公开(公告)号：US20240321679A1

公开(公告)日：2024-09-26

申请号：US18505412

申请日：2023-11-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngjoon KOH ,  Jaechoon KIM

IPC: H01L23/427 ,  H01L25/18 ,  H10B80/00

CPC classification number: H01L23/427 ,  H01L25/18 ,  H10B80/00 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05169 ,  H01L2224/05184 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/1431 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/1441 ,  H01L2924/1443

Abstract: A heat dissipation structure may include a heat dissipation chamber including a lower wall, an upper wall on the lower wall, and a plurality of sidewalls extending between the lower wall and the upper wall, the heat dissipation chamber providing an inner space for a working fluid to flow therein; and a wick structure on an inner surface of the heat dissipation chamber. The wick structure may be configured to guide the working fluid in a liquid state. The heat dissipation chamber may be configured to change its shape according to a temperature.

公开(公告)号：US20250079338A1

公开(公告)日：2025-03-06

申请号：US18752055

申请日：2024-06-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunggu KANG ,  Youngjoon KOH ,  Jae Choon KIM ,  Sung-Ho MUN ,  Hwanjoo PARK

IPC: H01L23/00 ,  H01L23/24 ,  H01L23/28 ,  H01L23/36 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/16

Abstract: A semiconductor package may comrpise a substrate, a chip structure on the substrate, a passive element structure in the substrate and including a passive element, and a stiffening structure at least partially overlapping the passive element structure. A top surface of the passive element may be below a top surface of the substrate.