公开(公告)号：USRE46985E1

公开(公告)日：2018-08-07

申请号：US15653147

申请日：2017-07-18

Applicant: LG ELECTRONICS INC.

Inventor： Byungjoon Rhee

IPC: H01L29/20 ,  H01L25/075 ,  H01L33/48 ,  H01L27/12 ,  H01L33/62 ,  H01L33/50 ,  H05K1/18 ,  H05K1/02 ,  H05K3/32 ,  H05K3/46

CPC classification number: H01L25/0753 ,  H01L27/1248 ,  H01L33/486 ,  H01L33/504 ,  H01L33/507 ,  H01L33/508 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0066 ,  H05K1/0274 ,  H05K1/189 ,  H05K3/323 ,  H05K3/4682 ,  H05K2201/10106 ,  H05K2201/10128 ,  H01L2924/00

Abstract: A display device using a semiconductor light emitting device and a method of fabricating the semiconductor light emitting device are disclosed. The display device includes a substrate, a plurality of first electrodes disposed on the substrate, an anisotropic conductive film disposed on the substrate provided with the first electrodes, a plurality of semiconductor light emitting devices disposed on the anisotropic conductive film layer, electrically connected to the first electrodes, and constituting individual pixels, and a plurality of second electrodes disposed between the semiconductor light emitting devices and electrically connected to the semiconductor light emitting devices. Thus, alignment of the semiconductor light emitting device array may be simplified by use of an anisotropic conductive film Due to excellent brightness, the semiconductor light emitting devices, which are small in size, may form individual sub-pixels. In addition, the distance between the semiconductor light emitting devices is sufficiently long to embody a flexible display device.

公开(公告)号：US09978726B2

公开(公告)日：2018-05-22

申请号：US15140147

申请日：2016-04-27

Applicant: LG ELECTRONICS INC.

Inventor： Byungjoon Rhee ,  Kyuhyun Bang ,  Hwanjoon Choi

IPC: H01L33/54 ,  H01L25/07 ,  H01L25/075 ,  H01L33/62 ,  G06F1/16 ,  G02F1/1333

CPC classification number: H01L25/0753 ,  G02F1/133305 ,  G06F1/1652 ,  H01L33/54 ,  H01L33/62 ,  H01L2933/0016 ,  H01L2933/0066

Abstract: A display device including a substrate including a wiring electrode; a plurality of semiconductor light emitting devices electrically connected to the wiring electrode; and an intermediate electrode extending along one direction to be electrically connected to conductive electrodes of adjoining semiconductor light emitting devices, covering the conductive electrodes, and facing the wiring electrode to be electrically connected to the wiring electrode.

公开(公告)号：US12170345B2

公开(公告)日：2024-12-17

申请号：US17631781

申请日：2019-09-03

Applicant: LG ELECTRONICS INC.

Inventor： Byungjoon Rhee

IPC: H01L33/38 ,  H01L25/075 ,  H01L33/00 ,  H01L33/50 ,  H01L33/62

Abstract: The present invention provides a display device using a semiconductor light-emitting element and a manufacturing method therefor, the display device transferring semiconductor light-emitting elements on a temporary substrate, and then directly implementing, through a stack process, the structure of a wiring substrate on the temporary substrate on which the semiconductor light-emitting elements are arrayed, thereby enabling the semiconductor light-emitting elements and the wiring substrate to be electrically connected.

公开(公告)号：US09627363B2

公开(公告)日：2017-04-18

申请号：US14794305

申请日：2015-07-08

Applicant: LG ELECTRONICS INC.

Inventor： Chisun Kim ,  Byungjoon Rhee ,  Bongchu Shim

IPC: H01L25/07 ,  H01L25/075 ,  G09F9/33 ,  H01L33/62 ,  H01L33/20

CPC classification number: H01L25/0753 ,  G09F9/33 ,  H01L33/20 ,  H01L33/62 ,  H01L2224/95 ,  H05K1/189 ,  H05K3/323 ,  H05K3/4682 ,  H05K2201/10106 ,  H05K2201/10128

Abstract: A display device including a wiring substrate having a wiring electrode; a plurality of semiconductor light emitting devices which form pixels; and a conductive adhesive layer configured to electrically connect the wiring electrode with the plurality of semiconductor light emitting devices. Further, the conductive adhesive layer includes a body provided with a resin having an adhesive property; and a metallic aggregation part disposed in the body, and formed as metallic atoms precipitated from a metal-organic compound and aggregated with each other.

