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    Optical devices and opto-electronic modules and methods for manufacturing the same
    1.
    发明授权
    Optical devices and opto-electronic modules and methods for manufacturing the same 有权
    光器件和光电模块及其制造方法

    公开(公告)号：US09490287B2

    公开(公告)日：2016-11-08

    申请号：US14366770

    申请日：2012-12-18

    Applicant: HEPTAGON MICRO OPTICS PTE. LTD. ,  HEPTAGON OY

    Inventor： Markus Rossi ,  Hartmut Rudmann ,  Stephan Heimgartner ,  Alexander Bietsch ,  Robert Lenart

    IPC: G02B27/10 ,  H01L27/146 ,  H01L27/148

    CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14683 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H01L27/14818 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The optical device comprises a first substrate (SI) comprising at least one optical structure (1) comprising a main portion (2) and a surrounding portion (3) at least partially surrounding said main portion. The device furthermore comprises non-transparent material (5, 5a, 5b) applied onto said surrounding portion. The opto-electronic module comprises a plurality of these optical devices comprised in said first substrate. The method for manufacturing an optical device comprises the steps of a) providing a first substrate comprising at least one optical structure comprising a main portion and a surrounding portion at least partially surrounding said main portion; and b) applying a non-transparent material onto at least said surrounding portion. Said non-transparent material is present on at least said surrounding portion still in the finished optical device.

    Abstract translation: 光学装置包括包括至少一个光学结构（1）的第一基板（S1），该至少一个光学结构（1）包括主要部分（2）和至少部分地围绕所述主要部分的环绕部分（3）。 该装置还包括施加到所述周围部分上的不透明材料（5,5a，5b）。 所述光电模块包括包含在所述第一衬底中的多个这些光学器件。 制造光学器件的方法包括以下步骤：a）提供包括至少一个光学结构的第一衬底，该至少一个光学结构包括至少部分地围绕所述主要部分的主要部分和环绕部分; 以及b）将不透明材料施加到至少所述周围部分上。 所述不透明材料存在于仍在最终光学装置中的至少所述周围部分上。

    Molded Circuit Substrates
    2.
    发明申请
    Molded Circuit Substrates 审中-公开

    公开(公告)号：US20180302990A1

    公开(公告)日：2018-10-18

    申请号：US15766943

    申请日：2016-10-07

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Bojan Tesanovic ,  Simon Gubser ,  Robert Lenart ,  Mario Cesana

    IPC: H05K3/00 ,  H05K1/02 ,  H01L27/146 ,  H01L33/48 ,  H01L33/58

    Abstract: Molded circuit substrates include a conductive layer surrounded by an insulating sidewall. The insulating sidewall further provides a structural component for an electronic module into which the molded circuit substrate is incorporated. Accordingly, the molded circuit substrates can permit better performance, reduce electronic module thickness, and reduce fabrication costs. Methods for fabricating molded circuit substrates can facilitate precise positioning of insulating sidewalls, insulating partitions, electrical contacts and other components.

    OPTICAL ELEMENT STACK ASSEMBLIES
    7.
    发明申请
    OPTICAL ELEMENT STACK ASSEMBLIES 审中-公开

    公开(公告)号：US20180329175A1

    公开(公告)日：2018-11-15

    申请号：US15775232

    申请日：2016-11-04

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Ji Wang ,  Kam Wah Leong ,  Bojan Tesanovic ,  Qichuan Yu ,  Tobias Senn ,  Nicola Spring ,  Robert Lenart

    IPC: G02B9/04 ,  B29C39/10 ,  B29C39/42 ,  G02B7/02

    CPC classification number: G02B9/04 ,  B29C39/10 ,  B29C39/42 ,  B29K2995/0031 ,  B29L2011/00 ,  B29L2011/0016 ,  G02B7/021

    Abstract: Optical stack assemblies and fabrication techniques thereof. The optical stack assembly includes first and second sub-assemblies, each of which include a substrate and a sub-structure fixed to the respective substrate. Each sub-structures includes a respective first edge feature and a respective second edge feature that project away from the substrate of that sub-structure, each second edge feature being disposed laterally closer to an outer periphery of the respective sub-structure than the first edge feature of the same sub-structure. The first edge feature of the first sub-structure is in direct contact with the first edge feature of the second sub¬structure, while the second edge feature of the first sub-structure and the second edge feature of the second sub-structure are attached to one another by adhesive. At least one of the first or second sub-structures includes an optical element on a same side of the sub-structure as the first and second edge features of that sub-structure. The optical element stack assembly further includes a spacer laterally surrounding, and moulded to, the first and second sub-assemblies.

    Optical Devices and Opto-electronic Modules and Methods for Manufacturing The Same
    8.
    发明申请
    Optical Devices and Opto-electronic Modules and Methods for Manufacturing The Same 有权
    光器件和光电模块及其制造方法

    公开(公告)号：US20140339664A1

    公开(公告)日：2014-11-20

    申请号：US14366770

    申请日：2012-12-18

    Applicant: Heptagon Micro Optics Pte. Ltd. ,  Heptagon Oy

    Inventor： Markus Rossi ,  Hartmut Rudmann ,  Stephan Heimgartner ,  Alexander Bietsch ,  Robert Lenart

    IPC: H01L27/146

    CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14683 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H01L27/14818 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The optical device comprises a first substrate (SI) comprising at least one optical structure (1) comprising a main portion (2) and a surrounding portion (3) at least partially surrounding said main portion. The device furthermore comprises non-transparent material (5, 5a, 5b) applied onto said surrounding portion. The opto-electronic module comprises a plurality of these optical devices comprised in said first substrate. The method for manufacturing an optical device comprises the steps of a) providing a first substrate comprising at least one optical structure comprising a main portion and a surrounding portion at least partially surrounding said main portion; and b) applying a non-transparent material onto at least said surrounding portion. Said non-transparent material is present on at least said surrounding portion still in the finished optical device.

    Abstract translation: 光学装置包括包括至少一个光学结构（1）的第一基板（S1），该至少一个光学结构（1）包括主要部分（2）和至少部分地围绕所述主要部分的环绕部分（3）。 该装置还包括施加到所述周围部分上的不透明材料（5,5a，5b）。 所述光电模块包括包含在所述第一衬底中的多个这些光学器件。 制造光学器件的方法包括以下步骤：a）提供包括至少一个光学结构的第一衬底，该至少一个光学结构包括至少部分地围绕所述主要部分的主要部分和环绕部分; 以及b）将不透明材料施加到至少所述周围部分上。 所述不透明材料存在于仍在最终光学装置中的至少所述周围部分上。

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