-
公开(公告)号：US20240110752A1
公开(公告)日：2024-04-04
申请号：US18479337
申请日：2023-10-02
Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
Inventor： Yoshihiro Machida
CPC classification number: F28D15/0266 , F28D15/043
Abstract: An evaporator includes a first metal layer having a first inner surface and a first outer surface, a second metal layer having a second inner surface and a second outer surface, and a porous body provided between the first outer surface and the second outer surface. The porous body includes a first bottomed hole provided in the first inner surface, a second bottomed hole provided in the second inner surface, a first fine pore, wherein the first bottomed hole and the second bottomed hole partially communicate with each other through the first fine pore, a first groove portion provided in the first inner surface and configured to communicate with the first bottomed hole, and a second groove portion provided in the second inner surface and configured to communicate with the second bottomed hole. The first outer surface and the second outer surface serve as an outer surface of the evaporator.
-
公开(公告)号：US11719490B2
公开(公告)日：2023-08-08
申请号：US17030930
申请日：2020-09-24
Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
Inventor： Yoshihiro Machida
CPC classification number: F28D15/0266
Abstract: A loop heat pipe includes an evaporator to vaporizes a working fluid, a condenser to liquefy the working fluid, a liquid pipe to connect the evaporator and the condenser, and a vapor pipe to connect the evaporator and the condenser, and form a loop-shaped passage together with the liquid pipe. A recess is formed in at least a portion of an outer wall surface of a pipe wall of the evaporator, the condenser, the liquid pipe, and the vapor pipe.
-
公开(公告)号：US20210372708A1
公开(公告)日：2021-12-02
申请号：US17325671
申请日：2021-05-20
Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
Inventor： Yoshihiro Machida
Abstract: A loop-type heat pipe includes an evaporator, a first condenser, a second condenser, a first liquid pipe having a first flow path and configured to connect the evaporator and the first condenser, a second liquid pipe having a second flow path and configured to connect the evaporator and the second condenser, a first vapor pipe configured to connect the evaporator and the first condenser, a second vapor pipe configured to connect the evaporator and the second condenser, and a connecting portion having a first porous body and configured to connect the first liquid pipe and second liquid pipe to the evaporator. The evaporator has a third flow path connected to the first liquid pipe and the first vapor pipe, a fourth flow path connected to the second liquid pipe and the second vapor pipe, and a partitioning wall configured to partition the third flow path and the fourth flow path.
-
公开(公告)号：US11098957B2
公开(公告)日：2021-08-24
申请号：US16535597
申请日：2019-08-08
Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
Inventor： Yoshihiro Machida
Abstract: A loop-type heat pipe includes an evaporator configured to vaporize an operating fluid, a condenser configured to liquefy the operating fluid, a liquid pipe configured to interconnect the evaporator and the condenser, a steam pipe configured to interconnect the evaporator and the condenser and to form a loop together with the liquid pipe, a porous body provided in the liquid pipe and configured to retain therein the liquid operating fluid, and a solid columnar support provided in the liquid pipe and configured to guide the operating fluid liquefied by the condenser to the porous body. At least one first groove is formed at a side surface of the columnar support.
-
公开(公告)号：US20210116184A1
公开(公告)日：2021-04-22
申请号：US17038415
申请日：2020-09-30
Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
Inventor： Yoshihiro Machida
Abstract: A loop heat pipe includes: an evaporator; a condenser; a liquid pipe that connects the evaporator and the condenser; a vapor pipe that connects the evaporator and the condenser to form a loop flow path; and a porous body provided inside of a part of the evaporator, the condenser, the liquid pipe, and the vapor pipe. The evaporator, the condenser, the liquid pipe, and the vapor pipe have a first main surface. At least one recessed portion is formed in at least part of a first area, located directly above or below the flow path, of the first main surface, and is not formed in a second area, located directly above or directly below a pipe wall of the flow path, of the first main surface and is not formed in a third area, located directly above or below the porous body, of the first main surface.
-
Patent Agency Ranking
公开(公告)号：US10859321B2
公开(公告)日：2020-12-08
申请号：US16143659
申请日：2018-09-27
Applicant: Shinko Electric Industries Co., LTD.
Inventor： Yoshihiro Machida
Abstract: A heat pipe includes an inlet through which a working fluid is injected. The inlet includes a non-sealed portion and a sealed portion connected to the non-sealed portion. The non-sealed portion and the sealed portion each include two outermost metal layers and a plurality of intermediate metal layers stacked between the outermost metal layers. The heat pipe further includes a porous body arranged in the inlet.
