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    DISPLAY SUBSTRATE AND DISPLAY APPARATUS
    1.
    发明申请
    DISPLAY SUBSTRATE AND DISPLAY APPARATUS 有权

    公开(公告)号：US20250008822A1

    公开(公告)日：2025-01-02

    申请号：US18264033

    申请日：2022-11-17

    Applicant: BOE Technology Group Co., Ltd.

    Inventor： Pinfan Wang ,  Zheng Liu ,  Rui Hong ,  Tao Sun ,  Bingwei Wang ,  Zunqing Song

    IPC: H10K59/80 ,  H10K59/121 ,  H10K59/131

    Abstract: A display substrate is provided. The display substrate includes a plurality of islands, a plurality of gaps, and a plurality of bridges; wherein a respective island of the plurality of islands includes a base substrate; one or more light emitting elements on the base substrate; and an encapsulating layer on a side of the one or more light emitting elements away from the base substrate, encapsulating the one or more light emitting elements; the encapsulating layer includes a first inorganic encapsulating sub-layer and a second inorganic encapsulating sub-layer; and in a cross-section along a plane perpendicular to the base substrate and intersecting the first inorganic encapsulating sub-layer and the second inorganic encapsulating sub-layer, an outermost edge of the first inorganic encapsulating sub-layer is encapsulated by the second inorganic encapsulating sub-layer, thereby rendering the outermost edge of the first inorganic encapsulating sub-layer unexposed.

    Packaging method, display panel and display apparatus
    5.
    发明授权
    Packaging method, display panel and display apparatus 有权

    公开(公告)号：US10147901B2

    公开(公告)日：2018-12-04

    申请号：US14906028

    申请日：2015-08-19

    Applicant: Boe Technology Group Co., Ltd.

    Inventor： Rui Hong ,  Dan Wang ,  Zhengyin Xu

    IPC: H01L51/56 ,  H01L51/52 ,  H01L27/32 ,  H01L51/00

    Abstract: A packaging method, a display panel, and a display apparatus. The packaging method comprises steps of: forming a frit layer in a packaging area of a first substrate; forming at least a metal thin film and/or at least a silicon thin film on the frit layer formed on the first substrate, and forming at least a metal thin film and/or at least a silicon thin film in a packaging area of a second substrate, wherein one of the outermost thin film formed on the frit layer and the outermost thin film formed is a metal thin film, and the other is a silicon thin film; and vacuum laminating the first substrate and the second substrate, without the use of a laser to irradiate the frit layer during the packaging.

    Frit material, photoelectric packaged device and packaging method thereof, and display apparatus
    9.
    发明授权
    Frit material, photoelectric packaged device and packaging method thereof, and display apparatus 有权

    公开(公告)号：US10196300B2

    公开(公告)日：2019-02-05

    申请号：US15322755

    申请日：2016-01-29

    Applicant: BOE Technology Group Co., Ltd.

    Inventor： Rui Hong

    IPC: C03C8/24 ,  C03C27/06 ,  H01L51/56 ,  C03C3/12 ,  C03C8/04 ,  H01L51/00 ,  H01L51/52 ,  C03C8/14 ,  C03C8/16

    Abstract: Examples of the present invention provide a frit material, a photoelectric packaged device and a packaging method thereof, and a display apparatus. They relates to the field of display technology, and may reduce the bubbles generated during the sintering of the frit material at high temperature, improve the flatness of the surface of the frit material, and increase the proportion of the packaged area after the frit material is adhered to the device substrate, to increase the mechanical strength of the packaged OLED panel, while the viscosity of the frit material is not affected. The frit material comprises frit-powders and an organic material comprising an organic thickener, wherein the frit material further comprises an inorganic thickener consisting of a clay mineral material. Examples of the present invention are used for production of the frit material, the photoelectric packaged device comprising the frit material, and the display apparatus.

    Mask Plate for Laser Irradiation and Method of Laser Encapsulation Using the Same
    10.
    发明申请
    Mask Plate for Laser Irradiation and Method of Laser Encapsulation Using the Same 审中-公开

    公开(公告)号：US20170183767A1

    公开(公告)日：2017-06-29

    申请号：US15314690

    申请日：2016-04-08

    Applicant: BOE Technology Group Co., Ltd.

    Inventor： Rui Hong

    IPC: C23C14/04 ,  H01L51/56 ,  H01L51/52 ,  C23C14/58

    CPC classification number: C23C14/042 ,  C23C14/58 ,  H01L51/5246 ,  H01L51/56

    Abstract: A mask plate for laser irradiation and a method of laser encapsulation using the same are disclosed to improve the display effect of the encapsulated display panel and also the utilization of substrate thereof, so as to reduce the cost. The mask plate includes a laser blocking region and a laser transmitting region surrounding the laser blocking region, wherein the laser blocking region is configured to block laser having a predetermined wavelength; and the laser transmitting region is configured to allow the laser having the predetermined wavelength to transmit there-through; along a direction perpendicular to a surface of the mask plate, a width of a cross-section of the laser transmitting region is smaller than a diameter of a light spot of the laser having the predetermined wavelength.

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