公开(公告)号：US09252346B2

公开(公告)日：2016-02-02

申请号：US14463452

申请日：2014-08-19

Applicant: LG Electronics Inc.

Inventor： Byungjoon Rhee

IPC: H01L27/15 ,  H01L29/267 ,  H01L33/00 ,  H01L31/0203 ,  H01L23/495 ,  H01L23/48 ,  H01L23/52 ,  H01L23/12 ,  H01L29/40 ,  H01L33/62 ,  C09J9/02 ,  H01L23/00 ,  H01L33/36 ,  H01L51/52 ,  H01L33/38 ,  H01L23/482 ,  H01L23/532 ,  H01L23/492

CPC classification number: H01L33/62 ,  C09J9/02 ,  C09J2201/602 ,  H01L23/4828 ,  H01L23/4922 ,  H01L23/5328 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L33/36 ,  H01L33/38 ,  H01L51/5246 ,  H01L2224/0401 ,  H01L2224/1134 ,  H01L2224/1411 ,  H01L2224/2929 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/29561 ,  H01L2224/29644 ,  H01L2224/29655 ,  H01L2224/81191 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2225/1058 ,  H01L2924/12041 ,  H01L2924/156 ,  H01L2924/35 ,  H01L2924/36 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83

Abstract: A semiconductor device includes an electrode including a plurality of pillars, a semiconductor element configured to be electrically-connected with the electrode, a substrate having electrode patterns, and a conductive adhesive layer located between the substrate and the electrode, the conductive adhesive layer including conductive substances configured to electrically-connect the pillars and the electrode patterns to each other, and including a body which encloses the conductive substances.

Abstract translation: 一种半导体器件包括：包括多个柱的电极，被配置为与电极电连接的半导体元件，具有电极图案的基板和位于基板和电极之间的导电粘合剂层，导电粘合剂层包括导电 构造为将柱和电极图案彼此电连接的物质，并且包括包围导电物质的主体。

公开(公告)号：US20150228865A1

公开(公告)日：2015-08-13

申请号：US14425587

申请日：2013-06-05

Applicant: LG ELECTRONICS INC.

Inventor： Byungjoon Rhee

IPC: H01L33/50 ,  H01L33/38 ,  H01L33/32 ,  H01L27/15 ,  H01L33/00

CPC classification number: H01L33/50 ,  G09G3/32 ,  H01L24/01 ,  H01L25/0753 ,  H01L27/156 ,  H01L33/0025 ,  H01L33/32 ,  H01L33/38 ,  H01L2251/558 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H05B33/14 ,  H01L2924/00

Abstract: A display device using semiconductor light emitting devices is disclosed. The display device includes a substrate, a plurality of first electrodes disposed on the substrate, a light emitting device array comprising a plurality of semiconductor light emitting devices electrically connected to the first electrodes, constituting individual pixels, and having different brightnesses increasing from one side of a current input direction of each of the first electrodes to the other side of the current input direction, and a plurality of second electrodes electrically connected to the semiconductor light emitting devices. Thus, brightness variation caused by power loss may be reduced in a display device of PM type using light emitting device array, thereby reducing load effect that is a problem of the device of PM type using light emitting device array.

Abstract translation: 公开了一种使用半导体发光器件的显示装置。 显示装置包括基板，设置在基板上的多个第一电极，发光器件阵列，包括电连接到第一电极的多个半导体发光器件，构成各个像素，并且具有从 每个第一电极到当前输入方向的另一侧的电流输入方向，以及电连接到半导体发光器件的多个第二电极。 因此，在使用发光装置阵列的PM型显示装置中，由于功率损失引起的亮度变化可能会降低，从而降低使用发光器件阵列的PM型器件的问题的负载效应。

公开(公告)号：US11387396B2

公开(公告)日：2022-07-12

申请号：US16962325

申请日：2018-02-01

Applicant: LG ELECTRONICS INC.

Inventor： Byungjoon Rhee

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/50 ,  H01L33/60

Abstract: Discussed is a display apparatus and, more particularly, to a display apparatus using a semiconductor light emitting device. A display apparatus includes a substrate having a first wiring; a rib portion provided with a first rib and a second rib formed to protrude from one surface of the substrate, the first and second ribs disposed on opposite sides of the first wiring; a solderable metal filled between the first rib and the second rib, and formed to cover the first wiring; and a plurality of semiconductor light emitting devices sequentially arranged along the rib portion, at least part of the plurality of semiconductor light emitting devices are inserted into the solderable metal to be electrically connected to the first wiring.

