发明授权
- 专利标题： Leadframe for optoelectronic components and method for producing optoelectronic components
- 专利标题（中）： 光电元件引线框架及光电元件生产方法
-
申请号： US13885912申请日： 2012-01-31
-
公开(公告)号： US09130136B2公开(公告)日： 2015-09-08
- 发明人: Martin Brandl , Tobias Gebuhr , Markus Pindl , Albert Schneider
- 申请人： Martin Brandl , Tobias Gebuhr , Markus Pindl , Albert Schneider
- 申请人地址： DE Regensburg
- 专利权人： OSRAM Opto Semiconductors GmbH
- 当前专利权人： OSRAM Opto Semiconductors GmbH
- 当前专利权人地址： DE Regensburg
- 代理机构： Slater & Matsil, L.L.P.
- 优先权： DE102011013259 20110307; DE102011016566 20110408
- 国际申请： PCT/EP2012/051582 WO 20120131
- 国际公布： WO2012/119813 WO 20120913
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L33/62 ; H01L21/56 ; H01L33/00 ; H01L23/00
摘要：
A leadframe for producing a number of optoelectronic components is specified. At least one mounting region includes a number of chip mounting areas for a number of semiconductor chips. Alongside the mounting region at at least one main area of the leadframe one or more of grooves for reducing mechanical stresses in the leadframe are formed. The groove(s) do not completely penetrate through the leadframe. A method for producing a number of optoelectronic components on a leadframe of this type is furthermore specified.
公开/授权文献
信息查询
IPC分类:
