公开(公告)号：US09087819B2

公开(公告)日：2015-07-21

申请号：US13334515

申请日：2011-12-22

申请人： Gyujei Lee ,  Kang Won Lee

发明人： Gyujei Lee ,  Kang Won Lee

IPC分类号： H01L23/48 ,  H01L23/538 ,  H01L25/065 ,  H01L23/00 ,  H01L23/52 ,  H01L23/29 ,  H01L23/31

CPC分类号： H01L23/481 ,  H01L23/293 ,  H01L23/3128 ,  H01L23/3171 ,  H01L23/52 ,  H01L23/538 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0657 ,  H01L2224/02377 ,  H01L2224/0401 ,  H01L2224/13009 ,  H01L2224/13014 ,  H01L2224/13018 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13184 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/16237 ,  H01L2224/29099 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06544 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014

摘要： A semiconductor package includes a semiconductor chip having a first surface, a second surface which faces away from the first surface, and through holes which pass through the first surface and the second surface; a dielectric layer formed on one or more of the first surface and the second surface and formed with grooves around the through holes on a fourth surface of the dielectric layer facing away from a third surface of the dielectric layer which is attached to the semiconductor chip; through-silicon vias filling the through holes; and bumps formed on the through-silicon vias and on portions of the dielectric layer around the through-silicon vias and filling the grooves.

摘要翻译： 半导体封装包括具有第一表面，远离第一表面的第二表面和穿过第一表面和第二表面的通孔的半导体芯片; 电介质层，其形成在所述第一表面和所述第二表面的一个或多个上，并且在所述电介质层的第四表面上的所述通孔周围形成有与所述电介质层的附接到所述半导体芯片的第三表面相背离的沟槽; 通孔通孔填充通孔; 以及形成在穿硅通孔上的电介质层的部分上的凸起，并且填充沟槽。

公开(公告)号：US08829657B2

公开(公告)日：2014-09-09

申请号：US13614924

申请日：2012-09-13

申请人： Hyun Joo Kim ,  Kang Won Lee ,  Gyu Jei Lee

发明人： Hyun Joo Kim ,  Kang Won Lee ,  Gyu Jei Lee

IPC分类号： H01L29/06

CPC分类号： H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/06156 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor substrate includes a substrate body divided into device regions and a peripheral region outside the device region, and having one surface, another surface substantially facing away from the one surface, trenches defined in the device regions under the one surface and inner surfaces which are formed due to defining of the trenches; active regions formed in the trenches; and a gettering layer formed between the inner surfaces of the substrate body and the active regions.

摘要翻译： 半导体衬底包括分为器件区域和器件区域外的周边区域的衬底体，并且具有一个表面，大体上背离所述一个表面的另一表面，在所述一个表面下的器件区域中限定的沟槽和内表面， 由于沟槽的界定而形成; 形成在沟槽中的有源区; 以及形成在基板主体的内表面和有源区之间的吸气层。

公开(公告)号：US20120001870A1

公开(公告)日：2012-01-05

申请号：US13176184

申请日：2011-07-05

申请人： Seung Seob LEE ,  Kang Won Lee

发明人： Seung Seob LEE ,  Kang Won Lee

IPC分类号： G06F3/045 ,  B05D3/06 ,  B05D5/12

CPC分类号： G06F3/045 ,  B82Y15/00

摘要： A method of manufacturing a piezoresistive device includes the steps of: producing a polymer structure with an elastically deformable upper surface by processing a polymer material; applying a carbon nanotube solution on the upper surface of the polymer structure in conformity with a predetermined pattern; and drying the carbon nanotube solution to form a carbon nanotube pattern on the upper surface of the polymer structure. A piezoresistive device manufactured by the above method and a piezoresistive-type touch panel provided with the piezoresistive device are also provided.

摘要翻译： 制造压阻器件的方法包括以下步骤：通过加工聚合物材料制造具有可弹性变形的上表面的聚合物结构; 根据预定图案将碳纳米管溶液施加在聚合物结构的上表面上; 并干燥碳纳米管溶液以在聚合物结构的上表面上形成碳纳米管图案。 还提供了通过上述方法制造的压阻器件和设置有压阻器件的压阻式触摸面板。

公开(公告)号：US08669964B2

公开(公告)日：2014-03-11

申请号：US13176184

申请日：2011-07-05

申请人： Seung Seob Lee ,  Kang Won Lee

发明人： Seung Seob Lee ,  Kang Won Lee

IPC分类号： G06F3/045 ,  B05D3/06 ,  B05D5/12

CPC分类号： G06F3/045 ,  B82Y15/00

摘要： A method of manufacturing a piezoresistive device includes the steps of: producing a polymer structure with an elastically deformable upper surface by processing a polymer material; applying a carbon nanotube solution on the upper surface of the polymer structure in conformity with a predetermined pattern; and drying the carbon nanotube solution to form a carbon nanotube pattern on the upper surface of the polymer structure. A piezoresistive device manufactured by the above method and a piezoresistive-type touch panel provided with the piezoresistive device are also provided.

