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公开(公告)号：US20240353352A1
公开(公告)日：2024-10-24
申请号：US18626240
申请日：2024-04-03
申请人： KLA Corporation
发明人： Qiang Zhao , Ming Di
CPC分类号： G01N21/9505 , G01N21/8806
摘要： Methods and systems for improved detection of defects of interest and measurement of structures buried within complex three dimensional semiconductor structures are described herein. Through-focus scanning optical microscopy (TSOM) using non-linear, second harmonic generation (SHG) light signals emitted from a sample provides interface-selective sensitivity for metrology and inspection of advanced semiconductor structures. A TSOM/SHG system includes a spectral filter to pass collected light at wavelengths corresponding to SHG emission. In some embodiments, a TSOM/SHG system includes an ultrafast, pulsed laser source emitting ultraviolet to near infrared wavelengths to efficiently induce SHG at surface interfaces. The halving of wavelength inherent to SHG enables a doubling of illumination wavelength without penalizing resolution. In a further aspect, a TSOM/SHG measurement system includes an exogenous illumination source, an external electric field source, or both, to induce a DC electric field at one or more interfaces of structures under illumination, thereby enhancing SHG emission.
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公开(公告)号：US10770362B1
公开(公告)日：2020-09-08
申请号：US16529495
申请日：2019-08-01
申请人： KLA Corporation
发明人： Natalia Malkova , Leonid Poslavsky , Ming Di , Qiang Zhao , Dawei Hu
IPC分类号： H01L21/66 , G01R31/28 , G01N21/27 , G01R31/308
摘要： Methods and systems for determining band structure characteristics of high-k dielectric films deposited over a substrate based on spectral response data are presented. High throughput spectrometers are utilized to quickly measure semiconductor wafers early in the manufacturing process. Optical models of semiconductor structures capable of accurate characterization of defects in high-K dielectric layers and embedded nanostructures are presented. In one example, the optical dispersion model includes a continuous Cody-Lorentz model having continuous first derivatives that is sensitive to a band gap of a layer of the unfinished, multi-layer semiconductor wafer. These models quickly and accurately represent experimental results in a physically meaningful manner. The model parameter values can be subsequently used to gain insight and control over a manufacturing process.
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3.发明公开公开(公告)号：US20240186191A1
公开(公告)日：2024-06-06
申请号：US18210571
申请日：2023-06-15
申请人： KLA Corporation
发明人： Ming Di , Qiang Zhao , Tianhao Zhang , Dawei Hu , Yih Chang , Xi Chen
CPC分类号： H01L22/12 , G01J3/0229 , G01J3/2823
摘要： Methods and systems for measuring values of one or more parameters of interest, including changes in values of one or more parameters of interest, based on measured spectral differences are presented herein. A trained spectral difference based measurement model determines changes in the values of one or more parameters of interest based on a measure of differences in spectra measured before and after one or more process steps. In some examples, a measure of spectral difference is determined based on a difference in measured intensity, a difference in harmonic signal values, or a difference in value of one or more Mueller Matrix elements. A measure of spectral difference may be expressed as a set of difference values, a scalar value, or coefficients of a functional fit to difference values. A measure of spectral difference may be determined based on a weighting of spectral differences according to wavelength.
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公开(公告)号：US20240053280A1
公开(公告)日：2024-02-15
申请号：US18229606
申请日：2023-08-02
申请人： KLA Corporation
发明人： Ming Di , Yih-Chung Chang , Xi Chen , Dawei Hu , Ce Xu , Bowei Huang , Igor Baskin , Mark Allen Neil , Tianhao Zhang , Malik Karman Sadiq , Shankar Krishnan , Jenching Tsai , Carlos L. Ygartua , Yao-Chung Tsao , Qiang Zhao
CPC分类号： G01N21/9501 , H01L22/12
摘要： Methods and systems for compensating systematic errors across a fleet of metrology systems based on a trained error evaluation model to improve matching of measurement results across the fleet are described herein. In one aspect, the error evaluation model is a machine learning based model trained based on a set of composite measurement matching signals. Composite measurement matching signals are generated based on measurement signals generated by each target measurement system and corresponding model-based measurement signals associated with each target measurement system and reference measurement system. The training data set also includes an indication of whether each target system is operating within specification, an indication of the values of system model parameter of each target system, or both. In some embodiments, the composite measurement matching signals driving the training of the error evaluation model are weighted differently, for example, based on measurement sensitivity, measurement noise, or both.
