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    Pressure sensor having a laminated substrate
    1.
    发明授权
    Pressure sensor having a laminated substrate 失效
    具有层叠基板的压力传感器

    公开(公告)号：US5285690A

    公开(公告)日：1994-02-15

    申请号：US825620

    申请日：1992-01-24

    Applicant: Edward F. Koen ,  Robert D. Vernon

    Inventor： Edward F. Koen ,  Robert D. Vernon

    IPC: G01L9/04 ,  G01L9/00 ,  G01L9/12 ,  G01L27/00 ,  H01L29/84 ,  G01L9/06

    CPC classification number: G01L19/0084 ,  G01L19/147 ,  G01L27/007 ,  G01L9/0042 ,  Y10T29/49103

    Abstract: A pressure sensor sub-assembly (18) has a solid-state sensing element (22) mounted on a laminated ceramic substrate (20) and has the electrical signal contacts (22a) on the sensing element electrically connected to connector pins (24) on the substrate. A manufacturing process can fabricate a batch of sub-assemblies on a substrate structure that is sub-divided to form the separate sub-assemblies. The sensor sub-assemblies can be tested, and graded, before or after the sub-division step, and then each mounted in a housing.

    Abstract translation: 压力传感器子组件（18）具有安装在层叠陶瓷衬底（20）上的固态感测元件（22），并且在感测元件上具有电连接到连接器销（24）上的电信号触点（22a） 底物。 制造过程可以在被分割以形成单独的子组件的衬底结构上制造一批子组件。 传感器子组件可以在分割步骤之前或之后进行测试和分级，然后每个安装在外壳中。

    Lightweight sealed circuit board assembly
    2.
    发明授权
    Lightweight sealed circuit board assembly 失效
    轻巧密封电路板组件

    公开(公告)号：US5187642A

    公开(公告)日：1993-02-16

    申请号：US750447

    申请日：1991-08-20

    Applicant: Ronald N. Garner ,  Robert D. Vernon

    Inventor： Ronald N. Garner ,  Robert D. Vernon

    IPC: H05K7/14

    CPC classification number: H05K7/1461

    Abstract: An integrated circuit board assembly includes two integrated circuit boards. The integrated circuit boards have an electronic circuitry configured on the interior face and a dielectric sealant on the other face. The integrated circuit boards are secured to a frame in such a manner that the interior faces of the integrated circuit boards face inward toward each other. The securing of the frame to the integrated circuit boards is such that it forms a sealed enclosure protecting the electronic circuitry configured therein from the process environment. The exterior faces, however, are exposed to the process environment and are helpful in dissipating heat to the exterior environment.

    Abstract translation: 集成电路板组件包括两个集成电路板。 集成电路板具有构造在内表面上的电子电路和另一面上的介电密封剂。 集成电路板以使得集成电路板的内表面朝向彼此面对的方式固定到框架。 将框架固定到集成电路板上使得其形成密封的外壳，其保护配置在其中的电子电路与工艺环境。 然而，外表面暴露于工艺环境中，有助于将热量散发到外部环境中。

    Method of manufacture of pressure sensor having a laminated substrate
    4.
    发明授权
    Method of manufacture of pressure sensor having a laminated substrate 失效
    具有层叠基板的压力传感器的制造方法

    公开(公告)号：US5407501A

    公开(公告)日：1995-04-18

    申请号：US150838

    申请日：1993-11-12

    Applicant: Edward F. Koen ,  Robert D. Vernon

    Inventor： Edward F. Koen ,  Robert D. Vernon

    IPC: G01L9/04 ,  G01L9/00 ,  G01L9/12 ,  G01L27/00 ,  H01L29/84 ,  G01L9/06 ,  B32B31/00

    CPC classification number: G01L19/0084 ,  G01L19/147 ,  G01L27/007 ,  G01L9/0042 ,  Y10T29/49103

    Abstract: A pressure sensor sub-assembly (18) has a solid-state sensing element (22) mounted on a laminated ceramic substrate (20) and has the electrical signal contacts (22a) on the sensing element electrically connected to connector pins (24) on the substrate. A manufacturing process can fabricate a batch of sub-assemblies on a substrate structure that is sub-divided to form the separate sub-assemblies. The sensor sub-assemblies can be tested, and graded, before or after the sub-division step, and then each mounted in a housing.

    Abstract translation: 压力传感器子组件（18）具有安装在层叠陶瓷衬底（20）上的固态感测元件（22），并且在感测元件上具有电连接到连接器销（24）上的电信号触点（22a） 底物。 制造过程可以在被分割以形成单独的子组件的衬底结构上制造一批子组件。 传感器子组件可以在分割步骤之前或之后进行测试和分级，然后每个安装在外壳中。

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