公开(公告)号：US20150044839A1

公开(公告)日：2015-02-12

申请号：US14381039

申请日：2013-03-18

Applicant: BASF SE

Inventor： Simon Braun ,  Christian Bittner ,  Andreas Klipp

IPC: G03F7/42 ,  H01L29/161 ,  H01L29/16 ,  H01L21/02 ,  H01L21/265 ,  H01L21/266 ,  H01L21/027 ,  C11D7/50 ,  H01L29/66

CPC classification number: G03F7/426 ,  C11D7/5004 ,  C11D7/5009 ,  C11D7/5013 ,  C11D7/5022 ,  C11D11/0047 ,  G03F7/425 ,  H01L21/02057 ,  H01L21/0271 ,  H01L21/26513 ,  H01L21/266 ,  H01L21/31133 ,  H01L29/16 ,  H01L29/161 ,  H01L29/66477

Abstract: A photoresist stripping and cleaning composition free from N-alkylpyrrolidones and added quaternary ammonium hydroxides comprising a component (A) which comprises the polar organic solvents N-methylimidazole, dimethylsulfoxide and 1-aminopropane-2-ol.

Abstract translation: 不含N-烷基吡咯烷酮的光致抗蚀剂剥离和清洁组合物和加入的季铵氢氧化物，其包含组分（A），其包含极性有机溶剂N-甲基咪唑，二甲基亚砜和1-氨基丙烷-2-醇。

公开(公告)号：US10538724B2

公开(公告)日：2020-01-21

申请号：US15743848

申请日：2016-07-01

Applicant: BASF SE

Inventor： Christian Bittner ,  Guenter Oetter ,  Andrei Honciuc ,  Andreas Klipp ,  Simon Braun

IPC: C11D11/00 ,  C11D1/12 ,  G03F7/42 ,  G03F7/40

Abstract: The present invention relates to the use of a composition comprising one or more ammonium salt(s) of one or more compounds selected from the group consisting of sulfobutanedioic acid diester(s), (sulfomethyl)-butanedioic acid diester(s), methyl-sulfobutanedioic acid diester(s), sulfoglutaric acid diester(s), and sulfotricarballic acid triester(s), for cleaning or rinsing a product comprising a substrate and supported thereon a patterned material layer having line-space structures with a line width of 50 nm and below. The invention also relates to a corresponding method of making a cleaned or rinsed product comprising a substrate and supported thereon a patterned material layer having line-space structures with a line width of 50 nm or below. The invention also relates to a solution with color of HAZEN number below 1000 and/or a turbidity in the range of from 0.08 to 10 NTU, wherein the solution comprises water and one or more ammonium salt(s) and optionally one or more organic solvent compounds. The invention also relates to a method of making a corresponding solution.

公开(公告)号：US09223221B2

公开(公告)日：2015-12-29

申请号：US14381039

申请日：2013-03-18

Applicant: BASF SE

Inventor： Simon Braun ,  Christian Bittner ,  Andreas Klipp

IPC: H01L21/461 ,  G03F7/42 ,  H01L21/311 ,  C11D7/50 ,  C11D11/00 ,  H01L21/02 ,  H01L21/027 ,  H01L21/265 ,  H01L21/266 ,  H01L29/16 ,  H01L29/161 ,  H01L29/66

CPC classification number: G03F7/426 ,  C11D7/5004 ,  C11D7/5009 ,  C11D7/5013 ,  C11D7/5022 ,  C11D11/0047 ,  G03F7/425 ,  H01L21/02057 ,  H01L21/0271 ,  H01L21/26513 ,  H01L21/266 ,  H01L21/31133 ,  H01L29/16 ,  H01L29/161 ,  H01L29/66477

Abstract: A photoresist stripping and cleaning composition free from N-alkylpyrrolidones and added quaternary ammonium hydroxides comprising a component (A) which comprises the polar organic solvents N-methylimidazole, dimethylsulfoxide and 1-aminopropane-2-ol.

Abstract translation: 不含N-烷基吡咯烷酮的光致抗蚀剂剥离和清洁组合物和加入的季铵氢氧化物，其包含组分（A），其包含极性有机溶剂N-甲基咪唑，二甲基亚砜和1-氨基丙烷-2-醇。

公开(公告)号：US11742197B2

公开(公告)日：2023-08-29

申请号：US17044928

申请日：2019-04-02

Applicant: BASF SE

Inventor： Andreas Klipp ,  Christian Bittner ,  Simon Braun ,  Guenter Oetter ,  Yeni Burk

IPC: H01L21/02 ,  C07C271/12

CPC classification number: H01L21/02057 ,  C07C271/12

Abstract: The use of an organic compound as cleavable additive, preferably as cleavable surfactant, in the modification and/or treatment of at least one surface of a semiconductor substrate is described. Moreover, it is described a method of making a semiconductor substrate, comprising contacting at least one surface thereof with an organic compound, or with a composition comprising it, to treat or modify said surface, cleaving said organic compound into a set of fragments and removing said set of fragments from the contacted surface. More in particular, a method of cleaning or rinsing a semiconductor substrate or an intermediate semiconductor substrate is described. In addition, a compound is described which is suitable for the uses and methods pointed out above and which preferably is a cleavable surfactant.

公开(公告)号：US20180201885A1

公开(公告)日：2018-07-19

申请号：US15743848

申请日：2016-07-01

Applicant: BASF SE

Inventor： Christian Bittner ,  Guenter Oetter ,  Andrei Honciuc ,  Andreas Klipp ,  Simon Braun

IPC: C11D11/00 ,  C11D1/12 ,  G03F7/42 ,  G03F7/40

CPC classification number: C11D11/0047 ,  C11D1/123 ,  G03F7/40 ,  G03F7/425 ,  G03F7/426

Abstract: The present invention relates to the use of a composition comprising one or more ammonium salt(s) of one or more compounds selected from the group consisting of sulfobutanedioic acid diester(s), (sulfomethyl)-butanedioic acid diester(s), methyl-sulfobutanedioic acid diester(s), sulfoglutaric acid diester(s), and sulfotricarballic acid triester(s), for cleaning or rinsing a product comprising a substrate and supported thereon a patterned material layer having line-space structures with a line width of 50 nm and below. The invention also relates to a corresponding method of making a cleaned or rinsed product comprising a substrate and supported thereon a patterned material layer having line-space structures with a line width of 50 nm or below. The invention also relates to a solution with color of HAZEN number below 1000 and/or a turbidity in the range of from 0.08 to 10 NTU, wherein the solution comprises water and one or more ammonium salt(s) and optionally one or more organic solvent compounds. The invention also relates to a method of making a corresponding solution.