公开(公告)号：US20170167038A1

公开(公告)日：2017-06-15

申请号：US15278471

申请日：2016-09-28

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： HIROSHI HASHIBA ,  SATOSHI YOTSUHASHI ,  MASAHIRO DEGUCHI ,  YUKI YOSHIOKA ,  TAKAYOSHI YAMAGUCHI ,  TAICHI NAKAMURA

IPC: C25B11/14 ,  C25B3/04

CPC classification number: C25B11/14 ,  C25B3/04 ,  Y02E60/366

Abstract: The present disclosure provides an electrode for an electrolysis device, which allows performance of a catalyst to be efficiently exhibited in an electrochemical reaction of reducing an electrolysis reactant to generate an electrolysis product material. Specifically, a carbon fiber that has a structure in which the carbon fiber contains a part of and/or a whole of a catalyst particle is used as a cathode electrode to greatly improve adherence force of the catalyst particle and enable efficient generation of an electrolysis product material.

公开(公告)号：US20170120396A1

公开(公告)日：2017-05-04

申请号：US15265336

申请日：2016-09-14

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： NAOMICHI OHASHI ,  YUKI YOSHIOKA ,  YASUHIRO SUZUKI ,  HIROHISA HINO ,  MASATO MORI ,  KAZUHIRO NISHIKAWA

IPC: B23K35/362 ,  B23K35/02 ,  B23K35/26 ,  H01L21/56 ,  H05K1/18 ,  H05K3/34 ,  H01L23/00 ,  H01L23/31 ,  B23K1/00 ,  B23K35/36

CPC classification number: B23K35/362 ,  B23K1/0016 ,  B23K35/025 ,  B23K35/264 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/3615 ,  B23K35/3618 ,  H01L21/563 ,  H01L23/3142 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/16227 ,  H01L2224/81411 ,  H01L2224/81413 ,  H01L2224/81815 ,  H01L2924/0665 ,  H01L2924/20102 ,  H05K1/181 ,  H05K3/3436 ,  H05K3/3457 ,  H05K3/3489 ,  H05K3/3494 ,  H05K2201/10734 ,  H05K2203/048 ,  Y02P70/613

Abstract: A solder paste having improved self alignment for soldering is provided. The solder paste includes a solder powder; a composite epoxy resin containing a first epoxy resin that is solid at 25° C., and a second epoxy resin that is liquid at 25° C.; and a curing agent, wherein the first epoxy resin has a softening point that is at least 10° C. lower than the melting point of the solder powder, and is contained in a range of 10 weight parts to 75 weight parts with respect to the total 100 weight parts of the composite epoxy resin.