-
1.发明授权Carrier body for a semiconductor component, semiconductor component and method for producing a carrier body 有权用于半导体部件的载体，半导体部件和用于制造载体的方法公开(公告)号：US08629549B2
公开(公告)日：2014-01-14
申请号：US13126761
申请日：2009-10-22
IPC分类号： H01L23/48
CPC分类号： H01L23/49537 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L23/49575 , H01L24/48 , H01L31/0203 , H01L33/486 , H01L33/52 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2924/00014 , H01L2924/01046 , H01L2924/01068 , H01L2924/01079 , H01L2924/12036 , H01L2924/12041 , H01L2924/181 , H01L2924/1815 , H01L2933/0033 , H01L2933/0066 , Y10T29/49002 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A carrier body for a semiconductor component, in particular for an optoelectronic semiconductor component, is specified. Said carrier body has a connecting layer and a conductor layer, which are connected to one another via main areas facing one another. The connecting layer, the conductor layer or both the connecting layer and the conductor layer has/have at least one thinned region in which the layer thickness of said layer(s) is less than the maximum layer thickness of said layer(s). The connecting layer is either completely electrically conductive and electrically insulated at least from parts of the conductor layer or it is electrically insulating at least in parts. Furthermore, a semiconductor component comprising the electrical connection conductor and also a method for producing the carrier body are specified.
摘要翻译： 指定用于半导体部件的载体主体，特别是用于光电半导体部件。 所述载体主体具有连接层和导体层，它们通过彼此面对的主要区域相互连接。 连接层，导体层或连接层和导体层都具有至少一个薄层区域，其中所述层的层厚度小于所述层的最大层厚度。 连接层至少与导体层的一部分完全导电并电绝缘，或至少部分地电绝缘。 此外，规定了包括电连接导体的半导体部件以及用于制造载体主体的方法。
-
公开(公告)号：US20130200405A1
公开(公告)日：2013-08-08
申请号：US13818021
申请日：2011-08-18
CPC分类号： F21K9/00 , F21V29/85 , H01L33/486 , H01L33/62 , H01L33/64 , H01L2224/48247 , H01L2224/48471 , H01L2924/00 , H01L2224/48227
摘要： An optoelectronic semiconductor component includes a substrate that has an upper side and an under side lying opposite the upper side. The substrate is formed with an electrically conductive mounting region, an electrically conductive connection region and an electrically isolating oxidation region. An optoelectronic part is arranged on the upper side of the substrate in the region of the mounting region. The oxidation region electrically isolates the mounting region from the connection region. The oxidation region extends, without interruption, from the upper side of the substrate to the underside of the substrate. The mounting region and the connection region are formed with aluminum and the oxidation region is formed with an oxide of the aluminum. The mounting region, the oxidation region and the connection region being are designed contiguously to form an entity.
摘要翻译： 光电子半导体部件包括具有与上侧相对的上侧和下侧的基板。 基板形成有导电安装区域，导电连接区域和电隔离氧化区域。 在安装区域的区域中，光电子部件布置在基板的上侧。 氧化区域将安装区域与连接区域电隔离。 氧化区域从衬底的上侧到衬底的下侧不间断地延伸。 安装区域和连接区域由铝形成，并且氧化区域由铝的氧化物形成。 安装区域，氧化区域和连接区域被连续设计以形成实体。
-
3.发明申请公开(公告)号：US20130092966A1
公开(公告)日：2013-04-18
申请号：US13636678
申请日：2011-05-04
CPC分类号： H01L33/60 , H01L33/486 , H01L33/52 , H01L33/54 , H01L33/56 , H01L2924/0002 , H01L2924/00
摘要： An optoelectronic component includes a housing. At least one semiconductor chip is arranged in the housing. The semiconductor chip includes an active layer suitable for producing or detecting electromagnetic radiation. A casting compound at least partially surrounds the semiconductor chip. Reflective particles are embedded in the casting compound.
摘要翻译： 光电子部件包括壳体。 至少一个半导体芯片布置在壳体中。 半导体芯片包括适于产生或检测电磁辐射的有源层。 铸造化合物至少部分地围绕半导体芯片。 反射性颗粒嵌入铸塑料中。
-
公开(公告)号：US20110182075A1
公开(公告)日：2011-07-28
申请号：US13119342
申请日：2009-09-01
CPC分类号： H01L33/60 , G09F27/008 , H01L33/58 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： An optoelectronic device includes at least one luminescence diode chip which emits electromagnetic radiation during operation of the optoelectronic device, and at least one shield against stray radiation which laterally surrounds the luminescence diode chip only in places, wherein each shield is integral with a component of the optoelectronic device.
