Abstract:
An adhesive bonding method that includes bonding a handling wafer to a front side surface of a device wafer with an adhesive comprising N-substituted maleimide copolymers. The device wafer may then be thinned from the backside surface of the device wafer while the device wafer is adhesively engaged to the handling wafer. The adhesive can then be removed by laser debonding, wherein the device wafer is separated from the handling wafer.
Abstract:
An adhesive bonding method that includes bonding a handling wafer to a front side surface of a device wafer with an adhesive comprising N-substituted maleimide copolymers. The device wafer may then be thinned from the backside surface of the device wafer while the device wafer is adhesively engaged to the handling wafer. The adhesive can then be removed by laser debonding, wherein the device wafer is separated from the handling wafer.
Abstract:
A pressure-sensitive adhesive composition comprises a polyvinyl ether polymer. The polyvinyl ether polymer comprises 2-alkylalkoxyethylene monomeric units independently represented by the formula wherein R1 and R2 represent alkyl groups, and wherein taken together R1 and R2 have from 8 to 30 carbon atoms. An adhesive article comprises a layer of the pressure-sensitive adhesive composition on a substrate.
Abstract:
Disclosed are perfluoroethers and perfluoroether compositions useful in high temperature aerospace applications. The perfluoroethers can be adapted for use with various curing chemistries.
Abstract:
Disclosed are perfluoroethers and perfluoroether compositions useful in high temperature aerospace applications. The perfluoroethers can be adapted for use with various curing chemistries.
Abstract:
Disclosed are perfluoroethers and perfluoroether compositions useful in high temperature aerospace applications. The perfluoroethers can be adapted for use with various curing chemistries.
Abstract:
Vinyl ether compounds having the formula: R—O—X—O—CH═CH2 wherein R is a radical selected from R1—CnHm—, R1—CnHm—C(═O)—, R1—CnHm—CH[—O—X—O—CH═CH2—], R1—CnHm—CH[—O—X—O—CH═CH2—]C(═O)—, R1—CnHm—CH[—C(═O)—O—X—O—CH═CH2—], R1—CnHm—CH[—C(═O)—O—X—O—CH═CH2—]C(═O)—, R1—[CFCl—CF2—]pCH2— and HCFCl—CF2—, wherein R1 is hydrogen, an unsubstituted or substituted fluorinated aliphatic radical, an unsubstituted or substituted fluorinated cyclic aliphatic radical, an unsubstituted or substituted fluorinated aromatic radical, an unsubstituted or substituted fluorinated araliphatic radical, or an unsubstituted or substituted fluorinated heterocyclic radical; n is an integer between 1 and 6, inclusive; n≦m≦2n; p is an integer between 1 and 20, inclusive and X is an unsubstituted or substituted aliphatic radical, an unsubstituted or substituted cyclic aliphatic radical, an unsubstituted or substituted aromatic radical, an unsubstituted or substituted araliphatic radical, or an unsubstituted or substituted heterocyclic radical; provided that when R1 of R1—CnHm— is an otherwise unsubstituted fluorinated aliphatic group, X is not ethylene or propylene. Curable compositions containing the vinyl ether compounds are also disclosed, as well as polymers polymerized from the vinyl ether compounds.
Abstract:
Vinyl ether compounds having the formula: R—O—X—O—CH═CH2 wherein R is a radical selected from R1—CnHm—, R1—CnHm—C(═O)—, R1—CnHm—CH[—O—X—O—CH═CH2—], R1—CnHm—CH[—O—X—O—CH═CH2—]C(═O)—, R1—CnHm—CH[—C(═O)—O—X—O—CH═CH2—], R1—CnHm—CH[—C(═O)—O—X—0—CH═CH2—]C(═O)—, R1—[CFCl—CF2—]pCH2— and HCFCl—CF2—, wherein R1 is hydrogen, an unsubstituted or substituted fluorinated aliphatic radical, an unsubstituted or substituted fluorinated cyclic aliphatic radical, an unsubstituted or substituted fluorinated aromatic radical, an unsubstituted or substituted fluorinated araliphatic radical, or an unsubstituted or substituted fluorinated heterocyclic radical; n is an integer between 1 and 6, inclusive; n≦m≦2n; p is an integer between 1 and 20, inclusive and X is an unsubstituted or substituted aliphatic radical, an unsubstituted or substituted cyclic aliphatic radical, an unsubstituted or substituted aromatic radical, an unsubstituted or substituted araliphatic radical, or an unsubstituted or substituted heterocyclic radical; provided that when R1 of R1—CnHm— is an otherwise unsubstituted fluorinated aliphatic group, X is not ethylene or propylene. Curable compositions containing the vinyl ether compounds are also disclosed, as well as polymers polymerized from the vinyl ether compounds.
Abstract:
A water sensitive hot melt adhesive composition is described which possesses properties which are desirable with respect to the construction of disposable articles. The adhesive composition includes about 5% to about 95%, by weight, of a poly [vinyl methyl ether]; about 5% to about 70%, by weight, of a tackifying resin; and about 5% to about 35%, by weight, of a water soluble plasticizer.
Abstract:
A water soluble pressure sensitive adhesive composition is disclosed wherein polyvinyl methyl ether is the major component and a styrenic block copolymer is the second component, the polyvinyl methyl ether and styrenic block copolymer present in a weight ratio of from about 95:5 to about 88:12, said styrenic block copolymer in said composition comprising less than about 14 percent by weight of the weight of the polyvinyl methyl ether. The pressure sensitive adhesive is useful for bonding polyethylene, polypropylene, ethylene-propylene copolymers, and paper.