码中的数据和子面板条形码 并生成链接数据，以及数据库来存储链接数据。 即使在面板和子面板分离之后，面板和子面板的关系仍然可以通过数据链接模块提供的联系数据进行维护。

公开(公告)号：US20050236176A1

公开(公告)日：2005-10-27

申请号：US10921832

申请日：2004-08-20

Applicant: Shih-Ping Hsu ,  Shang-Wei Chen ,  Suo-Hsia Tang ,  Chao-Wen Shih

Inventor： Shih-Ping Hsu ,  Shang-Wei Chen ,  Suo-Hsia Tang ,  Chao-Wen Shih

IPC: G06K1/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/10 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/0266 ,  H05K1/0269 ,  H05K3/107 ,  H05K3/4644 ,  H05K2201/09781 ,  H05K2201/09927 ,  H05K2201/09936

Abstract: A circuit board with identifiable information and a method for fabricating the same are proposed. At least one insulating layer within the circuit board has a non-circuit area free of a circuit layout. A plurality of openings are formed in the non-circuit area of the insulating layer. A patterned circuit layer is formed on the insulating layer. Metal identifiable information is disposed in the openings of the non-circuit area. By this arrangement, a product status of the circuit board can be traced and identified via the metal patterned information.

Abstract translation: 提出了具有可识别信息的电路板及其制造方法。 电路板内的至少一个绝缘层具有不具有电路布局的非电路区域。 在绝缘层的非电路区域中形成多个开口。 在绝缘层上形成图案化的电路层。 金属识别信息设置在非电路区域的开口中。 通过这种布置，电路板的产品状态可以通过金属图案信息进行跟踪和识别。

公开(公告)号：US20030043552A1

公开(公告)日：2003-03-06

申请号：US10231322

申请日：2002-08-30

Applicant: NEC CORPORATION

Inventor： Takashi Abe

IPC: H05K001/00 ,  H05K001/18 ,  H05K007/02 ,  H05K007/06 ,  H05K007/08

CPC classification number: H05K1/0266 ,  H05K1/029 ,  H05K1/18 ,  H05K2201/09127 ,  H05K2201/09927 ,  H05K2201/10204

Abstract: A circuit board permits common use of the same circuit board without separately manufacturing the circuit board per providing destinations when similar circuit boards are manufactured for a plurality of providing destinations in the same factory. The circuit board has at least a first providing destination indicating region on which a first providing destination is indicated and a second providing destination indicating region located adjacent the first providing destination indicating region, on which second providing destination region, a second providing destination is indicated, the providing destination indicating regions other than that indicating an intended providing destination being hidden by mounting parts thereon.

Abstract translation: 电路板允许在同一工厂中为多个提供目的地制造类似的电路板时，不需要在提供目的地的情况下单独制造电路板，因此可以通用同一电路板。 电路板至少具有指示第一提供目的地的第一提供目的地指示区域和位于第一提供目的地指示区域附近的第二提供目的地指示区域，第二提供目的地区域指示第二提供目的地区域， 提供目的地指示除了通过在其上安装部件来指示预期提供目的地被隐藏的区域之外的区域。

公开(公告)号：US06403891B1

公开(公告)日：2002-06-11

申请号：US09049888

申请日：1998-03-27

Applicant: Koushik Banerjee ,  Craig Randleman

Inventor： Koushik Banerjee ,  Craig Randleman

IPC: H05K100

CPC classification number: H05K1/0266 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/3452 ,  H05K3/4611 ,  H05K2201/062 ,  H05K2201/0969 ,  H05K2201/09927 ,  H05K2201/09936 ,  H05K2203/0588 ,  H05K2203/107 ,  H05K2203/161

Abstract: A printed circuit board which has an ink block and a first conductive layer that are attached to a solder mask. A first dielectric layer is attached to the first conductive layer. Indicia is formed in the ink block by a laser ablation process. The first conductive layer has a first non-metallized area located beneath the ink block. Eliminating metal beneath the ink block would reduce the amount of energy that is absorbed by the circuit board during the laser ablation process. The printed circuit board has multiple layers of conductive and dielectric material. Some or all of the conductive layers may have non-metallized areas located beneath the ink block.