摘要翻译： 光电子器件包括至少一个发光二极管芯片，其在光电子器件的工作过程中发射电磁辐射，以及至少一个防止杂散辐射的屏蔽物，其仅在某些位置横向包围发光二极管芯片，其中每个屏蔽件与 光电器件。
-
5.发明授权公开(公告)号：US09444022B2
公开(公告)日：2016-09-13
申请号：US14118475
申请日：2012-05-18
CPC分类号： H01L33/502 , H01L33/06 , H01L33/28 , H01L33/32 , H01L33/44 , H01L33/486 , H01L33/50 , H01L33/505 , H01L33/52 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/48247 , H01L2224/48471 , H01L2224/48479 , H01L2924/00014 , H01L2924/181 , H01L2933/0041 , H01L2933/0058 , H01L2933/0066 , H01L2933/0091 , H01L2224/48091 , H01L2924/00012 , H01L2224/4554
摘要： An optoelectronic semiconductor chip includes a semiconductor body that emits primary light, and a luminescence conversion element that emits secondary light by wavelength conversion of at least part of the primary light, wherein the luminescence conversion element has a first lamina fixed to a first partial region of an outer surface of the semiconductor body, the outer surface emitting primary light, and leaves free a second partial region of the outer surface, the luminescence conversion element has a second lamina fixed to a surface of the first lamina facing away from the semiconductor body and spaced apart from the semiconductor body, the first lamina is at least partly transmissive to the primary radiation, a section of the second lamina covers at least the second partial region, and at least the section of the second lamina is designed to be absorbent and/or reflective and/or scattering for the primary radiation.
摘要翻译： 光电子半导体芯片包括发射初级光的半导体本体和通过至少部分初级光的波长转换而发射二次光的发光转换元件，其中发光转换元件具有固定到第一部分区域的第一部分区域 所述半导体本体的外表面，所述外表面发射初级光，并且释放所述外表面的第二部分区域，所述发光转换元件具有固定到所述第一层的背离半导体主体的表面的第二层， 与半导体本体间隔开，第一薄片至少部分地透射到主辐射，第二薄片的一部分至少覆盖第二部分区域，并且至少第二薄片的部分被设计成吸收和/ 或用于初级辐射的反射和/或散射。
-
公开(公告)号：US08735928B2
公开(公告)日：2014-05-27
申请号：US13807342
申请日：2011-06-27
申请人： Harald Jäger , Michael Zitzlsperger , Markus Pindl
发明人： Harald Jäger , Michael Zitzlsperger , Markus Pindl
IPC分类号： H01L33/60
CPC分类号： H01L33/60 , H01L31/0203 , H01L31/0232 , H01L31/18 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2933/005 , H01L2933/0066 , H01L2924/00014
摘要： A method of producing a surface-mountable semiconductor component including providing an auxiliary carrier made with a plastics material; applying at least one insert and at least one optoelectronic component to a mounting surface of the auxiliary carrier; enclosing the optoelectronic component and the insert in a common molding, wherein the molding covers the optoelectronic component and the insert form-fittingly at least in places, the optoelectronic component and the insert are not in direct contact with one another, and the optoelectronic component and the insert are connected together mechanically by the molding; removing the auxiliary carrier; and producing individual surface-mountable semiconductor components by severing the molding.
摘要翻译： 一种制造可表面安装的半导体部件的方法，包括提供由塑料材料制成的辅助载体; 将至少一个插入件和至少一个光电子部件施加到辅助载体的安装表面; 将光电子部件和插入件封装在共同的模制件中，其中模制件至少在一些地方覆盖光电子部件和插入件，光电子部件和插入件彼此不直接接触，并且光电子部件和 插入件通过模制机械连接在一起; 移除辅助载体; 并通过切割模制件来生产单个的可表面安装的半导体部件。
-
7.发明授权公开(公告)号：US08502252B2
公开(公告)日：2013-08-06
申请号：US13062425
申请日：2009-08-20
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L25/0753 , H01L33/62 , H01L33/641 , H01L2924/0002 , H01L2924/00
摘要： An optoelectronic component (1) is provided, having at least two connecters (2) for electrical contacting of the component (1), a housing body (3), in which the connecters (2) are embedded in places, a heat sink (4), which is connected to at least one connecter (2), wherein the housing body (3) is formed of a plastics material, the housing body (3) comprises an opening (30), in which the heat sink (4) is freely accessible in places, at least one optoelectronic semiconductor chip (5) is arranged in the opening (30) on the heat sink (4), and at least two of the connecters (2) each comprise a chip-end portion (2c), which faces the at least one optoelectronic semiconductor chip (5), wherein the chip-end portions (2c) of the at least two connecters (2) are arranged in a common plane.