-
公开(公告)号：US20200096261A1
公开(公告)日：2020-03-26
申请号：US16553216
申请日：2019-08-28
Applicant: Shinko Electric Industries Co., LTD.
Inventor： Koichi Tanaka , Nobuyuki Kurashima , Yoshihiro Machida , Takahiko Kiso
Abstract: A loop heat pipe includes an evaporator that vaporizes working fluid, a condenser that liquefies the working fluid vaporized by the evaporator, a liquid pipe connecting the condenser to the evaporator, and a vapor pipe connecting the evaporator to the condenser. The liquid pipe includes two wall portions located at opposite sides of the liquid pipe, two porous bodies, each of which is continuous with and formed integrally with one of the two wall portions, and a flow passage located between the two porous bodies.
-
公开(公告)号：US09818681B2
公开(公告)日：2017-11-14
申请号：US14969555
申请日：2015-12-15
Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
Inventor： Yoshihiro Machida
CPC classification number: H01L23/49827 , H01L21/4853 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49833 , H01L23/49838 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/04026 , H01L2224/05155 , H01L2224/05166 , H01L2224/05644 , H01L2224/05647 , H01L2224/06183 , H01L2224/131 , H01L2224/13111 , H01L2224/16014 , H01L2224/16105 , H01L2224/16106 , H01L2224/16175 , H01L2224/291 , H01L2224/29111 , H01L2224/2919 , H01L2224/32014 , H01L2224/32105 , H01L2224/32106 , H01L2224/32175 , H01L2224/32227 , H01L2224/33183 , H01L2224/73253 , H01L2224/81424 , H01L2224/81444 , H01L2224/81447 , H01L2224/81815 , H01L2224/83101 , H01L2224/83424 , H01L2224/83444 , H01L2224/83447 , H01L2224/83815 , H01L2924/15311 , H05K1/185 , H05K3/4614 , H05K2201/10303 , H05K2203/061 , H01L2924/00012 , H01L2924/014 , H01L2924/00014 , H01L2924/0665 , H01L2924/01029 , H01L2924/01047 , H01L2224/05144
Abstract: A wiring substrate includes a first substrate and an electronic component mounted on an upper surface of the first substrate. A first pad is formed on an uppermost wiring layer of the first substrate. A connection terminal is formed on the electronic component and is located proximate to the first pad in a plan view. The wiring substrate further includes a connection member formed on the first pad to electrically connect the first pad and the connection terminal. The connection member includes a rod-shaped core and a solder layer, which is coated around the core and joined to the first pad. The solder layer includes a bulge that spreads from the core of the connection member in a planar direction. The bulge is joined to the connection terminal of the electronic component.
-
公开(公告)号：US11774181B2
公开(公告)日：2023-10-03
申请号：US17038415
申请日：2020-09-30
Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
Inventor： Yoshihiro Machida
CPC classification number: F28D15/0266 , F28D15/046
Abstract: A loop heat pipe includes: an evaporator; a condenser; a liquid pipe that connects the evaporator and the condenser; a vapor pipe that connects the evaporator and the condenser to form a loop flow path; and a porous body provided inside of a part of the evaporator, the condenser, the liquid pipe, and the vapor pipe. The evaporator, the condenser, the liquid pipe, and the vapor pipe have a first main surface. At least one recessed portion is formed in at least part of a first area, located directly above or below the flow path, of the first main surface, and is not formed in a second area, located directly above or directly below a pipe wall of the flow path, of the first main surface and is not formed in a third area, located directly above or below the porous body, of the first main surface.
-
公开(公告)号：US11592240B2
公开(公告)日：2023-02-28
申请号：US16885394
申请日：2020-05-28
Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
Inventor： Yoshihiro Machida , Nobuyuki Kurashima
Abstract: A loop-type heat pipe includes an evaporator configured to vaporize an operating fluid, a condenser configured to condense the operating fluid, a liquid pipe configured to connect the evaporator and the condenser, a vapor pipe configured to connect the evaporator and the condenser, a porous body provided in the liquid pipe, and a vapor moving path provided at a part in the liquid pipe separately from the porous body and extending from the evaporator along a longitudinal direction of the liquid pipe, the operating fluid vaporized in the evaporator moving in the vapor moving path. The vapor moving path has a flow path in which the operating fluid vaporized in the evaporator flows and a wall part surrounding the flow path.
-
-
-
-
-
-
-
-
-
Search Results
72
records
(took 0.056 seconds)