Abstract translation: 一种印刷电路板，其具有附接到焊料掩模的墨块和第一导电层。 第一电介质层附着到第一导电层。 通过激光烧蚀工艺在墨块中形成标记。 第一导电层具有位于墨块下方的第一非金属化区域。 消除墨块下面的金属将减少在激光烧蚀过程期间被电路板吸收的能量的量。 印刷电路板具有多层导电和介电材料。 一些或全部导电层可以具有位于墨块下方的非金属化区域。

公开(公告)号：US5378581A

公开(公告)日：1995-01-03

申请号：US33014

申请日：1993-03-18

Applicant: Robert D. Vernon

Inventor： Robert D. Vernon

IPC: H01L21/60 ,  H01L23/495 ,  H01L23/544 ,  H05K1/02 ,  H05K3/00 ,  H05K3/06 ,  G03C5/00

CPC classification number: H01L24/86 ,  H01L23/49572 ,  H01L23/544 ,  H05K3/0082 ,  H01L2223/54473 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/3025 ,  H05K1/0266 ,  H05K2201/09927 ,  H05K2201/09936 ,  H05K2203/0195 ,  H05K2203/0505 ,  H05K2203/0551 ,  H05K2203/107 ,  H05K2203/1545 ,  H05K3/064 ,  Y10T29/49121 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T428/14 ,  Y10T428/1486 ,  Y10T428/24322

Abstract: A method for patterning a tape to which an integrated circuit may be bonded including providing a tape having a top layer of unexposed film which, when exposed in an interconnection pattern and developed, acts as a mask for processing a photoprocessable layer of the tape to provide conductive portions in an interconnection pattern on the tape.

Abstract translation: 一种用于图案化可以结合集成电路的带的方法，包括提供具有未曝光膜顶层的带，当以互连图案曝光并显影时，其作为用于处理带的可光处理层的掩模，以提供 磁带上的互连图案中的导电部分。

公开(公告)号：US5027505A

公开(公告)日：1991-07-02

申请号：US488129

申请日：1990-03-05

Applicant: Nobuyuki Nakamura ,  Yuji Sakamoto ,  Takashi Kawakami ,  Shinya Ohkubo

Inventor： Nobuyuki Nakamura ,  Yuji Sakamoto ,  Takashi Kawakami ,  Shinya Ohkubo

IPC: G09F3/00 ,  H01L25/075 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0266 ,  G09F3/00 ,  H01L25/0753 ,  H05K3/0052 ,  H01L2924/0002 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09927 ,  H05K2201/10106 ,  H05K2203/1545 ,  Y10T29/4913 ,  Y10T29/49789 ,  Y10T29/49819 ,  Y10T29/53261

Abstract: The present invention provides a method of producing electronic components such as LED displays and hybrid IC's from a broad supply frame. The frame comprises a parallel pair of elongate side bands, and a plurality of unit circuit boards integrally incorporated in the frame by means of connecting webs and arranged between the pair of side bands at a predetermined interval therealong. Various process steps such as chip bonding and wire bonding are performed with respect to the individual circuit boards while they are still in the frame. In a final step, each unit circuit board or electronic component is separated from the frame. The frame may be provided with an identification pattern to identify the type of unit circuit boards incorporated in the frame.

Abstract translation: 本发明提供从广泛供应框架制造诸如LED显示器和混合IC的电子部件的方法。 该框架包括平行的一对细长边带，以及多个单元电路板，其通过连接腹板一体地结合在框架中，并且以一定间隔在该对边带之间布置。 当各个电路板仍在框架中时，执行诸如芯片接合和引线键合的各种工艺步骤。 在最后一步中，每个单元电路板或电子部件与框架分离。 该框架可以设置有识别图案，以识别结合在框架中的单元电路板的类型。