摘要:
A novel epoxy compound represented by the following general formula (I), and a production process thereof, is provided: Y—(CH2)3—Si(OR1)nR23-n (I) (wherein, Y is represented by any of the following formulas: wherein, R1 and R2 represent alkyl groups having 1 to 5 carbon atoms, n represents an integer of 1 to 3, R3 and R4 represent hydrogen atoms, alkyl groups having 1 to 6 carbon atoms or trialkylsilyl groups having 1 to 4 carbon atoms, R5 represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms or a trialkylsilyl group having 1 to 4 carbon atoms, R6 to R12 represent hydrogen atoms, alkyl groups having 1 to 6 carbon atoms or trialkylsilyl groups having 1 to 4 carbon atoms, and R13 represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, a trialkylsilyl group having 1 to 4 carbon atoms or an aryl group).
摘要:
Novel epoxy compounds having imide structures represented by general formula (I) or general formula (II) below, and having an allyl group in the same molecule, as well as a process for their production. (wherein R1 and R2 each represent hydrogen, a C1-6 alkyl group, or a C1-4 trialkylsilyl group) (wherein R3 represents hydrogen, a C1-6 alkyl group, or a C1-4 trialkylsilyl group)
摘要:
Novel epoxy compounds represented by the general formula: (wherein R1 and R2 each represent hydrogen, a C1-6 alkyl group or a C1-4 trialkylsilyl group, each R3 may be the same or different and each independently represents hydrogen, alkyl, aryl, aralkyl, alkenyl or fluoroalkyl, and n is 0 or a positive integer), and the general formula: (wherein R3 represents the same groups specified above, R4 represents hydrogen, a C1-6 alkyl group or a C1-4 trialkylsilyl group, and n is 0 or a positive integer), and a process for their production.
摘要:
Novel epoxy compounds represented by the general formula: (wherein R1 and R2 each represent hydrogen, a C1-6 alkyl group or a C1-4 trialkylsilyl group, each R3 may be the same or different and each independently represents hydrogen, alkyl, aryl, aralkyl, alkenyl or fluoroalkyl, and n is 0 or a positive integer), and the general formula: (wherein R3 represents the same groups specified above, R4 represents hydrogen, a C1-6 alkyl group or a C1-4 trialkylsilyl group, and n is 0 or a positive integer), and a process for their production.
摘要:
A novel epoxy compound represented by the following general formula (I), and a production process thereof, is provided: Y—(CH2)3—Si(OR1)nR23-n (I) (wherein, Y is represented by any of the following formulas: wherein, R1 and R2 represent alkyl groups having 1 to 5 carbon atoms, n represents an integer of 1 to 3, R3 and R4 represent hydrogen atoms, alkyl groups having 1 to 6 carbon atoms or trialkylsilyl groups having 1 to 4 carbon atoms, R5 represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms or a trialkylsilyl group having 1 to 4 carbon atoms, R6 to R12 represent hydrogen atoms, alkyl groups having 1 to 6 carbon atoms or trialkylsilyl groups having 1 to 4 carbon atoms, and R13 represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, a trialkylsilyl group having 1 to 4 carbon atoms or an aryl group).
摘要:
Novel epoxy compounds having imide structures represented by general formula (I) or general formula (II) below, and having an allyl group in the same molecule, as well as a process for their production (wherein R1 and R2 each represent hydrogen, a C1-6 alkyl group, or a C1-4 trialkylsilyl group) (wherein R3 represents hydrogen, a C1-6 alkyl group, or a C1-4 trialkylsilyl group).
摘要:
Provided are a composition containing a quantum dot fluorescent body, a molded body of a quantum dot fluorescent body dispersion resin, a structure containing a quantum dot fluorescent body, a light-emitting device, an electronic apparatus or a mechanical device, and a method for producing the molded body. The quantum dot fluorescent body is dispersed in a cycloolefin (co)polymer, which is a dispersion resin, to form the composition containing a quantum dot fluorescent body. The composition containing the quantum dot fluorescent body is molded, forming the molded body of the quantum dot fluorescent body dispersion resin. A gas barrier layer is formed at a portion or the entirety of the surface of the molded body of the quantum dot fluorescent body dispersion resin. A light-emitting device is configured using the composition containing the quantum dot fluorescent body as a sealing material that seals an LED chip.
摘要:
Provided are a composition that contains a quantum dot fluorescent body and that is able to suppress quenching of the quantum dot fluorescent body, a molded body of a quantum dot fluorescent body dispersion resin, a structure containing a quantum dot fluorescent body, a light-emitting device, an electronic apparatus, or a mechanical device, and a method for producing the molded body of a quantum dot fluorescent body dispersion resin.A quantum dot fluorescent body is dispersed in a cycloolefin (co)polymer that is a dispersion resin to form the composition containing a quantum dot fluorescent body, and the composition containing a quantum dot fluorescent body is molded, forming the molded body of the quantum dot fluorescent body dispersion resin, and a gas barrier layer that reduces the passage of oxygen to the molded body of the quantum dot dispersion resin is formed at a portion or the entirety of the surface of the molded body of the quantum dot fluorescent body dispersion resin, and furthermore, a light-emitting device is configured using the composition containing the quantum dot fluorescent body as a sealing material that seals an LED chip.
摘要:
According to the present invention, a novel epoxy group-containing copolymer, including a production process thereof, and an epoxy (meth)acrylate copolymer starting from the epoxy group-containing copolymer, including a production process thereof are provided. The epoxy group-containing copolymer of the present invention contains a specific epoxy group-containing repeating unit and an olefin-based repeating unit. A novel epoxy (meth)acrylate copolymer of the present invention is produced by reacting the epoxy group-containing copolymer with (meth)acrylic acid.
摘要:
The present invention has an object to provide a curable composition for transfer materials. The curable composition is applicable to a UV nanoimprint process capable of forming micropatterns with high throughput, is applicable to a thermal nanoimprint process in some cases, and is capable of forming a micropattern having high selectivity on etching rates regarding a fluorine-based gas and an oxygen gas. A curable composition for transfer materials of the present invention contains a curable silicon compound produced by subjecting a silicon compound (A) having a Si—H group and a compound (B) having a curable functional group and a carbon-carbon double bond other than the curable functional group to a hydrosilylation reaction.