DISPLAY PANEL, MANUFACTURING METHOD OF THE SAME, AND ELECTRONIC DEVICE

    公开(公告)号:US20250142967A1

    公开(公告)日:2025-05-01

    申请号:US18914400

    申请日:2024-10-14

    Abstract: A display panel includes a substrate, a gate electrode disposed on the substrate, a two-dimensional semiconductor material layer overlapping the gate electrode, a source electrode and a drain electrode electrically connected to the two-dimensional semiconductor material layer, a first electrode of a micro light-emitting diode electrically connected to the drain electrode, an active layer electrically connected to the first electrode of the micro light-emitting diode, where the active layer includes a quantum well layer surrounded by an ion-doped insulating partition, and a second electrode of the micro light-emitting diode electrically connected to the active layer.

    DISPLAY APPARATUS COMPRISING A PLURALITY OF DRIVER IC, MODULAR DISPLAY APPARATUS AND CONTROL METHOD THEREOF

    公开(公告)号:US20240153468A1

    公开(公告)日:2024-05-09

    申请号:US18534201

    申请日:2023-12-08

    Inventor: Sangwon KIM

    CPC classification number: G09G5/003 G06F3/1446 G09G2300/026 G09G2370/08

    Abstract: A display apparatus of a modular display apparatus including a plurality of display apparatuses includes a communication interface, and a plurality of driver integrated circuits (ICs), where a first driver IC among the plurality of driver ICs is configured to, based on receiving a first signal transmitted by an external device through the communication interface, transmit the first signal to a second driver IC adjacent to the first driver IC such that the first signal is sequentially transmitted to remaining driver ICs among the plurality of driver ICs that are connected in a daisy chain manner, and each of the first driver IC and the second driver IC is configured to transmit a second signal, that is transmitted by the external device, to a first other display apparatus among the plurality of display apparatuses that is connected to the display apparatus.

    ELECTRONIC DEVICE FOR PERFORMING HANDOVER ON BASIS OF STATE OF ELECTRONIC DEVICE, AND OPERATION METHOD OF ELECTRONIC DEVICE

    公开(公告)号:US20230217336A1

    公开(公告)日:2023-07-06

    申请号:US18118171

    申请日:2023-03-07

    CPC classification number: H04W36/24

    Abstract: An example electronic device includes a communication processor for establishing a cellular communication with a first node supporting a first frequency band or a second node supporting a second frequency band; an application processor; and memory. The memory can store instructions which, when executed, control the communication processor such that: the communication processor confirms a service type performed by the cellular communication; the application processor confirms whether or not the state of the electronic device satisfies a predetermined condition set differently in accordance with the service type; and the application processor blocks a connection with the second node and/or releases the connection with the second node, in response to confirming that the state of the electronic device does not satisfy the predetermined condition.

    METHODS OF FORMING GRAPHENE AND GRAPHENE MANUFACTURING APPARATUSES

    公开(公告)号:US20210276873A1

    公开(公告)日:2021-09-09

    申请号:US17190852

    申请日:2021-03-03

    Abstract: A graphene manufacturing apparatus includes a reaction chamber a substrate supporter configured to structurally support a substrate inside the reaction chamber; a plasma generator configured to generate a plasma inside the reaction chamber; a first gas supply configured to supply an inert gas into the reaction chamber at a first height from an upper surface of the substrate supporter in a height direction of the reaction chamber; a second gas supply configured to supply a carbon source into the reaction chamber at a second height from the upper surface of the substrate supporter in the height direction of the reaction chamber; and a third gas supply configured to supply a reducing gas into the reaction chamber, wherein the first to third gas supply units are disposed at different heights at a third height from the upper surface of the substrate supporter in the height direction of the reaction chamber.

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