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公开(公告)号：US11796390B2
公开(公告)日：2023-10-24
申请号：US17856660
申请日：2022-07-01
申请人： KLA Corporation
发明人： Tianhan Wang , Aaron Rosenberg , Dawei Hu , Alexander Kuznetsov , Manh Dang Nguyen , Stilian Pandev , John Lesoine , Qiang Zhao , Liequan Lee , Houssam Chouaib , Ming Di , Torsten R. Kaack , Andrei V. Shchegrov , Zhengquan Tan
IPC分类号： G01J3/18 , G01J3/28 , G01N21/55 , G01N21/956 , G01N21/21 , G01N21/25 , G01N21/88 , G01N21/84
CPC分类号： G01J3/18 , G01J3/28 , G01N21/21 , G01N21/25 , G01N21/55 , G01N21/8422 , G01N21/8851 , G01N21/956 , G01J2003/2836 , G01N2021/8883
摘要： A spectroscopic metrology system includes a spectroscopic metrology tool and a controller. The controller generates a model of a multilayer grating including two or more layers, the model including geometric parameters indicative of a geometry of a test layer of the multilayer grating and dispersion parameters indicative of a dispersion of the test layer. The controller further receives a spectroscopic signal of a fabricated multilayer grating corresponding to the modeled multilayer grating from the spectroscopic metrology tool. The controller further determines values of the one or more parameters of the modeled multilayer grating providing a simulated spectroscopic signal corresponding to the measured spectroscopic signal within a selected tolerance. The controller further predicts a bandgap of the test layer of the fabricated multilayer grating based on the determined values of the one or more parameters of the test layer of the fabricated structure.
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公开(公告)号：US20240221149A1
公开(公告)日：2024-07-04
申请号：US18132857
申请日：2023-04-10
申请人： KLA Corporation
发明人： Qiang Zhao , Ming Di
CPC分类号： G06T7/001 , G01N21/95 , G06T7/55 , G06T2207/10152 , G06T2207/30148
摘要： An inspection system may perform an inspection recipe by receiving reference SHG images of a reference structure based on a scan of the reference structure with an illumination beam and collecting second harmonic generation (SHG) light in response to the illumination beam, where the reference structure includes a multilayer structure including one or more inversion-symmetric materials. The system may further receive test SHG images of a test structure based on a scan of the test structure by illuminating the test structure with the illumination beam and collecting the SHG light in response to the illumination beam, where the test structure and the reference structure have a common design. The system may further identify defects in the test structure by comparing the test and reference SHG images.
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公开(公告)号：US20240176206A1
公开(公告)日：2024-05-30
申请号：US18116187
申请日：2023-03-01
申请人： KLA Corporation
发明人： Qiang Zhao , Ming Di , Xi Chen , Shova Subedi , Tianhao Zhang
CPC分类号： G02F1/3532 , G01N21/636 , G01N21/9501 , G01N2021/0125
摘要： A metrology system may include an illumination source to generate an illumination beam and an illumination sub-system to direct the illumination beam to a sample with an inversion-symmetric substrate and one or more films disposed on the inversion-symmetric substrate. The system may further include a filter configured to block a wavelength of the illumination beam and pass a wavelength associated with a second harmonic of the illumination beam and a detector to capture second harmonic generation (SHG) light. The system may further include a controller to receive metrology data from the detector associated with the SHG light from with an interface between the inversion-symmetric substrate and the one or more films and generate one or more metrology measurements associated with the one or more films based on the metrology data.
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公开(公告)号：US20220349752A1
公开(公告)日：2022-11-03
申请号：US17856660
申请日：2022-07-01
申请人： KLA Corporation
发明人： Tianhan Wang , Aaron Rosenberg , Dawei Hu , Alexander Kuznetsov , Manh Dang Nguyen , Stilian Pandev , John Lesoine , Qiang Zhao , Liequan Lee , Houssam Chouaib , Ming Di , Torsten R. Kaack , Andrei V. Shchegrov , Zhengquan Tan
IPC分类号： G01J3/18 , G01J3/28 , G01N21/55 , G01N21/956 , G01N21/21 , G01N21/25 , G01N21/88 , G01N21/84
摘要： A spectroscopic metrology system includes a spectroscopic metrology tool and a controller. The controller generates a model of a multilayer grating including two or more layers, the model including geometric parameters indicative of a geometry of a test layer of the multilayer grating and dispersion parameters indicative of a dispersion of the test layer. The controller further receives a spectroscopic signal of a fabricated multilayer grating corresponding to the modeled multilayer grating from the spectroscopic metrology tool. The controller further determines values of the one or more parameters of the modeled multilayer grating providing a simulated spectroscopic signal corresponding to the measured spectroscopic signal within a selected tolerance. The controller further predicts a bandgap of the test layer of the fabricated multilayer grating based on the determined values of the one or more parameters of the test layer of the fabricated structure.
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