公开(公告)号：US09252063B2

公开(公告)日：2016-02-02

申请号：US14324295

申请日：2014-07-07

Applicant: Infineon Technologies AG

Inventor： Nee Wan Khoo ,  Lay Yeap Lim ,  Tian San Tan

IPC: H01L21/44 ,  H01L21/46 ,  H01L21/66 ,  H01L21/78

CPC classification number: H01L22/14 ,  H01L21/78 ,  H01L22/32 ,  H01L2224/97

Abstract: A leadframe strip includes a plurality of unit leadframes connected to a periphery of the leadframe strip, each unit leadframe having a die paddle, a plurality of leads and a semiconductor die attached to the die paddle. The leadframe strip is tested by electrically isolating at least the leads from the periphery of the leadframe strip such that at least some of the leads extend uninterrupted beyond a final lead outline of the unit leadframes after electrical isolation from the periphery of the leadframe strip. The semiconductor dies are tested, which includes probing the die paddles and the leads that extend uninterrupted beyond the final lead outline of the unit leadframes after electrical isolation from the periphery of the leadframe strip. The unit leadframes are severed from the leadframe strip along the final lead outline of the unit leadframes after testing the semiconductor dies.

Abstract translation: 引线框条包括连接到引线框带的周边的多个单元引线框架，每个单元引线框架具有管芯焊盘，多个引线和连接到管芯焊盘的半导体管芯。 引线框条通过至少将引线与引线框带的周边电隔离来进行测试，使得至少一些引线在与引线框带的外围电绝缘之后不间断延伸超过单元引线框架的最终引线轮廓。 测试半导体管芯，其包括在与引线框架条的周边电绝缘之后探测管芯焊盘和引线，其延伸不间断地超过单元引线框架的最终引线轮廓。 在测试半导体裸片之后，单元引线框架沿引线框架沿着单元引线框架的最终引线轮廓被切断。

公开(公告)号：US20140192500A1

公开(公告)日：2014-07-10

申请号：US13738833

申请日：2013-01-10

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Sung Hoe Yeong ,  Lay Yeap Lim ,  Tien Shyang Law

IPC: C25D13/12 ,  H01L23/29

CPC classification number: C25D13/12 ,  C08K2003/2227 ,  C08K2003/385 ,  C09D5/4411 ,  C09D5/4457 ,  C09D7/61 ,  H01L21/56 ,  H01L23/29 ,  H01L23/3157 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A system, a packaged component and a method for making a packaged component are disclosed. In an embodiment a system comprises a component carrier, a component disposed on the component carrier and an insulating layer disposed on an electrically conductive surface of at least one of the component carrier or the component, wherein the insulating layer comprises a polymer and an inorganic material comprising a dielectric strength of equal or greater than 15 ac-kv/mm and a thermal conductivity of equal or greater than 15 W/m*K.

Abstract translation: 公开了一种系统，封装元件和制造封装元件的方法。 在一个实施例中，系统包括部件载体，设置在部件载体上的部件和设置在部件载体或部件中的至少一个的导电表面上的绝缘层，其中绝缘层包括聚合物和无机材料 包括等于或大于15ac-kv / mm的介电强度和等于或大于15W / m * K的热导率。

公开(公告)号：US20150064849A1

公开(公告)日：2015-03-05

申请号：US14015148

申请日：2013-08-30

Applicant: Infineon Technologies AG

Inventor： Nee Wan Khoo ,  Lay Yeap Lim

IPC: H01L23/00

CPC classification number: H01L24/89 ,  H01L21/561 ,  H01L22/14 ,  H01L23/3107 ,  H01L23/495 ,  H01L23/49541 ,  H01L23/49558 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48245 ,  H01L2224/50 ,  H01L2224/73265 ,  H01L2224/73269 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/157 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A lead frame strip includes connected unit lead frames each having a die paddle, a tie bar directly connecting the die paddle to a periphery of the unit lead frame, leads directly connected to the periphery of the unit lead frame and projecting toward the die paddle, and an opening in the periphery adjacent the tie bar. The openings in the periphery of the unit lead frames are spanned with an electrically insulating material that connects the tie bar of each unit lead frame to the periphery of the unit lead frame. The direct connections between the tie bars and the periphery of the unit lead frames are severed prior to subsequent processing, so that the tie bars remain connected to the periphery of the unit lead frames by the electrically insulating material and the die paddles are electrically disconnected from the periphery of the unit lead frames.

Abstract translation: 引线框架条包括连接的单元引线框架，每个引线框架都具有管芯焊盘，将管芯焊盘直接连接到单元引线框架的外围的引导杆直接连接到单元引线框架的周边并朝向管芯焊盘突出， 以及在连接杆附近的周边的开口。 单元引线框架周边的开口用电绝缘材料跨接，每个单元引线框架的连接杆连接到单元引线框架的外围。 在后续处理之前，连接杆和单元引线框架的周边之间的直接连接被切断，使得连接杆通过电绝缘材料保持连接到单元引线框架的外围，并且管芯焊盘与电绝缘材料电连接 单元引线框的周边。

公开(公告)号：US09728492B1

公开(公告)日：2017-08-08

申请号：US15162871

申请日：2016-05-24

Applicant: Infineon Technologies AG

Inventor： Thiong Zhou See ,  Wee Boon Tay ,  Lay Yeap Lim

IPC: H01L21/66 ,  H01L21/78 ,  H01L23/495 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L24/49 ,  H01L21/4842 ,  H01L21/561 ,  H01L21/7806 ,  H01L22/14 ,  H01L22/32 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49513 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/17 ,  H01L24/38 ,  H01L24/48 ,  H01L24/83 ,  H01L24/84 ,  H01L2224/04042 ,  H01L2224/16245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2224/37099 ,  H01L2224/37599 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A strip of semiconductor devices includes a plurality of leadframes electrically isolated from each other, a plurality of semiconductor chips, and an encapsulation material. Each leadframe has a first surface and a second surface opposite to the first surface. At least one semiconductor chip of the plurality of semiconductor chips is electrically coupled to the first surface of each leadframe. The encapsulation material encapsulates each semiconductor chip and at least portions of each leadframe.

