公开(公告)号：US09130136B2

公开(公告)日：2015-09-08

申请号：US13885912

申请日：2012-01-31

申请人： Martin Brandl ,  Tobias Gebuhr ,  Markus Pindl ,  Albert Schneider

发明人： Martin Brandl ,  Tobias Gebuhr ,  Markus Pindl ,  Albert Schneider

IPC分类号： H01L23/495 ,  H01L33/62 ,  H01L21/56 ,  H01L33/00 ,  H01L23/00

CPC分类号： H01L33/62 ,  H01L21/561 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/29 ,  H01L24/83 ,  H01L24/97 ,  H01L33/0095 ,  H01L2224/29191 ,  H01L2224/32245 ,  H01L2224/83192 ,  H01L2924/00013 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

摘要： A leadframe for producing a number of optoelectronic components is specified. At least one mounting region includes a number of chip mounting areas for a number of semiconductor chips. Alongside the mounting region at at least one main area of the leadframe one or more of grooves for reducing mechanical stresses in the leadframe are formed. The groove(s) do not completely penetrate through the leadframe. A method for producing a number of optoelectronic components on a leadframe of this type is furthermore specified.

摘要翻译： 指定了用于生产多个光电子部件的引线框架。 至少一个安装区域包括用于多个半导体芯片的多个芯片安装区域。 在引线框架的至少一个主要区域上的安装区域之外，形成用于减小引线框架中的机械应力的一个或多个凹槽。 凹槽不完全穿透引线框架。 进一步规定了在这种类型的引线框上产生多个光电子部件的方法。

公开(公告)号：US08735928B2

公开(公告)日：2014-05-27

申请号：US13807342

申请日：2011-06-27

申请人： Harald Jäger ,  Michael Zitzlsperger ,  Markus Pindl

发明人： Harald Jäger ,  Michael Zitzlsperger ,  Markus Pindl

IPC分类号： H01L33/60

CPC分类号： H01L33/60 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00014

摘要： A method of producing a surface-mountable semiconductor component including providing an auxiliary carrier made with a plastics material; applying at least one insert and at least one optoelectronic component to a mounting surface of the auxiliary carrier; enclosing the optoelectronic component and the insert in a common molding, wherein the molding covers the optoelectronic component and the insert form-fittingly at least in places, the optoelectronic component and the insert are not in direct contact with one another, and the optoelectronic component and the insert are connected together mechanically by the molding; removing the auxiliary carrier; and producing individual surface-mountable semiconductor components by severing the molding.

摘要翻译： 一种制造可表面安装的半导体部件的方法，包括提供由塑料材料制成的辅助载体; 将至少一个插入件和至少一个光电子部件施加到辅助载体的安装表面; 将光电子部件和插入件封装在共同的模制件中，其中模制件至少在一些地方覆盖光电子部件和插入件，光电子部件和插入件彼此不直接接触，并且光电子部件和 插入件通过模制机械连接在一起; 移除辅助载体; 并通过切割模制件来生产单个的可表面安装的半导体部件。

公开(公告)号：US20140014995A1

公开(公告)日：2014-01-16

申请号：US13983853

申请日：2012-01-19

申请人： Markus Pindl ,  Simon Jerebic ,  Tobias Gebuhr

发明人： Markus Pindl ,  Simon Jerebic ,  Tobias Gebuhr

IPC分类号： H01L33/56

CPC分类号： H01L33/56 ,  H01L33/483 ,  H01L33/505 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2924/00 ,  H01L2924/00014

摘要： An optoelectronic component includes a substrate, a semiconductor chip arranged on the substrate, and a light-transmissive cover, wherein the light-transmissive cover covers at least an area of the semiconductor chip facing away from the substrate, the light-transmissive cover has a hardness greater than that of silicone, and a connecting material is arranged as a potting material between the light-transmissive cover and the substrate such that those areas of the semiconductor chip not covered by the substrate are surrounded by the connecting material, and the connecting material forms a cavity seal.

