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公开(公告)号：US09903708B2
公开(公告)日：2018-02-27
申请号：US15063057
申请日：2016-03-07
Applicant: KLA-Tencor Corporation
Inventor： Chunhai Wang , Chunsheng Huang , Andrew An Zeng , Frederick Arnold Goodman , Shouhong Tang , Yi Zhang
CPC classification number: G01B11/06 , G01B9/02021 , G01B9/0203 , G01B11/24 , G01B11/2441 , G01B2290/70 , G02B17/008 , G02B27/283 , H04N5/225
Abstract: A semiconductor measuring tool has a folding mirror configuration that directs a light beam to pass the same space multiple times to reduce the size and footprint. Furthermore, the folding mirrors may reflect the light beam at less than forty-five degrees; thereby allowing for smaller folding mirrors as compared to the prior art.
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2.发明申请Method and Apparatus to Fold Optics in Tools for Measuring Shape and/or Thickness of a Large and Thin Substrate 有权用于测量大薄薄基板的形状和/或厚度的工具中折叠光学的方法和装置公开(公告)号：US20160265904A1
公开(公告)日：2016-09-15
申请号：US15063057
申请日：2016-03-07
Applicant: KLA-Tencor Corporation
Inventor： Chunhai Wang , Chunsheng Huang , Andrew An Zeng , Frederick Arnold Goodman , Shouhong Tang , Yi Zhang
CPC classification number: G01B11/06 , G01B9/02021 , G01B9/0203 , G01B11/24 , G01B11/2441 , G01B2290/70 , G02B17/008 , G02B27/283 , H04N5/225
Abstract: A semiconductor measuring tool has a folding mirror configuration that directs a light beam to pass the same space multiple times to reduce the size and footprint. Furthermore, the folding mirrors may reflect the light beam at less than forty-five degrees; thereby allowing for smaller folding mirrors as compared to the prior art.
Abstract translation: 半导体测量工具具有折射镜配置，其引导光束多次通过相同的空间以减小尺寸和占地面积。 此外，折叠镜可以以小于四十五度反射光束; 从而允许与现有技术相比较小的折叠镜。
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Patent Agency Ranking
公开(公告)号：US10324045B2
公开(公告)日：2019-06-18
申请号：US15230330
申请日：2016-08-05
Applicant: KLA-Tencor Corporation
Inventor： Steve (Yifeng) Cui , Chunsheng Huang , Chunhai Wang , Christian Wolters , Bret Whiteside , Anatoly G. Romanovsky , Chuanyong Huang , Donald Warren Pettibone
IPC: G01N21/88 , G01N21/00 , G01N21/95 , G01N21/956
Abstract: Methods and systems for reducing illumination intensity while scanning over large particles are presented herein. A surface inspection system determines the presence of a large particle in the inspection path of a primary measurement spot using a separate leading measurement spot. The inspection system reduces the incident illumination power while the large particle is within the primary measurement spot. The primary measurement spot and the leading measurement spot are separately imaged by a common imaging collection objective onto one or more detectors. The imaging based collection design spatially separates the image of the leading measurement spot from the image of the primary measurement spot at one or more wafer image planes. Light detected from the leading measurement spot is analyzed to determine a reduced power time interval when the optical power of the primary illumination beam and the leading illumination beam are reduced.
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4.发明授权公开(公告)号：US09163928B2
公开(公告)日：2015-10-20
申请号：US13864701
申请日：2013-04-17
Applicant: KLA-Tencor Corporation
Inventor： Shouhong Tang , Chunhai Wang , Andrew An Zeng
CPC classification number: G01B9/02072 , G01B9/02021 , G01B9/02027 , G01B11/06 , G01B11/2441
Abstract: A calibration wafer and a method for calibrating an interferometer system are disclosed. The calibration method includes: determining locations of the holes defined in the calibration wafer based on two opposite intensity frame; comparing the locations of the holes against the locations measured utilizing an external measurement device; adjusting a first optical magnification or a second optical magnification at least partially based on the comparison result; defining a distortion map for each of the first and second intensity frames based on the comparison of the locations of the holes; generating an extended distortion map for each of the first and second intensity frames by map fitting the distortion map; and utilizing the extended distortion map for each of the first and second intensity frames to reduce at least one of: a registration error or an optical distortion in a subsequent measurement process.
