公开(公告)号：US11610788B2

公开(公告)日：2023-03-21

申请号：US17217417

申请日：2021-03-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong-Jhin Cho ,  Young-Hoo Kim ,  Jihoon Jeong ,  Yungjun Kim ,  Jung-Min Oh ,  Kuntack Lee ,  Hyosan Lee

IPC: H01L21/67 ,  H01L21/02

Abstract: A process chamber and a substrate processing apparatus including the same are disclosed. The process chamber includes a first housing and a second housing on the first housing. The first housing includes a first outer wall, a first partition wall facing the first outer wall, and a first side wall connecting the first outer wall and the first partition wall. The second housing includes a second outer wall, a second partition wall between the second outer wall and the first partition wall, and a second side wall connecting the second outer wall and the second partition wall. Each of the first and second outer walls has a thickness greater than a thickness of the first partition wall and a thickness of the second partition wall.

公开(公告)号：US11482410B2

公开(公告)日：2022-10-25

申请号：US17398219

申请日：2021-08-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hunjae Jang ,  Seungmin Shin ,  Kuntack Lee ,  Seungho Kim ,  Younghoo Kim ,  Taehong Kim ,  Sunghyun Park

IPC: H01L21/02 ,  B08B3/08 ,  B08B7/00 ,  B08B3/10

Abstract: A wafer-cleaning apparatus includes an inner pin that supports a wafer. The wafer-cleaning apparatus further includes a nozzle disposed above the inner pin, a light source disposed under the inner pin, a window disposed between the light source and the wafer, and a window protector disposed between the wafer and the window. The nozzle supplies a chemical liquid to the wafer and the inner pin distributes a portion of the chemical liquid on an upper surface of the wafer by rotating the wafer. The window protector receives a portion of the chemical liquid that flows out of the wafer and the light source supplies the light to the wafer through the window protector and the window.

公开(公告)号：US10991600B2

公开(公告)日：2021-04-27

申请号：US15848481

申请日：2017-12-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong-Jhin Cho ,  Young-Hoo Kim ,  Jihoon Jeong ,  Yungjun Kim ,  Jung-Min Oh ,  Kuntack Lee ,  Hyosan Lee

IPC: H01L21/67 ,  H01L21/02

Abstract: A process chamber and a substrate processing apparatus including the same are disclosed. The process chamber includes a first housing and a second housing on the first housing. The first housing includes a first outer wall, a first partition wall facing the first outer wall, and a first side wall connecting the first outer wall and the first partition wall. The second housing includes a second outer wall, a second partition wall between the second outer wall and the first partition wall, and a second side wall connecting the second outer wall and the second partition wall. Each of the first and second outer walls has a thickness greater than a thickness of the first partition wall and a thickness of the second partition wall.

公开(公告)号：US09852921B2

公开(公告)日：2017-12-26

申请号：US15175062

申请日：2016-06-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyoung Hwan Kim ,  Ingi Kim ,  Mihyun Park ,  Young-Hoo Kim ,  Ui-soon Park ,  Jung-Min Oh ,  Kuntack Lee ,  Hyosan Lee

IPC: G01N15/06 ,  G01N33/00 ,  G01N33/48 ,  H01L21/311 ,  H01L21/67

CPC classification number: H01L21/31111 ,  H01L21/67086 ,  H01L21/67253 ,  H01L21/67288

Abstract: A substrate treating apparatus and a method of treating a substrate, the apparatus including a substrate treater that treats a substrate using a chemical solution, the chemical solution including a phosphoric acid aqueous solution and a silicon compound; and a chemical solution supplier that supplies the chemical solution to the substrate treating unit, wherein the chemical solution supplier includes a concentration measurer that measures concentrations of the chemical solutions, the concentration measurer including a first concentration measurer that measures a water concentration of the chemical solution; and a second concentration measurer that measures a silicon concentration of the chemical solution.

公开(公告)号：US09721801B2

公开(公告)日：2017-08-01

申请号：US14972505

申请日：2015-12-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hongjin Kim ,  Kyoungseob Kim ,  Sungho Shin ,  Kuntack Lee ,  Kihong Cho

IPC: H01L21/306 ,  H01L21/465 ,  H01L21/02 ,  H01L21/67 ,  B24C1/08

CPC classification number: H01L21/30625 ,  B24C1/08 ,  H01L21/02021 ,  H01L21/02057 ,  H01L21/465 ,  H01L21/67219

Abstract: A substrate treating method may include jetting a fluid containing an abrasive onto a substrate, and polishing the substrate using the jetted fluid.

公开(公告)号：US09595434B2

公开(公告)日：2017-03-14

申请号：US14704912

申请日：2015-05-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyoungseob Kim ,  Yongsun Ko ,  Kyoung Hwan Kim ,  SeokHoon Kim ,  Kuntack Lee ,  Hyosan Lee

IPC: H01L21/00 ,  H01L21/02 ,  H01L21/78 ,  H01L21/67

CPC classification number: H01L21/02068 ,  H01L21/67051 ,  H01L21/78

Abstract: A method of manufacturing a semiconductor device includes: forming a pattern on a surface of a semiconductor substrate; placing the substrate on a platform of a substrate treatment apparatus; rotating the wafer while applying a cleaning liquid from a first nozzle and a wetting liquid from a second nozzle to treat a first region on the surface of the substrate; vertically changing the distance of the second nozzle together with the first nozzle with respect to the platform; after the vertical change, rotating the wafer while applying the cleaning liquid from the first nozzle and the wetting liquid from the second nozzle to treat a second region on the surface of the substrate; and forming a semiconductor device from the treated substrate.

