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公开(公告)号：US11539086B2
公开(公告)日：2022-12-27
申请号：US17099287
申请日：2020-11-16
Applicant: Apple Inc.
Inventor： Daniel W. Jarvis , David M. DeMuro , Hongli Dai , Julian Malinski , Julien Marcil , Meng Chi Lee , Richard Hung Minh Dinh , Rishabh Bhargava , Steven D. Sterz , Richard M. Mank , Soundararajan Manthiri , Vijayasekaran Boovaragavan
IPC: H01M4/02 , H01M10/42 , H01M10/48 , G01R31/382 , H01M10/44
Abstract: Methods and systems for detecting and compensating for expansion of rechargeable batteries over time. An expansion detector may be coupled to or positioned proximate a rechargeable battery to monitor for expansion thereof. After expansion exceeding a selected threshold is detected, the expansion detector may report the expansion to an associated processing unit. The processing unit may undertake to arrest further rechargeable battery expansion by modifying or changing one or more characteristics of charging and/or discharging circuitry coupled to the rechargeable battery. For example, the processing unit may charge the rechargeable battery at a lower rate or with reduced voltage after detecting expansion.
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公开(公告)号：US10709018B2
公开(公告)日：2020-07-07
申请号：US16426443
申请日：2019-05-30
Applicant: Apple Inc.
Inventor： Yanfeng Chen , Shankar Pennathur , Mandar Painaik , Lan Hoang , Meng Chi Lee
Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.
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公开(公告)号：US10535611B2
公开(公告)日：2020-01-14
申请号：US15042817
申请日：2016-02-12
Applicant: Apple Inc.
Inventor： Flynn P. Carson , Jun Chung Hsu , Meng Chi Lee , Shakti S. Chauhan
IPC: H01L23/552 , H01L23/31 , H01L23/498 , H01L21/48 , H01L21/56 , H01L21/78 , H01L23/00
Abstract: Packages including substrate-less integrated components and methods of fabrication are described are described. In an embodiment, a packaging method includes attaching a ground structure to a carrier and a plurality of components face down to the carrier and laterally adjacent to the ground structure. The plurality of components are encapsulated within a molding compound, and the carrier is removed exposing a plurality of component terminals and a plurality of ground structure terminals. A plurality of packages are singulated.
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公开(公告)号：US20170179039A1
公开(公告)日：2017-06-22
申请号：US14976199
申请日：2015-12-21
Applicant: Apple Inc.
Inventor： Meng Chi Lee , Shakti S. Chauhan , Flynn P. Carson , Jun Chung Hsu , Tha-An Lin
IPC: H01L23/552 , H01L21/56 , H01L23/522 , H01L21/48 , H01L23/528 , H01L23/31
CPC classification number: H01L23/552 , H01L21/4853 , H01L21/486 , H01L21/56 , H01L21/561 , H01L21/568 , H01L23/3128 , H01L23/3157 , H01L23/5226 , H01L23/528 , H01L24/96 , H01L24/97 , H01L2224/04105 , H01L2224/12105 , H01L2224/131 , H01L2224/16227 , H01L2224/97 , H01L2924/10253 , H01L2924/1431 , H01L2924/1434 , H01L2924/1436 , H01L2924/15311 , H01L2924/1815 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H01L2924/014 , H01L2924/00014 , H01L2224/81
Abstract: A system in package (SiP) is disclosed that uses an EMI shield to inhibit EMI or other electrical interference on the components within the SiP. A metal shield may be formed on an upper surface of an encapsulant encapsulating the SiP. The metal shield may be electrically coupled to a ground layer in a printed circuit board (PCB) to form the EMI shield around the SiP. The metal shield may be electrically coupled to the ground layer using one or more conductive structures located in the encapsulant. The conductive structures may be located on a perimeter of the components in the SiP. The conductive structures may provide a substantially vertical connection between the substrate and the shield on the upper surface of the encapsulant.
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公开(公告)号：US20160270213A1
公开(公告)日：2016-09-15
申请号：US15041033
申请日：2016-02-11
Applicant: APPLE INC.
Inventor： Amir Salehi , Vu T. Vo , Wyeman Chen , Chang Liu , Dennis R. Pyper , Steven Patrick Cardinali , Lan Hoang , Siddharth Nangia , Meng Chi Lee , Takayoshi Katahira
CPC classification number: H05K3/284 , B33Y80/00 , H05K1/0224 , H05K2201/0141 , H05K2201/0715 , H05K2201/10242 , H05K2201/10318 , H05K2201/10969 , H05K2201/2036
Abstract: Readily manufactured structures for sealing or encapsulating devices in system-in-a-package modules, such that the modules are easily assembled, have a low-profile, and are space efficient. One example may provide readily manufactured covers for SIP modules. These modules may be easily assembled by attaching the cover to a top side of a substrate. These SIP modules may have a low-profile, for example when their height is reduced using one or more recesses in a bottom surface of a top of the recess, where the one or more recesses are arranged to accept one or more components. These SIP modules may be made space efficient by placing an edge of a cover near an edge of the substrate and connecting the plating of the cover using side plating on, or vias through, the substrate.