Abstract translation: 公开了一种用于校准干涉仪系统的校准晶片和方法。 校准方法包括：基于两个相对强度的帧确定校准晶片中限定的孔的位置; 比较孔的位置与使用外部测量装置测量的位置; 至少部分地基于比较结果调整第一光学倍率或第二光学倍率; 基于孔的位置的比较来定义第一和第二强度帧中的每一个的失真图; 通过映射拟合失真图来生成第一和第二强度帧中的每一个的扩展失真图; 以及利用所述第一和第二强度帧中的每一个的所述扩展失真图来减少随后测量过程中的注册误差或光学失真中的至少一个。
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5.发明申请REDUCING REGISTRATION ERROR OF FRONT AND BACK WAFER SURFACES UTILIZING A SEE-THROUGH CALIBRATION WAFER 审中-公开使用透彻的校准波形减少正面和背面表面的注册错误公开(公告)号：US20150192404A1
公开(公告)日：2015-07-09
申请号：US14661718
申请日：2015-03-18
Applicant: KLA-Tencor Corporation
Inventor： Shouhong Tang , Andrew Zeng , Chunhai Wang , Yaroslov Dudin , Steve Yifeng Cui , Jei-Fei Zheng , Yi Zhang
CPC classification number: G01B9/02072 , G01B3/30 , G01B9/02021 , G01B9/02027 , G01B11/06 , G01B11/2441 , G01B21/042 , G01B2210/44 , G01B2210/48
Abstract: A calibration wafer and a method for calibrating an interferometer system are disclosed. The calibration method includes: determining locations of the holes defined in the calibration wafer based on two opposite intensity frame; comparing the locations of the holes against the locations measured utilizing an external measurement device; adjusting a first optical magnification or a second optical magnification at least partially based on the comparison result; defining a first distortion map for each of the first and second intensity frames based on the comparison of the locations of the holes; generating an extended distortion map for each of the first and second intensity frames by map fitting the first distortion map; and utilizing the extended distortion map for each of the first and second intensity frames to reduce at least one of: a registration error or an optical distortion in a subsequent measurement process.
Abstract translation: 公开了一种用于校准干涉仪系统的校准晶片和方法。 校准方法包括：基于两个相对强度的帧确定校准晶片中限定的孔的位置; 比较孔的位置与使用外部测量装置测量的位置; 至少部分地基于比较结果调整第一光学倍率或第二光学倍率; 基于孔的位置的比较，为第一和第二强度帧中的每一个定义第一失真图; 通过对所述第一和第二强度帧中的每一个通过映射拟合所述第一失真图来生成扩展失真图; 以及利用所述第一和第二强度帧中的每一个的所述扩展失真图来减少随后测量过程中的注册误差或光学失真中的至少一个。
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6.发明申请公开(公告)号：US20140313516A1
公开(公告)日：2014-10-23
申请号：US13864701
申请日：2013-04-17
Applicant: KLA-Tencor Corporation
Inventor： Shouhong Tang , Chunhai Wang , Andrew An Zeng
IPC: G01B9/02
CPC classification number: G01B9/02072 , G01B9/02021 , G01B9/02027 , G01B11/06 , G01B11/2441
Abstract: A calibration wafer and a method for calibrating an interferometer system are disclosed. The calibration method includes: determining locations of the holes defined in the calibration wafer based on two opposite intensity frame; comparing the locations of the holes against the locations measured utilizing an external measurement device; adjusting a first optical magnification or a second optical magnification at least partially based on the comparison result; defining a distortion map for each of the first and second intensity frames based on the comparison of the locations of the holes; generating an extended distortion map for each of the first and second intensity frames by map fitting the distortion map; and utilizing the extended distortion map for each of the first and second intensity frames to reduce at least one of: a registration error or an optical distortion in a subsequent measurement process.
Abstract translation: 公开了一种用于校准干涉仪系统的校准晶片和方法。 校准方法包括：基于两个相对强度的帧确定校准晶片中限定的孔的位置; 比较孔的位置与使用外部测量装置测量的位置; 至少部分地基于比较结果调整第一光学倍率或第二光学倍率; 基于孔的位置的比较来定义第一和第二强度帧中的每一个的失真图; 通过映射拟合失真图来生成第一和第二强度帧中的每一个的扩展失真图; 以及利用所述第一和第二强度帧中的每一个的所述扩展失真图来减少随后测量过程中的注册误差或光学失真中的至少一个。
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公开(公告)号：US20180038803A1
公开(公告)日：2018-02-08
申请号：US15230330
申请日：2016-08-05
Applicant: KLA-Tencor Corporation
Inventor： Steve (Yifeng) Cui , Chunsheng Huang , Chunhai Wang , Christian Wolters , Bret Whiteside , Anatoly G. Romanovsky , Chuanyong Huang , Donald Warren Pettibone
CPC classification number: G01N21/9501 , G01N21/956
Abstract: Methods and systems for reducing illumination intensity while scanning over large particles are presented herein. A surface inspection system determines the presence of a large particle in the inspection path of a primary measurement spot using a separate leading measurement spot. The inspection system reduces the incident illumination power while the large particle is within the primary measurement spot. The primary measurement spot and the leading measurement spot are separately imaged by a common imaging collection objective onto one or more detectors. The imaging based collection design spatially separates the image of the leading measurement spot from the image of the primary measurement spot at one or more wafer image planes. Light detected from the leading measurement spot is analyzed to determine a reduced power time interval when the optical power of the primary illumination beam and the leading illumination beam are reduced.
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