摘要翻译： 制造压阻器件的方法包括以下步骤：通过加工聚合物材料制造具有可弹性变形的上表面的聚合物结构; 根据预定图案将碳纳米管溶液施加在聚合物结构的上表面上; 并干燥碳纳米管溶液以在聚合物结构的上表面上形成碳纳米管图案。 还提供了通过上述方法制造的压阻器件和设置有压阻器件的压阻式触摸面板。

公开(公告)号：US20100248788A1

公开(公告)日：2010-09-30

申请号：US12728357

申请日：2010-03-22

申请人： Hyung Min Yook ,  Sung Sik Yoo ,  Kang Won Lee ,  Myeong Lo Lee ,  Young Ae Kang ,  Hui Chul Yang ,  Yong Ki Min

发明人： Hyung Min Yook ,  Sung Sik Yoo ,  Kang Won Lee ,  Myeong Lo Lee ,  Young Ae Kang ,  Hui Chul Yang ,  Yong Ki Min

IPC分类号： H04W88/02 ,  G09G3/04

CPC分类号： G06F3/04817 ,  G06F3/0481 ,  G06F3/0486 ,  G06F3/04886 ,  G06F3/1415 ,  G06F3/1431 ,  G06F2203/04803 ,  G09G5/14 ,  G09G2340/0407 ,  G09G2340/0414 ,  G09G2340/0421 ,  G09G2340/0442 ,  G09G2340/045 ,  G09G2340/0464 ,  G09G2340/0471 ,  G09G2340/0478

摘要： A method of supporting divided screen areas and a mobile terminal employing the same are disclosed. The method includes: generating input signals for one of sequentially and simultaneously activating a plurality of user functions; activating the user functions according to generated input signals; dividing a screen into divided screen areas that correspond to activated user functions; and outputting functional view areas associated with the activated user functions to the corresponding divided screen areas.

摘要翻译： 公开了一种支持划分的屏幕区域的方法和使用该屏幕区域的移动终端。 该方法包括：产生顺序并同时激活多个用户功能的输入信号; 根据生成的输入信号激活用户功能; 将屏幕分为对应于激活的用户功能的分割屏幕区域; 以及将与激活的用户功能相关联的功能视图区域输出到相应的分割屏幕区域。

公开(公告)号：US09427923B2

公开(公告)日：2016-08-30

申请号：US14233354

申请日：2011-08-31

申请人： Jin Hwan Lee ,  Kyoung Sik Jo ,  Sang Wook Lee ,  Min Young Park ,  Sang Eon Lee ,  Kang Won Lee ,  Jin Ha Kim ,  Heon Kwang Lim ,  Seung Seob Lee

发明人： Jin Hwan Lee ,  Kyoung Sik Jo ,  Sang Wook Lee ,  Min Young Park ,  Sang Eon Lee ,  Kang Won Lee ,  Jin Ha Kim ,  Heon Kwang Lim ,  Seung Seob Lee

IPC分类号： B29D22/00 ,  B29C59/02 ,  B65D1/48 ,  B29C33/38

CPC分类号： B29D22/003 ,  B29C33/3842 ,  B29C59/022 ,  B29C2059/023 ,  B29K2995/0093 ,  B65D1/48

摘要： Provided is an food packing material, manufacturing method and mold thereof having hydrophobicity including a number of columns formed in one side of food packing material. The disclosure may provide food packing material, manufacturing method and mold thereof in which an amount of contents off a wall of the food packing material may be minimized by hydrophobicity.

摘要翻译： 本发明提供一种具有疏水性的食品包装材料，其制造方法和模具，其包括在食品包装材料的一侧形成的多个塔。 本公开可以提供食品包装材料，其制造方法和模具，其中通过疏水性可以使食品包装材料的壁的内容物的量最小化。

公开(公告)号：US20130305816A1

公开(公告)日：2013-11-21

申请号：US13695619

申请日：2012-10-11

申请人： Sung Joon Choi ,  Young Taek Cha ,  Dae Young Shin ,  Kang Won Lee

发明人： Sung Joon Choi ,  Young Taek Cha ,  Dae Young Shin ,  Kang Won Lee

IPC分类号： G01N11/10

CPC分类号： G01N11/10 ,  G01N11/16

摘要： A viscometer for measuring the viscosity of fluid. The viscometer includes: a first chamber and a second chamber separated from the first chamber; a micro channel connecting the first chamber to the second chamber; a first thin film disposed over the first chamber and a second thin film disposed over the second chamber; and a first piezoelectric film disposed over the first thin film and a second piezoelectric film disposed over the second thin film. At least one of the first and second piezoelectric films has a hexagonal shape if a longest distance between a center and an edge of the piezoelectric film is longer than a threshold range and a circular shape if the distance is shorter than the threshold range.

