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    SEMICONDUCTOR MEMORY DEVICE AND MEMORY SYSTEM
    4.
    发明申请
    SEMICONDUCTOR MEMORY DEVICE AND MEMORY SYSTEM 有权
    半导体存储器件和存储器系统

    公开(公告)号：US20140173234A1

    公开(公告)日：2014-06-19

    申请号：US14104574

    申请日：2013-12-12

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： BU-IL JUNG ,  So-Young KIM

    IPC: G06F3/06

    CPC classification number: G06F3/0688 ,  G06F3/0616 ,  G06F3/064 ,  G06F12/0246 ,  G06F2212/7211

    Abstract: A semiconductor memory system or device includes a memory cell array and an address converter. The memory cell array includes a plurality of memory blocks, and there is at least one block that serves as a buffer. Each of the memory blocks includes at least one memory cell row. An address converting circuit along with a block copy circuit performs a block copy operation of copying data of a first memory block, which is a source block among the memory blocks, into a second block, which is a buffer or destination block, and maps a first logical address for accessing the first memory block onto a physical address designating the second block. The first memory block then can serve as a new destination block after the block copy operation of the first memory block is completed.

    Abstract translation: 半导体存储器系统或器件包括存储单元阵列和地址转换器。 存储单元阵列包括多个存储器块，并且存在用作缓冲器的至少一个块。 每个存储块包括至少一个存储单元行。 地址转换电路与块复制电路一起执行将作为存储块中的源块的第一存储块的数据复制到作为缓冲器或目的地块的第二块中的块复制操作，并将 用于将第一存储器块访问到指定第二块的物理地址的第一逻辑地址。 然后，第一存储器块的块复制操作完成之后，第一存储器块可以用作新的目标块。

    STACKED SEMICONDUCTOR DEVICE, SYSTEM INCLUDING THE SAME AND METHOD OF TRANSFERRING SIGNALS IN THE SAME
    5.
    发明申请
    STACKED SEMICONDUCTOR DEVICE, SYSTEM INCLUDING THE SAME AND METHOD OF TRANSFERRING SIGNALS IN THE SAME 审中-公开

    公开(公告)号：US20190096853A1

    公开(公告)日：2019-03-28

    申请号：US16044886

    申请日：2018-07-25

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Haesuk LEE ,  So-Young KIM ,  Seung-Han WOO

    IPC: H01L25/065 ,  G11C5/02 ,  H01L23/538

    Abstract: A stacked semiconductor device includes a plurality of semiconductor dies stacked in a first direction, M data paths electrically connecting the plurality of semiconductor dies, one data path including one or more through-silicon vias, where M is a positive integer, a transmission circuit including M serialization units configured to serialize P transmission signals to M serial signals and output the M serial signals to the M data paths, respectively, where P is a positive integer greater than M and a reception circuit including M parallelization units configured to receive the M serial signals from the M data paths and parallelize the M serial signals to P reception signals corresponding to the P transmission signals. The number of the through-silicon vias is reduced by serializing the transmission signals, transferring the serialized signals through the smaller number of data paths between the stacked semiconductor dies and then parallelizing the transferred signals.

    SYSTEM, APPARATUS, AND METHOD FOR SHARING ELECTRONIC DEVICE
    7.
    发明申请
    SYSTEM, APPARATUS, AND METHOD FOR SHARING ELECTRONIC DEVICE 有权
    用于共享电子设备的系统，装置和方法

    公开(公告)号：US20150058936A1

    公开(公告)日：2015-02-26

    申请号：US14462789

    申请日：2014-08-19

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Tae-Wook KANG ,  Suk-Jin SUNG ,  So-Young KIM ,  Ju-Hee OH ,  Il-Han YOON ,  Yon-Gi CHO ,  Young-Keun CHOI

    IPC: H04L29/06

    CPC classification number: H04L63/08 ,  H04L63/10 ,  H04W12/06 ,  H04W12/08

    Abstract: A system, apparatus, and method for sharing content in an electronic device behaving as a cloud electronic device are provided. An electronic device behaving as a guest electronic device includes a controller to detect an input of account information associated with a manager electronic device. The controller of the guest electronic device transmits account information associated with the manager electronic device and accesses the cloud electronic device when the manager electronic device acknowledges the request.

    Abstract translation: 提供了一种用于在电子设备中共享作为云电子设备的内容的系统，装置和方法。 作为访客电子设备的电子设备包括：控制器，用于检测与管理者电子设备相关联的帐户信息的输入。 访客电子设备的控制器发送与管理者电子设备相关联的帐户信息，并且当管理者电子设备确认请求时访问云电子设备。

    ELECTRONIC DEVICE AND METHOD FOR CONTROLLING MOTION
    9.
    发明申请
    ELECTRONIC DEVICE AND METHOD FOR CONTROLLING MOTION 有权

    公开(公告)号：US20210278947A1

    公开(公告)日：2021-09-09

    申请号：US16330572

    申请日：2017-09-05

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Seung-Min CHOI ,  Kyu-Hong KIM ,  So-Young KIM ,  Doo-Suk KANG ,  Geon-Soo KIM ,  Yo-Han LEE ,  Bo-Kun CHOI

    IPC: G06F3/041 ,  G06F3/0488

    Abstract: An electronic device according to various embodiments of the present invention comprises: a housing including a first surface facing a first direction and a second surface facing a second direction opposite to the first direction; a touch screen display disposed between the first surface and the second surface and exposed through the first surface; a pressure sensor disposed between the first surface and the second surface and configured to sense at least one pressure by an external object on the touch screen display; at least one processor electrically connected to the touch screen display and the pressure sensor; and a memory electrically connected to the processor, wherein the memory may store instructions which cause the processor to receive, from the pressure sensor, data indicating pressure by a user or the external object on the touch screen display, determine a rate of pressure change corresponding to a change of the pressure per unit time, and call a function on the basis of at least a part of at least one between a value of the pressure and the rate of pressure change, during execution. Other embodiments may be possible.

    STACKED MEMORY DEVICE, A SYSTEM INCLUDING THE SAME AND AN ASSOCIATED METHOD
    10.
    发明申请
    STACKED MEMORY DEVICE, A SYSTEM INCLUDING THE SAME AND AN ASSOCIATED METHOD 有权

    公开(公告)号：US20210166740A1

    公开(公告)日：2021-06-03

    申请号：US17172328

    申请日：2021-02-10

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Hyun-Sung SHIN ,  Ik-Joon CHOI ,  So-Young KIM ,  Tae-Kyu BYUN ,  Jae-Youn YOUN

    IPC: G11C7/10 ,  G11C5/06 ,  G11C5/04 ,  G06F3/06 ,  G06F7/523 ,  G06F12/06 ,  G11C7/06 ,  G11C7/22

    Abstract: A stacked memory device includes: a logic semiconductor die; a plurality of memory semiconductor dies stacked with the logic semiconductor die, wherein each of the memory semiconductor dies includes a memory integrated circuit and one or more of the memory semiconductor dies is a calculation semiconductor die including a calculation unit; and through-silicon vias electrically connecting the logic semiconductor die and the plurality of memory semiconductor dies, wherein each of the calculation units is configured to perform calculations based on broadcast data and internal data and to generate calculation result data, wherein the broadcast data is commonly provided to the calculation semiconductor dies through the through-silicon vias, and the internal data is respectively read from the memory integrated circuits of the calculation semiconductor dies.

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