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公开(公告)号：US12262575B2
公开(公告)日：2025-03-25
申请号：US17312030
申请日：2020-08-07
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Haiyan Sun , Xiaojin Zhang , Dan Wang , Changho Lee
Abstract: Provided is a display substrate including a base substrate, an anode layer, a light-emitting layer, an electron diffusion layer, a hole block layer and a cathode layer which are sequentially stacked along a direction away from the base substrate, wherein a material of the electron diffusion layer comprises a first luminescent material, and a transport speed of holes generated by the anode layer in the electron diffusion layer is less than a transport speed of the holes in the light-emitting layer.
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公开(公告)号：US11469341B2
公开(公告)日：2022-10-11
申请号：US16638523
申请日：2019-10-08
Inventor： Qianqian Bu , Weipin Hu , Dan Wang , Yun Qiu , Xiao Sun , Congcong Wei
IPC: H01L27/14 , H01L31/115 , H01L27/146 , H01L31/0216 , H01L31/0232 , H01L31/18
Abstract: The present disclosure relates to an optical detection panel. The optical detection panel may include a first substrate and a second substrate opposite the first substrate, a photosensitive component and a driving thin film transistor at a side of the second substrate facing the first substrate, a first electrode and a second electrode at a side of the second substrate facing the first substrate, and a plurality of microlenses at a side of the photosensitive component opposite from the second substrate. The second electrode may be connected to the driving thin film transistor.
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3.发明授权公开(公告)号：US11264592B2
公开(公告)日：2022-03-01
申请号：US16475714
申请日：2019-01-10
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Abstract: An encapsulation structure of an organic electroluminescent device includes a substrate, a first inorganic sealing layer and an organic sealing layer. The first inorganic sealing layer is stacked on the substrate, and the organic sealing layer is stacked on a side of the first inorganic sealing layer that is away from the substrate. The organic sealing layer includes a UV light absorbing material and/or a UV resistant polymer material. An encapsulation method of the encapsulation structure of an organic electroluminescent device and a display panel including the encapsulation structure are further provided.
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公开(公告)号：US10914880B2
公开(公告)日：2021-02-09
申请号：US16325311
申请日：2018-05-30
Inventor： Linlin Wang , Dongliang Wang , Dan Wang , Huabin Chen
Abstract: Embodiments of the present disclosure provide a polarizer, a display panel, a display apparatus, and a wearable device. The polarizer includes a polarizing layer and a lens layer arranged in stack, wherein the lens layer includes at least one converging lens.
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公开(公告)号：US10461122B2
公开(公告)日：2019-10-29
申请号：US15759633
申请日：2017-08-18
Inventor： Yanfeng Wang , Xiaoling Xu , Yuanxin Du , Zhenhua Lv , Yun Qiu , Dan Wang , Xue Dong
IPC: H01L27/15 , G02B5/30 , G09G3/00 , H01L27/12 , G02B27/26 , G09G3/20 , H01L33/36 , H01L25/075 , H01L33/44 , G09G3/32 , G02B5/18 , H01L33/58
Abstract: A light emitting diode display panel and a manufacturing method thereof, and a display device. The light emitting diode display panel includes a substrate, a plurality of light emitting diodes arranged in an array on the substrate; a plurality of polarization layers located on a light exit side of the plurality of light emitting diodes respectively, and the plurality of polarization layers are in a one-to-one correspondence to the plurality of light emitting diodes; the plurality of polarization layers include a plurality of first polarization layers and a plurality of second polarization layers having different polarization directions.
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Patent Agency Ranking
公开(公告)号：US10446794B2
公开(公告)日：2019-10-15
申请号：US15761493
申请日：2017-10-10
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Dan Wang
Abstract: A component of top-emitting organic light-emitting device includes an anode, a light-emitting layer, a cathode, a light extraction layer, and an encapsulation layer. The light-emitting layer is arranged over the anode. The cathode is arranged over the light-emitting layer. The light extraction layer is arranged over the cathode. The encapsulation layer is arranged over the light extraction layer. A material of the light extraction layer includes an inorganic material.