摘要翻译： 提供了一种光电子部件（1），其具有至少两个用于部件（1）的电接触的连接器（2），壳体主体（3），其中连接器（2）嵌入其中，散热器 4），其连接到至少一个连接器（2），其中所述壳体（3）由塑料材料形成，所述壳体（3）包括开口（30），所述散热器（4） 在地方可自由接近，至少一个光电半导体芯片（5）布置在散热器（4）上的开口（30）中，并且至少两个连接器（2）各自包括芯片端部分（2c） ），其面向所述至少一个光电半导体芯片（5），其中所述至少两个连接器（2）的所述芯片端部分（2c）布置在公共平面中。
-
公开(公告)号：US08482025B2
公开(公告)日：2013-07-09
申请号：US13375813
申请日：2010-05-05
IPC分类号： H01L33/00
CPC分类号： H01L25/167 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2924/00014
摘要： An optoelectronic semi-conductor component includes a first carrier having a top side and an underside laying opposite the top side of the first carrier, wherein the first carrier has a first and a second region; at least one optoelectronic semiconductor chip arranged at the top side on the first carrier; and at least one electronic component arranged in the second region at the underside of the first carrier, wherein the first region has a greater thickness in a vertical direction than the second region, wherein, at the underside, the first region projects beyond the second region in a vertical direction, and the at least one electronic component is electrically conductively connected to the at least one optoelectronic semi-conductor chip.
摘要翻译： 光电半导体部件包括第一载体，其具有与第一载体的顶侧相对的顶侧和下侧，其中第一载体具有第一和第二区; 布置在第一载体上的顶侧的至少一个光电子半导体芯片; 以及至少一个电子部件，其布置在第一载体的下侧的第二区域中，其中第一区域在垂直方向上具有比第二区域更大的厚度，其中，在下侧，第一区域突出超过第二区域 并且所述至少一个电子部件与所述至少一个光电半导体芯片导电连接。
-
9.发明申请公开(公告)号：US20110121336A1
公开(公告)日：2011-05-26
申请号：US12808165
申请日：2008-11-19
IPC分类号： H01L33/58
CPC分类号： H01L33/486 , H01L25/0753 , H01L33/44 , H01L2224/48091 , H01L2224/48464 , H01L2924/00014
摘要： The invention relates to an arrangement comprising at least one optoelectronic semiconductor component (101), said arrangement comprising a carrier element arrangement (108) suitable for carrying the at least one optoelectronic semiconductor component. The arrangement comprises a housing body (103) consisting of a light-absorbent plastic material, which is arranged on the carrier element arrangement. The housing body comprises a raised area (104) and a set-back area (105) between which an inclined flank (115) is formed. The set-back area extends up to the optoelectronic semiconductor component, in order to reduce reflections.
摘要翻译： 本发明涉及一种包括至少一个光电子半导体部件（101）的装置，所述装置包括适于承载至少一个光电子半导体部件的载体元件装置（108）。 该装置包括由吸收塑料材料组成的壳体（103），该吸收塑料材料布置在载体元件装置上。 壳体包括形成有倾斜侧面（115）的凸起区域（104）和回填区域（105）。 后置区延伸到光电子半导体元件，以减少反射。
-
公开(公告)号：US09048393B2
公开(公告)日：2015-06-02
申请号：US13377910
申请日：2010-05-28
CPC分类号： H01L33/486 , H01L33/38 , H01L33/52 , H01L33/54 , H01L2224/48091 , H01L2924/00014
摘要： An optoelectronic component including a connection carrier including an electrically insulating film at a top side of the connection carrier, an optoelectronic semiconductor chip at the top side of the connection carrier, a cutout in the electrically insulating film which encloses the optoelectronic semiconductor chip, and a potting body surrounding the optoelectronic semiconductor chip, wherein a bottom area of the cutout is formed at least regionally by the electrically insulating film, the potting body extends at least regionally as far as an outer edge of the cutout facing the optoelectronic semiconductor chip, and the cutout is at least regionally free of the potting body.
摘要翻译： 一种光电子部件，包括在连接载体的顶侧包括电绝缘膜的连接载体，在连接载体的顶侧的光电半导体芯片，包围光电半导体芯片的电绝缘膜中的切口，以及 灌封体围绕光电子半导体芯片，其中，所述切口的底部区域至少由所述电绝缘膜区域形成，所述灌封体至少在区域上延伸至所述切口的面向所述光电半导体芯片的外边缘，并且 切口至少在区域上没有灌封体。
-
-
-
-
-
-
-
-
-
搜索结果
35 条记录 (耗时 0.014 秒)
