A novel epoxy compound represented by the following general formula (I), and a production process thereof, is provided: Y—(CH2)3—Si(OR1)nR23-n  (I) (wherein, Y is represented by any of the following formulas: wherein, R1 and R2 represent alkyl groups having 1 to 5 carbon atoms, n represents an integer of 1 to 3, R3 and R4 represent hydrogen atoms, alkyl groups having 1 to 6 carbon atoms or trialkylsilyl groups having 1 to 4 carbon atoms, R5 represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms or a trialkylsilyl group having 1 to 4 carbon atoms, R6 to R12 represent hydrogen atoms, alkyl groups having 1 to 6 carbon atoms or trialkylsilyl groups having 1 to 4 carbon atoms, and R13 represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, a trialkylsilyl group having 1 to 4 carbon atoms or an aryl group).