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    Opto-electronic module
    4.
    发明授权
    Opto-electronic module 有权
    光电模块

    公开(公告)号：US08975108B2

    公开(公告)日：2015-03-10

    申请号：US14303968

    申请日：2014-06-13

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Hartmut Rudmann ,  Alexander Bietsch ,  Susanne Westenhöfer ,  Simon Gubser

    IPC: H01L21/00 ,  H01L31/167 ,  H01L31/12 ,  G01S7/481 ,  H01L31/0232 ,  H01L31/173 ,  G01S17/02

    CPC classification number: H01L31/167 ,  G01S7/4813 ,  G01S17/026 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/12 ,  H01L31/173

    Abstract: An optical proximity sensor module includes a substrate, a light emitter mounted on a first surface of the substrate, the light emitter being operable to emit light at a first wavelength, and a light detector mounted on the first surface of the substrate, the light detector being operable to detect light at the first wavelength. The module includes an optics member disposed substantially parallel to the substrate, and a separation member disposed between the substrate and the optics member. The separation member may surround the light emitter and the light detector, and may include a wall portion that extends from the substrate to the optics member and that separates the light emitter and the light detector from one another. The separation member may be composed, for example, of a non-transparent polymer material containing a pigment, such as carbon black.

    Abstract translation: 光学接近传感器模块包括基板，安装在基板的第一表面上的光发射器，所述发光器可操作以发射第一波长的光;以及光检测器，安装在基板的第一表面上，光检测器 可操作以检测第一波长的光。 该模块包括基本上平行于基板设置的光学部件，以及设置在基板和光学部件之间的分离部件。 分离构件可以围绕光发射器和光检测器，并且可以包括从基板延伸到光学构件并将光发射器和光检测器彼此分离的壁部分。 分离构件可以由例如碳黑等含有颜料的不透明聚合物材料构成。

    Opto-electronic module
    5.
    发明授权
    Opto-electronic module 有权
    光电模块

    公开(公告)号：US08791489B2

    公开(公告)日：2014-07-29

    申请号：US13827264

    申请日：2013-03-14

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Hartmut Rudmann ,  Alexander Bietsch ,  Susanne Westenhoefer ,  Simon Gubser

    IPC: H01L33/00 ,  H01L31/12

    CPC classification number: H01L31/167 ,  G01S7/4813 ,  G01S17/026 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/12 ,  H01L31/173

    Abstract: An optical proximity sensor module includes a substrate, a light emitter mounted on a first surface of the substrate, the light emitter being operable to emit light at a first wavelength, and a light detector mounted on the first surface of the substrate, the light detector being operable to detect light at the first wavelength. The module includes an optics member disposed substantially parallel to the substrate, and a separation member disposed between the substrate and the optics member. The separation member may surround the light emitter and the light detector, and may include a wall portion that extends from the substrate to the optics member and that separates the light emitter and the light detector from one another. The separation member may be composed, for example, of a non-transparent polymer material containing a pigment, such as carbon black.

    Abstract translation: 光学接近传感器模块包括基板，安装在基板的第一表面上的光发射器，该光发射器可操作以发射第一波长的光;以及光检测器，安装在基板的第一表面上，光检测器 可操作以检测第一波长的光。 该模块包括基本上平行于基板设置的光学部件，以及设置在基板和光学部件之间的分离部件。 分离构件可以围绕光发射器和光检测器，并且可以包括从基板延伸到光学构件并将光发射器和光检测器彼此分离的壁部分。 分离构件可以由例如碳黑等含有颜料的不透明聚合物材料构成。

    Method for manufacturing waveguide structures on wafer-level and corresponding waveguide structures
    7.
    发明授权
    Method for manufacturing waveguide structures on wafer-level and corresponding waveguide structures 有权

    公开(公告)号：US10215909B2

    公开(公告)日：2019-02-26

    申请号：US15992273

    申请日：2018-05-30

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Simon Gubser ,  Frank Sobel ,  Alexander Bietsch ,  Jens Geiger

    IPC: F21V8/00 ,  B29D11/00

    Abstract: The waveguide structure can be manufactured on wafer-scale and comprises a holding structure and a first and a second waveguides each having a core and two end faces. The holding structure comprises a separation structure being arranged between the first and the second waveguide and provides an optical separation between the first and the second waveguide in a region between the end faces of the first and second waveguides. A method for manufacturing such a waveguide structure with at least one waveguide comprises shaping replication material by means of tool structures to obtain the end faces, hardening the replication material and removing the tool structures from a waveguide structures wafer comprising a plurality of so-obtained waveguides.

    Method for manufacturing waveguide structures on wafer-level and corresponding waveguide structures
    9.
    发明授权
    Method for manufacturing waveguide structures on wafer-level and corresponding waveguide structures 有权

    公开(公告)号：US10007052B2

    公开(公告)日：2018-06-26

    申请号：US15014244

    申请日：2016-02-03

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Simon Gubser ,  Frank Sobel ,  Alexander Bietsch ,  Jens Geiger

    IPC: F21V8/00 ,  B29D11/00

    CPC classification number: G02B6/0065 ,  B29D11/00663

    Abstract: The waveguide structure can be manufactured on wafer-scale and comprises a holding structure and a first and a second waveguides each having a core and two end faces. The holding structure comprises a separation structure being arranged between the first and the second waveguide and provides an optical separation between the first and the second waveguide in a region between the end faces of the first and second waveguides. A method for manufacturing such a waveguide structure with at least one waveguide comprises shaping replication material by means of tool structures to obtain the end faces, hardening the replication material and removing the tool structures from a waveguide structures wafer comprising a plurality of so-obtained waveguides.

    MANUFACTURE OF OPTICAL ELEMENTS BY REPLICATION AND CORRESPONDING REPLICATION TOOLS AND OPTICAL DEVICES
    10.
    发明申请
    MANUFACTURE OF OPTICAL ELEMENTS BY REPLICATION AND CORRESPONDING REPLICATION TOOLS AND OPTICAL DEVICES 审中-公开

    公开(公告)号：US20170090074A1

    公开(公告)日：2017-03-30

    申请号：US15310842

    申请日：2015-05-14

    Applicant: HEPTAGON MICRO OPTICS PTE LTD.

    Inventor： Alexander Bietsch ,  Michel Barge

    IPC: G02B3/00 ,  B29D11/00

    CPC classification number: G02B3/0031 ,  B29D11/00

    Abstract: A replication tool for producing an optical structure comprising an optical element includes a central section having the shape defining a negative of a portion of the optical structure and a vertically aligned central axis; a surrounding section laterally surrounding the central section; and one or more contact standoffs defining a plane referred to as contact plane. In a first azimuthal range, the surrounding portion provides a first compensation surface facing away from the central axis, and in a second azimuthal range, the surrounding portion provides a second compensation surface facing away from the central axis. In any cross-section containing the central axis in the second azimuthal range, a steepness of the second compensation surface is higher than a steepness of the first compensation surface in any cross-section containing the central axis in the first azimuthal range.

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