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公开(公告)号：US10288957B2
公开(公告)日：2019-05-14
申请号：US15426575
申请日：2017-02-07
Applicant: BOE Technology Group Co., Ltd.
Inventor： Lu Liu , Dan Wang , Yonglian Qi
IPC: H01B1/00 , G02F1/00 , G02B5/20 , G02F1/1343 , C09D5/24 , G02B1/16 , H01B1/12 , C09D163/10 , C09D175/16 , C09D175/14 , C09D4/06 , C09D7/40 , C09D7/61 , C09D7/47 , C09D179/02 , G02F1/1335 , G02F1/1333 , C08K3/30 , C08K3/34 , C08K3/36
Abstract: The embodiments of the invention provide a conductive composition and a method for producing the same, a color filter and a method for producing the same. The invention relates to the display technology field, and can simplify the process for producing the transparent conductive layer, and reduce the production cost; the conductive composition comprises a modified epoxy acrylic resin, a polyurethane acrylic resin, a polyaniline, a photo initiator, a fluorine-containing acrylate monomer, and optionally a filler and an auxiliary agent; wherein, in terms of weight ratio, the modified epoxy acrylic resin comprises 15-30 parts; the polyurethane acrylic resin comprises 10-20 parts; the polyaniline comprises 15-30 parts; the photo initiator comprises 2-4 parts; the fluorine-containing acrylate monomer comprises 15-35 parts; the filler comprises 0-25 parts; and the auxiliary agent comprises 0-8 parts; the conductive composition is useful for producing a display device.
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公开(公告)号：US10283376B2
公开(公告)日：2019-05-07
申请号：US15951267
申请日：2018-04-12
Inventor： Lianjie Qu , Yun Qiu , Dan Wang , Hebin Zhao
Abstract: A chip encapsulating method includes: fixing a plurality of wafers to a first panel level substrate, the wafer including a plurality of chips; forming a re-distribution layer on the wafer for each of the chips; forming each individual chip and the re-distribution layer connected to the chip by cutting; fixing the chip and the re-distribution layer connected thereto to a second panel level substrate; and encapsulating the chip to form an encapsulating layer. A chip encapsulating structure is prepared by the above described chip encapsulating method.
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公开(公告)号：US10274761B2
公开(公告)日：2019-04-30
申请号：US14412915
申请日：2014-05-27
Inventor： Jinku Lv , Rong Tang , Junjie Guo , Dan Wang , Bin Zou , Yutao Hao , Hongyu Zhao , Qian Zhang
Abstract: A detecting device for light-emitting property of a light source is provided and the detecting device for light-emitting property of a light source includes: a positioning device configured for fixing the light source; and a detection apparatus configured for acquiring a parameter of an emergent light from the light source. The detecting device for light-emitting property of a light source can detect the light-emitting property of the light source, thus help to select the chrominance and brightness degree, of a light source, required by a display module, and shorten the researching and manufacturing period for a liquid crystal display.
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公开(公告)号：US09660215B2
公开(公告)日：2017-05-23
申请号：US14891915
申请日：2015-04-13
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Xinwei Gao , Dan Wang , Rui Hong , Chao Kong
CPC classification number: H01L51/524 , H01L51/52 , H01L51/5237 , H01L51/5246 , H01L51/56
Abstract: Embodiments of the present invention disclose a display panel and an encapsulation method thereof, and relate to the field of display technology. The display panel comprises a first substrate and a second substrate which are disposed in opposition to each other. The first substrate and the second substrate are encapsulated by a sealant. In a non-display area of the display panel, a first adsorption layer is disposed on one of the first substrate and the second substrate, and a second adsorption layer is disposed on the other of the first substrate and the second substrate. The first adsorption layer and the second adsorption layer may be attracted to each other by magnetic force. Embodiments of the present invention can effectively avoid the separation of the first substrate and the second substrate due to the stress released during the process of melting the sealant, thereby improving the problem of poor encapsulation caused thereby.
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