摘要翻译： 光电子部件包括基板，布置在基板上的半导体芯片和透光盖，其中透光盖覆盖半导体芯片的远离基板的至少一个区域，透光盖具有 硬度大于硅树脂，并且连接材料被布置为在透光性盖和基板之间的灌封材料，使得未被基板覆盖的半导体芯片的那些区域被连接材料包围，并且连接材料 形成空腔密封。

公开(公告)号：US09366395B2

公开(公告)日：2016-06-14

申请号：US14119711

申请日：2012-05-23

申请人： Kirstin Petersen ,  Stephan Preuss ,  Markus Pindl ,  Markus Boss ,  Martin Brandl

发明人： Kirstin Petersen ,  Stephan Preuss ,  Markus Pindl ,  Markus Boss ,  Martin Brandl

IPC分类号： F21V9/16 ,  F21K99/00 ,  H01L33/50 ,  B29D11/00 ,  B29C43/02 ,  H01L33/58 ,  H01L23/00 ,  H01L25/075 ,  B29C43/20

CPC分类号： F21K9/50 ,  B29C43/021 ,  B29C43/20 ,  B29D11/0073 ,  B29D11/00807 ,  F21K9/60 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/505 ,  H01L33/507 ,  H01L33/58 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2933/0091 ,  H01L2924/00

摘要： An optical element for light outcoupling and/or conversion of light includes a light-emitting semiconductor chip with at least one layer selected from a wavelength conversion layer, a scattering layer, a light outcoupling layer and a lens layer, which each includes a plastics material processable in a compression molding method.

摘要翻译： 用于光输出耦合和/或转换光的光学元件包括具有选自波长转换层，散射层，光输出耦合层和透镜层中的至少一个层的发光半导体芯片，每个包括塑料材料 可在压缩成型方法中加工。

公开(公告)号：US20140191272A1

公开(公告)日：2014-07-10

申请号：US14233754

申请日：2012-06-27

申请人： Simon Jerebic ,  Erik Heinemann ,  Markus Pindl ,  Michael Bestele ,  Jan Marfeld

发明人： Simon Jerebic ,  Erik Heinemann ,  Markus Pindl ,  Michael Bestele ,  Jan Marfeld

IPC分类号： H01L33/50

CPC分类号： H01L33/508 ,  H01L25/0753 ,  H01L33/58 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

摘要： An optoelectronic component includes a substrate, on which a semiconductor chip and a wettable attractor element are arranged. A medium including pigments at least regionally covers the exposed region of the substrate that is not covered by the semiconductor chip and the attractor element. The medium at least partly wets the semiconductor chip and the attractor element.

摘要翻译： 光电子部件包括其上布置有半导体芯片和可吸湿吸引子元件的基板。 包括颜料的介质至少区域地覆盖未被半导体芯片和吸引元件覆盖的基板的暴露区域。 该介质至少部分地润湿半导体芯片和吸引元件。

公开(公告)号：US20130077280A1

公开(公告)日：2013-03-28

申请号：US13700414

申请日：2011-04-13

申请人： Thomas Bemmerl ,  Simon Jerebic ,  Markus Pindl

发明人： Thomas Bemmerl ,  Simon Jerebic ,  Markus Pindl

IPC分类号： H05K7/02

CPC分类号： H01L24/32 ,  H01L21/56 ,  H01L23/3142 ,  H01L24/83 ,  H01L25/167 ,  H01L33/06 ,  H01L33/32 ,  H01L33/44 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83951 ,  H01L2924/12041 ,  H01L2924/1434 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2933/0091 ,  H05K7/02 ,  H01L2924/00

摘要： An electronic arrangement (1) comprising a carrier (2), on which at least one connecting area (6) is arranged. At least one electronic component (3a, 3b, 3c) is fixed on the connecting area (6) by means of a contact material (4). A covering area (5) surrounds the connecting area (6) on the carrier (2). At least one covered region (15, 16, 17, 18, 19) is covered by a covering material (10). The covering material (10) is designed in such a way that an optical contrast between the covering area (5) and the covered region (15, 16, 17, 18, 19) is minimized.

摘要翻译： 一种包括载体（2）的电子装置（1），其上布置有至少一个连接区域（6）。 至少一个电子部件（3a，3b，3c）借助接触材料（4）固定在连接区域（6）上。 覆盖区域（5）围绕载体（2）上的连接区域（6）。 至少一个覆盖区域（15,16,17,18,19）被覆盖材料（10）覆盖。 覆盖材料（10）被设计成使覆盖区域（5）和覆盖区域（15,16,17,18,19）之间的光学对比度最小化。

公开(公告)号：US09681566B2

公开(公告)日：2017-06-13

申请号：US13700414

申请日：2011-04-13

申请人： Thomas Bemmerl ,  Simon Jerebic ,  Markus Pindl

发明人： Thomas Bemmerl ,  Simon Jerebic ,  Markus Pindl

IPC分类号： H05K7/02 ,  H01L33/44 ,  H01L23/00

CPC分类号： H01L24/32 ,  H01L21/56 ,  H01L23/3142 ,  H01L24/83 ,  H01L25/167 ,  H01L33/06 ,  H01L33/32 ,  H01L33/44 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83951 ,  H01L2924/12041 ,  H01L2924/1434 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2933/0091 ,  H05K7/02 ,  H01L2924/00

摘要： An electronic arrangement (1) comprising a carrier (2), on which at least one connecting area (6) is arranged. At least one electronic component (3a, 3b, 3c) is fixed on the connecting area (6) by means of a contact material (4). A covering area (5) surrounds the connecting area (6) on the carrier (2). At least one covered region (15, 16, 17, 18, 19) is covered by a covering material (10). The covering material (10) is designed in such a way that an optical contrast between the covering area (5) and the covered region (15, 16, 17, 18, 19) is minimized.