摘要翻译： 用于测量流体粘度的粘度计。 粘度计包括：与第一室分离的第一室和第二室; 将第一室连接到第二室的微通道; 设置在所述第一室上的第一薄膜和设置在所述第二室上的第二薄膜; 以及设置在所述第一薄膜上的第一压电薄膜和设置在所述第二薄膜上的第二压电薄膜。 如果压电膜的中心和边缘之间的最长距离比阈值范围长，并且如果距离小于阈值范围，则第一和第二压电膜中的至少一个具有六边形形状。

公开(公告)号：US09128022B2

公开(公告)日：2015-09-08

申请号：US13695619

申请日：2012-10-11

申请人： Sung Joon Choi ,  Young Taek Cha ,  Dae Young Shin ,  Kang Won Lee

发明人： Sung Joon Choi ,  Young Taek Cha ,  Dae Young Shin ,  Kang Won Lee

IPC分类号： G01N11/16 ,  G01N11/10

CPC分类号： G01N11/10 ,  G01N11/16

摘要： A viscometer for measuring the viscosity of fluid. The viscometer includes: a first chamber and a second chamber separated from the first chamber; a micro channel connecting the first chamber to the second chamber; a first thin film disposed over the first chamber and a second thin film disposed over the second chamber; and a first piezoelectric film disposed over the first thin film and a second piezoelectric film disposed over the second thin film. At least one of the first and second piezoelectric films has a hexagonal shape if a longest distance between a center and an edge of the piezoelectric film is longer than a threshold range and a circular shape if the distance is shorter than the threshold range.

摘要翻译： 用于测量流体粘度的粘度计。 粘度计包括：与第一室分离的第一室和第二室; 将第一室连接到第二室的微通道; 设置在所述第一室上的第一薄膜和设置在所述第二室上的第二薄膜; 以及设置在所述第一薄膜上的第一压电薄膜和设置在所述第二薄膜上的第二压电薄膜。 如果压电膜的中心和边缘之间的最长距离比阈值范围长，并且如果距离小于阈值范围，则第一和第二压电膜中的至少一个具有六边形形状。

公开(公告)号：US20140183201A1

公开(公告)日：2014-07-03

申请号：US14233354

申请日：2011-08-31

申请人： Jin Hwan Lee ,  Kyoung Sik Jo ,  Sang Wook Lee ,  Min Young Park ,  Sang Eon Lee ,  Kang Won Lee ,  Jin Ha Kim ,  Heon Kwang Lim ,  Seung Seob Lee

发明人： Jin Hwan Lee ,  Kyoung Sik Jo ,  Sang Wook Lee ,  Min Young Park ,  Sang Eon Lee ,  Kang Won Lee ,  Jin Ha Kim ,  Heon Kwang Lim ,  Seung Seob Lee

IPC分类号： B29D22/00 ,  B65D1/48

CPC分类号： B29D22/003 ,  B29C33/3842 ,  B29C59/022 ,  B29C2059/023 ,  B29K2995/0093 ,  B65D1/48

摘要： Provided is an food packing material, manufacturing method and mold thereof having hydrophobicity including a number of columns formed in one side of food packing material. The disclosure may provide food packing material, manufacturing method and mold thereof in which an amount of contents off a wall of the food packing material may be minimized by hydrophobicity.

摘要翻译： 本发明提供一种具有疏水性的食品包装材料，其制造方法和模具，其包括在食品包装材料的一侧形成的多个塔。 本公开可以提供食品包装材料，其制造方法和模具，其中通过疏水性可以使食品包装材料的壁的内容物的量最小化。

公开(公告)号：US08692646B2

公开(公告)日：2014-04-08

申请号：US13080024

申请日：2011-04-05

申请人： Kang Won Lee ,  Seung Seob Lee ,  Jung A. Lee ,  Kwang Cheol Lee

发明人： Kang Won Lee ,  Seung Seob Lee ,  Jung A. Lee ,  Kwang Cheol Lee

IPC分类号： H01C10/10 ,  H01C17/00 ,  H01C10/12 ,  H01H65/00 ,  H03K17/96 ,  G06F3/041

CPC分类号： H01C17/00 ,  G06F3/0414 ,  G06F2203/04103 ,  H01C10/10 ,  H01C10/12 ,  H01H65/00 ,  H03K17/9643 ,  Y10T29/49002

摘要： The present invention relates to a touch panel, more specifically a piezoresistive type touch panel. According to the present invention, it is provided a manufacturing method of a piezoresistive type touch panel, comprising manufacturing a polymer membrane in which a piezoresistive type film pattern, of which resistance varies with applied pressure, is embedded; manufacturing a spacer layer and attaching one side of the spacer layer to a surface of the polymer membrane; and then attaching a bottom substrate to the other side of the spacer layer.

摘要翻译： 触摸面板技术领域本发明涉及触摸面板，更具体地，涉及一种压阻式触摸面板。 根据本发明，提供了一种压阻式触摸面板的制造方法，其特征在于，包括：制造聚合物膜，其中嵌入电阻随施加压力而变化的压阻型膜图案; 制造间隔层并将间隔层的一侧附接到聚合物膜的表面; 然后将底部基板附接到间隔层的另一侧。