Invention Grant
- Patent Title: Loop heat pipe with recessed outer wall surface
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Application No.: US17030930Application Date: 2020-09-24
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Publication No.: US11719490B2Publication Date: 2023-08-08
- Inventor: Yoshihiro Machida
- Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Applicant Address: JP Nagano
- Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee Address: JP Nagano
- Agency: IPUSA, PLLC
- Priority: JP 19198357 2019.10.31
- Main IPC: F28D15/00
- IPC: F28D15/00 ; F28D15/02

Abstract:
A loop heat pipe includes an evaporator to vaporizes a working fluid, a condenser to liquefy the working fluid, a liquid pipe to connect the evaporator and the condenser, and a vapor pipe to connect the evaporator and the condenser, and form a loop-shaped passage together with the liquid pipe. A recess is formed in at least a portion of an outer wall surface of a pipe wall of the evaporator, the condenser, the liquid pipe, and the vapor pipe.
Public/Granted literature
- US20210131742A1 LOOP HEAT PIPE Public/Granted day:2021-05-06
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