公开(公告)号：US09799634B2

公开(公告)日：2017-10-24

申请号：US14774571

申请日：2014-03-26

Applicant: LG ELECTRONICS INC.

Inventor： Byungjoon Rhee

IPC: H01L25/075 ,  H01L23/00 ,  H01L25/00 ,  H01L33/44 ,  H01L33/50 ,  H01L33/56 ,  H05K1/02 ,  H05K1/18 ,  H05K3/32 ,  H05K3/46

CPC classification number: H01L25/0753 ,  H01L24/95 ,  H01L25/50 ,  H01L33/44 ,  H01L33/50 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2924/12041 ,  H05K1/0274 ,  H05K1/189 ,  H05K3/323 ,  H05K3/4682 ,  H05K2201/10106 ,  H05K2201/10128 ,  H01L2924/00

Abstract: The present disclosure relates to a display device, and more particularly, to a display device using a semiconductor light emitting device. Such a display device using a semiconductor light emitting device may include a first substrate comprising an electrode portion, a conductive adhesive layer located on the first substrate, and a plurality of semiconductor light emitting devices at least part of which are buried in an upper region of the conductive adhesive layer to constitute individual pixels electrically connected to the electrode portion.

公开(公告)号：US09425173B2

公开(公告)日：2016-08-23

申请号：US14463417

申请日：2014-08-19

Applicant: LG Electronics Inc.

Inventor： Byungjoon Rhee

IPC: H01L27/15 ,  H01L25/075 ,  H01L33/00 ,  H01L33/46

CPC classification number: H01L25/0753 ,  H01L27/156 ,  H01L33/0079 ,  H01L33/46 ,  H01L2224/14

Abstract: A display device according to an embodiment of the present disclosure may include a lower substrate disposed with a line electrode at an upper portion thereof, a plurality of semiconductor light emitting devices electrically connected to the line electrode to generate light and disposed to be separated from one another, and an adhesive portion including a body configured to fix the location of the lower substrate to that of the semiconductor light emitting device, and a conductor dispersed within the body to electrically connect the lower substrate to the semiconductor light emitting device, wherein the plurality of semiconductor light emitting devices form one pixel region (P) having red, green and blue semiconductor light emitting devices that emit red, green and blue light, and contain a material selected from inorganic semiconductor materials, and the adhesive portion blocks light generated from the plurality of semiconductor light emitting devices.

Abstract translation: 根据本公开的实施例的显示装置可以包括在其上部设置有线电极的下基板，多个半导体发光器件，电连接到线电极以产生光并且被布置成与一个 另一方面，以及包括被配置为将下基板的位置固定到半导体发光器件的位置的主体的粘合部分以及分散在主体内的导体，以将下基板电连接到半导体发光器件，其中多个 的半导体发光器件形成具有发射红色，绿色和蓝色光的红色，绿色和蓝色半导体发光器件的一个像素区域（P），并且包含从无机半导体材料中选择的材料，并且粘合剂部分阻挡从 多个半导体发光器件。

公开(公告)号：US09257482B2

公开(公告)日：2016-02-09

申请号：US14510905

申请日：2014-10-09

Applicant: LG ELECTRONICS INC.

Inventor： Byungjoon Rhee

IPC: H01L33/00 ,  H01L27/15 ,  H01L33/50 ,  H01L33/44 ,  H01L33/62 ,  H01L21/00

CPC classification number: H01L27/156 ,  H01L33/44 ,  H01L33/504 ,  H01L33/62 ,  H01L2933/0016

Abstract: Discussed is a display device using a semiconductor light emitting device. In a display device including a plurality of semiconductor light emitting devices, each of the plurality of semiconductor light emitting devices includes a first conductive semiconductor layer, a second conductive semiconductor layer overlapped with the first conductive semiconductor layer, an active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer, a first electrode deposited on the first conductive semiconductor layer, and a second electrode deposited on the second conductive semiconductor layer, wherein the first electrode is extended toward an adjoining semiconductor light emitting device to be electrically connected to the adjoining semiconductor light emitting device.

Abstract translation: 讨论的是使用半导体发光器件的显示装置。 在包括多个半导体发光器件的显示装置中，多个半导体发光器件中的每一个包括第一导电半导体层，与第一导电半导体层重叠的第二导电半导体层，设置在第一导电半导体层之间的有源层 半导体层和第二导电半导体层，沉积在第一导电半导体层上的第一电极和沉积在第二导电半导体层上的第二电极，其中第一电极朝相邻的半导体发光器件延伸以电连接到 相邻的半导体发光器件。