Abstract translation: 一种制造半导体器件的方法包括：在半导体衬底的表面上形成图案; 将基板放置在基板处理装置的平台上; 在从第一喷嘴施加清洁液体和来自第二喷嘴的润湿液体的同时旋转晶片以处理基板表面上的第一区域; 与第一喷嘴相对于平台垂直地改变第二喷嘴的距离; 在垂直变化之后，在从第一喷嘴施加清洁液体和来自第二喷嘴的润湿液体的同时转动晶片以处理基板表面上的第二区域; 以及从处理过的衬底形成半导体器件。

公开(公告)号：US20130145640A1

公开(公告)日：2013-06-13

申请号：US13707253

申请日：2012-12-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyosan Lee ,  Yongsun Ko ,  Kyongseob Kim ,  Kwangsu Kim ,  SeokHoon Kim ,  Kuntack Lee ,  Yongmyung Jun ,  Yong-Jhin Cho

IPC: F26B5/04

CPC classification number: H01L21/67034 ,  F26B5/04 ,  H01L21/02052 ,  H01L21/67051 ,  H01L21/6715

Abstract: A substrate treatment apparatus is provided. The apparatus may include a process chamber configured to have an internal space, a substrate supporting member disposed in the process chamber to support a substrate, a first supplying port configured to supply a supercritical fluid to a region of the internal space located below the substrate, a second supplying port configured to supply a supercritical fluid to other region of the internal space located over the substrate, and an exhaust port configured to exhaust the supercritical fluid from the process chamber to an exterior region.

Abstract translation: 提供了一种基板处理装置。 该装置可以包括被配置为具有内部空间的处理室，设置在处理室中以支撑基板的基板支撑构件，被配置为将超临界流体供应到位于基板下方的内部空间的区域的第一供应端口， 第二供应端口，其构造成将超临界流体供应到位于所述基板上方的所述内部空间的其他区域;以及排气端口，其构造成将所述超临界流体从所述处理室排出到外部区域。

公开(公告)号：US12198923B2

公开(公告)日：2025-01-14

申请号：US17660449

申请日：2022-04-25

Applicant: Semes Co., Ltd. ,  Samsung Electronics Co., Ltd.

Inventor： Hae-Won Choi ,  Anton Koriakin ,  Sangjine Park Park ,  Keonyoung Kim ,  Sukhoon Kim ,  Seohyun Kim ,  Young-Hoo Kim ,  Kuntack Lee ,  Jihoon Jeong

IPC: H01L21/02 ,  C11D1/72 ,  C11D3/43 ,  H01L21/67

Abstract: In a substrate processing method, a rinse process using a rinse solution is performed on a development-processed photoresist pattern on a substrate. A substitution process including a first substitution step using a mixed solution of a non-polar organic solvent and a surfactant and a second substitution step using the non-polar organic solvent is performed on the substrate. The substitution process is performed a plurality of times until the rinse solution remaining on the substrate is less than a predetermined value. A supercritical fluid drying process is performed on the substrate to dry the non-polar organic solvent remaining on the substrate.

公开(公告)号：US11964357B2

公开(公告)日：2024-04-23

申请号：US17857289

申请日：2022-07-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seungchul Han ,  Yonghee Lee ,  Taemin Earmme ,  Byoungho Kwon ,  Kuntack Lee

IPC: B24B37/005 ,  B24B37/20

CPC classification number: B24B37/005 ,  B24B37/20

Abstract: A conditioner of a chemical mechanical polishing (CMP) apparatus includes a disk to polish a polishing pad of the CMP apparatus, a driver to rotate the disk, a lifter to lift the driver, an arm to rotate the lifter, and a connector to connect the driver to the lifter, the driver being tiltable with respect to the lifter.

公开(公告)号：US20240120232A1

公开(公告)日：2024-04-11

申请号：US18545644

申请日：2023-12-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangjine PARK ,  Kuntack Lee ,  Jihwan Park ,  Seungmin Shin

IPC: H01L21/687 ,  G03F7/40

CPC classification number: H01L21/68707 ,  G03F7/40 ,  G03F7/2004

Abstract: A substrate processing apparatus includes: a first process chamber in which a developing process is performed by supplying a developer to a substrate that is in a dry state; a second process chamber in which a drying process is performed on the substrate by supplying a supercritical fluid to the substrate on which the developing process is performed and which is in a wet state; a third process chamber in which a bake operation is performed on the substrate on which the drying operation is performed and is in a dry state; a fourth process chamber in which a cooling operation is performed on the substrate on which the bake operation is performed and is in a dry state; and a substrate transferring unit configured to transfer the substrate between the first to fourth process chambers.