Abstract translation: 易于制造的结构，用于将封装或封装在系统级封装模块中，使得模块易于组装，具有薄型，并且具有空间效率。 一个示例可以提供用于SIP模块的容易制造的盖。 这些模块可以通过将盖附接到基板的顶侧来容易地组装。 这些SIP模块可以具有低轮廓，例如当使用凹部的顶部的底部表面中的一个或多个凹部来减小其高度时，其中一个或多个凹部布置成接受一个或多个部件。 这些SIP模块可以通过将盖的边缘放置在基板的边缘附近并且使用侧板或通孔穿过基板来连接盖的镀层来实现空间效率。
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Patent Agency Ranking
公开(公告)号：US20160064780A1
公开(公告)日：2016-03-03
申请号：US14838395
申请日：2015-08-28
Applicant: Apple Inc.
Inventor： Daniel W. Jarvis , David M. DeMuro , Hongli Dai , Julian Malinski , Julien Marcil , Meng Chi Lee , Richard Hung Minh Dinh , Rishabh Bhargava , Steven D. Sterz , Richard M. Mank , Soundararajan Manthiri , Vijayasekaran Boovaragavan
IPC: H01M10/42
CPC classification number: H01M10/4257 , G01R31/3606 , H01M10/44 , H01M10/445 , H01M10/48 , H01M2010/4271 , H01M2220/30
Abstract: Methods and systems for detecting and compensating for expansion of rechargeable batteries over time. An expansion detector may be coupled to or positioned proximate a rechargeable battery to monitor for expansion thereof. After expansion exceeding a selected threshold is detected, the expansion detector may report the expansion to an associated processing unit. The processing unit may undertake to arrest further rechargeable battery expansion by modifying or changing one or more characteristics of charging and/or discharging circuitry coupled to the rechargeable battery. For example, the processing unit may charge the rechargeable battery at a lower rate or with reduced voltage after detecting expansion.
Abstract translation: 随着时间的推移，可充电电池的扩展检测和补偿的方法和系统。 扩展检测器可以耦合到或靠近可再充电电池定位以监测其扩展。 在扩展超过所选择的阈值之后，扩展检测器可以将扩展报告给相关的处理单元。 处理单元可以通过修改或改变耦合到可再充电电池的充电和/或放电电路的一个或多个特性来进一步阻止进一步的充电电池膨胀。 例如，处理单元可以在检测到扩展后以较低的速率或降低的电压对可充电电池充电。
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公开(公告)号：US11164694B2
公开(公告)日：2021-11-02
申请号：US16586606
申请日：2019-09-27
Applicant: Apple Inc.
Inventor： Daniel P. Kumar , Frank Y. Yuan , Xinbo He , Rajarshi Paul , Meng Chi Lee
Abstract: Inductors that generate a reduced spurious electric-field. One example can provide an inductor where the terminals of the inductor are located at positions that reduce the spurious electric field by determining the types of signals conveyed at the terminals of the inductor and then selecting locations for the terminals based on that determination. For example, where a dynamic differential signal is applied to the inductor, the terminals of the inductor can be positioned near a physical center of the inductor.
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公开(公告)号：US20210098187A1
公开(公告)日：2021-04-01
申请号：US16586606
申请日：2019-09-27
Applicant: Apple Inc.
Inventor： Daniel P. Kumar , Frank Y. Yuan , Xinbo He , Rajarshi Paul , Meng Chi Lee
Abstract: Inductors that generate a reduced spurious electric-field. One example can provide an inductor where the terminals of the inductor are located at positions that reduce the spurious electric field by determining the types of signals conveyed at the terminals of the inductor and then selecting locations for the terminals based on that determination. For example, where a dynamic differential signal is applied to the inductor, the terminals of the inductor can be positioned near a physical center of the inductor.
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公开(公告)号：US10966321B2
公开(公告)日：2021-03-30
申请号：US16894463
申请日：2020-06-05
Applicant: Apple Inc.
Inventor： Yanfeng Chen , Shankar Pennathur , Mandar Painaik , Lan Hoang , Meng Chi Lee
Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.
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公开(公告)号：US10115677B2
公开(公告)日：2018-10-30
申请号：US15630346
申请日：2017-06-22
Applicant: Apple Inc.
Inventor： Meng Chi Lee , Shakti S. Chauhan , Flynn P. Carson , Jun Chung Hsu , Tha-An Lin
IPC: H01L29/00 , H01L23/552 , H01L23/528 , H01L23/31 , H01L23/522 , H01L21/48 , H01L21/56 , H01L23/00
Abstract: A system in package (SiP) is disclosed that uses an EMI shield to inhibit EMI or other electrical interference on the components within the SiP. A metal shield may be formed on an upper surface of an encapsulant encapsulating the SiP. The metal shield may be electrically coupled to a ground layer in a printed circuit board (PCB) to form the EMI shield around the SiP. The metal shield may be electrically coupled to the ground layer using one or more conductive structures located in the encapsulant. The conductive structures may be located on a perimeter of the components in the SiP. The conductive structures may provide a substantially vertical connection between the substrate and the shield on the upper surface of the encapsulant.
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