公开(公告)号：US09263419B2

公开(公告)日：2016-02-16

申请号：US14015148

申请日：2013-08-30

Applicant: Infineon Technologies AG

Inventor： Nee Wan Khoo ,  Lay Yeap Lim

IPC: H01L21/66 ,  H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L24/89 ,  H01L21/561 ,  H01L22/14 ,  H01L23/3107 ,  H01L23/495 ,  H01L23/49541 ,  H01L23/49558 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48245 ,  H01L2224/50 ,  H01L2224/73265 ,  H01L2224/73269 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/157 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A lead frame strip includes connected unit lead frames each having a die paddle, a tie bar directly connecting the die paddle to a periphery of the unit lead frame, leads directly connected to the periphery of the unit lead frame and projecting toward the die paddle, and an opening in the periphery adjacent the tie bar. The openings in the periphery of the unit lead frames are spanned with an electrically insulating material that connects the tie bar of each unit lead frame to the periphery of the unit lead frame. The direct connections between the tie bars and the periphery of the unit lead frames are severed prior to subsequent processing, so that the tie bars remain connected to the periphery of the unit lead frames by the electrically insulating material and the die paddles are electrically disconnected from the periphery of the unit lead frames.

Abstract translation: 引线框架条包括连接的单元引线框架，每个引线框架都具有管芯焊盘，将管芯焊盘直接连接到单元引线框架的外围的引导杆直接连接到单元引线框架的周边并朝向管芯焊盘突出， 以及在连接杆附近的周边的开口。 单元引线框架周边的开口用电绝缘材料跨接，每个单元引线框架的连接杆连接到单元引线框架的外围。 在后续处理之前，连接杆和单元引线框架的周边之间的直接连接被切断，使得连接杆通过电绝缘材料保持连接到单元引线框架的外围，并且管芯焊盘与电绝缘材料电连接 单元引线框的周边。

公开(公告)号：US20160005663A1

公开(公告)日：2016-01-07

申请号：US14324295

申请日：2014-07-07

Applicant: Infineon Technologies AG

Inventor： Nee Wan Khoo ,  Lay Yeap Lim ,  Tian San Tan

IPC: H01L21/66 ,  H01L21/78

CPC classification number: H01L22/14 ,  H01L21/78 ,  H01L22/32 ,  H01L2224/97

Abstract: A leadframe strip includes a plurality of unit leadframes connected to a periphery of the leadframe strip, each unit leadframe having a die paddle, a plurality of leads and a semiconductor die attached to the die paddle. The leadframe strip is tested by electrically isolating at least the leads from the periphery of the leadframe strip such that at least some of the leads extend uninterrupted beyond a final lead outline of the unit leadframes after electrical isolation from the periphery of the leadframe strip. The semiconductor dies are tested, which includes probing the die paddles and the leads that extend uninterrupted beyond the final lead outline of the unit leadframes after electrical isolation from the periphery of the leadframe strip. The unit leadframes are severed from the leadframe strip along the final lead outline of the unit leadframes after testing the semiconductor dies.

Abstract translation: 引线框条包括连接到引线框带的周边的多个单元引线框架，每个单元引线框架具有管芯焊盘，多个引线和连接到管芯焊盘的半导体管芯。 引线框条通过至少将引线与引线框带的周边电隔离来进行测试，使得至少一些引线在与引线框带的外围电隔离之后不间断地延伸超出单元引线框架的最终引线轮廓。 测试半导体管芯，其包括在与引线框架条的周边电绝缘之后探测管芯焊盘和引线，其延伸不间断地超过单元引线框架的最终引线轮廓。 在测试半导体裸片之后，单元引线框架沿引线框架沿着单元引线框架的最终引线轮廓被切断。

公开(公告)号：US09303327B2

公开(公告)日：2016-04-05

申请号：US13738833

申请日：2013-01-10

Applicant: Infineon Technologies AG

Inventor： Sung Hoe Yeong ,  Lay Yeap Lim ,  Tien Shyang Law

IPC: H05K1/18 ,  C25D13/12 ,  H01L23/29 ,  H01L21/56 ,  H01L23/31

CPC classification number: C25D13/12 ,  C08K2003/2227 ,  C08K2003/385 ,  C09D5/4411 ,  C09D5/4457 ,  C09D7/61 ,  H01L21/56 ,  H01L23/29 ,  H01L23/3157 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A system, a packaged component and a method for making a packaged component are disclosed. In an embodiment a system comprises a component carrier, a component disposed on the component carrier and an insulating layer disposed on an electrically conductive surface of at least one of the component carrier or the component, wherein the insulating layer comprises a polymer and an inorganic material comprising a dielectric strength of equal or greater than 15 ac-kv/mm and a thermal conductivity of equal or greater than 15 W/m*K.

Abstract translation: 公开了一种系统，封装元件和制造封装元件的方法。 在一个实施例中，系统包括部件载体，设置在部件载体上的部件和设置在部件载体或部件中的至少一个的导电表面上的绝缘层，其中绝缘层包括聚合物和无机材料 包括等于或大于15ac-kv / mm的介电强度和等于或大于15W / m * K的热导率。