公开(公告)号：US20130334558A1

公开(公告)日：2013-12-19

申请号：US13995847

申请日：2011-12-07

申请人： Markus Pindl ,  Harald Jäger ,  Stephan Preuss ,  Herbert Brunner

发明人： Markus Pindl ,  Harald Jäger ,  Stephan Preuss ,  Herbert Brunner

IPC分类号： H01L33/50

CPC分类号： H01L33/50 ,  H01L33/508 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2933/0041 ,  H01L2924/00014

摘要： A method of producing an optoelectronic component includes providing a cavity; introducing a liquid matrix material with phosphor particles distributed therein into the cavity; introducing a semiconductor chip into the matrix material; sedimenting the phosphor particles in the matrix material; and curing the matrix material, wherein a conversion layer including phosphor particles is produced, said conversion layer being arranged on the semiconductor chip.

摘要翻译： 制造光电子部件的方法包括提供空腔; 将其中分布有荧光体颗粒的液体基质材料引入所述空腔中; 将半导体芯片引入基体材料中; 沉淀基体材料中的荧光体颗粒; 并固化所述基体材料，其中产生包含荧光体颗粒的转换层，所述转换层布置在所述半导体芯片上。

公开(公告)号：US20130309788A1

公开(公告)日：2013-11-21

申请号：US13885912

申请日：2012-01-31

申请人： Martin Brandl ,  Tobias Gebuhr ,  Markus Pindl ,  Albert Schneider

发明人： Martin Brandl ,  Tobias Gebuhr ,  Markus Pindl ,  Albert Schneider

IPC分类号： H01L33/62

CPC分类号： H01L33/62 ,  H01L21/561 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/29 ,  H01L24/83 ,  H01L24/97 ,  H01L33/0095 ,  H01L2224/29191 ,  H01L2224/32245 ,  H01L2224/83192 ,  H01L2924/00013 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

摘要： A leadframe for producing a number of optoelectronic components is specified. At least one mounting region includes a number of chip mounting areas for a number of semiconductor chips. Alongside the mounting region at at least one main area of the leadframe one or more of grooves for reducing mechanical stresses in the leadframe are formed. The groove(s) do not completely penetrate through the leadframe. A method for producing a number of optoelectronic components on a leadframe of this type is furthermore specified.

摘要翻译： 指定了用于生产多个光电子部件的引线框架。 至少一个安装区域包括用于多个半导体芯片的多个芯片安装区域。 在引线框架的至少一个主要区域上的安装区域之外，形成用于减小引线框架中的机械应力的一个或多个凹槽。 凹槽不完全穿透引线框架。 进一步规定了在这种类型的引线框上产生多个光电子部件的方法。

公开(公告)号：US09018661B2

公开(公告)日：2015-04-28

申请号：US13983853

申请日：2012-01-19

申请人： Markus Pindl ,  Simon Jerebic ,  Tobias Gebuhr

发明人： Markus Pindl ,  Simon Jerebic ,  Tobias Gebuhr

IPC分类号： H01L33/00 ,  H01L33/56 ,  H01L33/48 ,  H01L33/50 ,  H01L33/54 ,  H01L33/58

CPC分类号： H01L33/56 ,  H01L33/483 ,  H01L33/505 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2924/00 ,  H01L2924/00014

摘要： An optoelectronic component includes a substrate, a semiconductor chip arranged on the substrate, and a light-transmissive cover, wherein the light-transmissive cover covers at least an area of the semiconductor chip facing away from the substrate, the light-transmissive cover has a hardness greater than that of silicone, and a connecting material is arranged as a potting material between the light-transmissive cover and the substrate such that those areas of the semiconductor chip not covered by the substrate are surrounded by the connecting material, and the connecting material forms a cavity seal.

摘要翻译： 光电子部件包括基板，布置在基板上的半导体芯片和透光盖，其中透光盖覆盖半导体芯片的远离基板的至少一个区域，透光盖具有 硬度大于硅树脂，并且连接材料被布置为在透光性盖和基板之间的灌封材料，使得未被基板覆盖的半导体芯片的那些区域被连接材料包围，并且连接材料 形成空腔密封。