公开(公告)号：US08790939B2

公开(公告)日：2014-07-29

申请号：US12918364

申请日：2009-02-19

Applicant: Stephan Preuss ,  Harald Jaeger

Inventor： Stephan Preuss ,  Harald Jaeger

IPC: H01L33/52

CPC classification number: H01L33/52 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for producing a plurality of radiation-emitting components includes A) providing a carrier layer having a plurality of mounting regions separated from one another by separating regions; B) applying an interlayer to the separating regions; C) applying a respective radiation-emitting device to each of the plurality of mounting regions; D) applying a continuous potting layer to the radiation-emitting device and the separating regions; E) severing the potting layer and partially severing the interlayer in the separating regions of the carrier layer in a first separating step; and F) partially severing the interlayer and severing the carrier layer in a second separating step, wherein the interlayer is completely severed by the first and the second separating step.

Abstract translation: 一种用于制造多个辐射发射部件的方法，包括：A）提供具有通过分离区域彼此分离的多个安装区域的载体层; B）将中间层施加到分离区域; C）将相应的辐射发射装置施加到所述多个安装区域中的每一个; D）向辐射发射装置和分离区域施加连续灌封层; E）在第一分离步骤中切断灌封层并在载体层的分离区域中部分切断中间层; 和F）在第二分离步骤中部分切断所述中间层并切断所述载体层，其中所述中间层被所述第一和第二分离步骤完全切断。

公开(公告)号：US08692275B2

公开(公告)日：2014-04-08

申请号：US13636678

申请日：2011-05-04

Applicant: Harald Jaeger ,  Michael Zitzlsperger ,  Albert Schneider

Inventor： Harald Jaeger ,  Michael Zitzlsperger ,  Albert Schneider

IPC: H01L33/00

CPC classification number: H01L33/60 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An optoelectronic component includes a housing. At least one semiconductor chip is arranged in the housing. The semiconductor chip includes an active layer suitable for producing or detecting electromagnetic radiation. A casting compound at least partially surrounds the semiconductor chip. Reflective particles are embedded in the casting compound.

Abstract translation: 光电子部件包括壳体。 至少一个半导体芯片布置在壳体中。 半导体芯片包括适于产生或检测电磁辐射的有源层。 铸造化合物至少部分地围绕半导体芯片。 反射性颗粒嵌入铸塑料中。

公开(公告)号：US08435806B2

公开(公告)日：2013-05-07

申请号：US12595887

申请日：2008-04-14

Applicant: Harald Jaeger ,  Herbert Brunner ,  Albert Schneider ,  Thomas Zeiler

Inventor： Harald Jaeger ,  Herbert Brunner ,  Albert Schneider ,  Thomas Zeiler

IPC: H01L21/00

CPC classification number: B29C45/14655 ,  B29C33/0038 ,  B29C33/10 ,  B29C43/18 ,  B29C2045/14098 ,  B29C2045/14663 ,  B29C2045/14934 ,  B29K2083/00 ,  H01L21/565 ,  H01L24/97 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method is disclosed for the manufacture of an optoelectronic component. A substrate has a first primary face and a second primary face that lies opposite the first primary face. A semiconductor body that is capable of emitting electromagnetic radiation from a front side is attached to the first primary face of the substrate. A covering that is transparent to the radiation from the optoelectronic semiconductor body is applied to at least the front side of the semiconductor body. The covering is given the form of an optical element by using a closed cavity that is shaped with the contour of the optical element.

Abstract translation: 公开了用于制造光电子部件的方法。 基板具有与第一主面相对的第一主面和第二主面。 能够从前侧发射电磁辐射的半导体本体被安装在基板的第一主面上。 至少对半导体本体的前侧施加对来自光电半导体本体的辐射透明的覆盖物。 通过使用与光学元件的轮廓成形的封闭空腔，将覆盖物赋予光学元件的形式。

公开(公告)号：USD369028S

公开(公告)日：1996-04-23

申请号：US36709

申请日：1995-03-27

Applicant: Harald Jaeger

Designer： Harald Jaeger

公开(公告)号：US08502252B2

公开(公告)日：2013-08-06

申请号：US13062425

申请日：2009-08-20

Applicant: Stefan Groetsch ,  Thomas Zeiler ,  Michael Zitzlsperger ,  Harald Jaeger

Inventor： Stefan Groetsch ,  Thomas Zeiler ,  Michael Zitzlsperger ,  Harald Jaeger

IPC: H01L33/00

CPC classification number: H01L33/486 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/641 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An optoelectronic component (1) is provided, having at least two connecters (2) for electrical contacting of the component (1), a housing body (3), in which the connecters (2) are embedded in places, a heat sink (4), which is connected to at least one connecter (2), wherein the housing body (3) is formed of a plastics material, the housing body (3) comprises an opening (30), in which the heat sink (4) is freely accessible in places, at least one optoelectronic semiconductor chip (5) is arranged in the opening (30) on the heat sink (4), and at least two of the connecters (2) each comprise a chip-end portion (2c), which faces the at least one optoelectronic semiconductor chip (5), wherein the chip-end portions (2c) of the at least two connecters (2) are arranged in a common plane.

Abstract translation: 提供了一种光电子部件（1），其具有至少两个用于部件（1）的电接触的连接器（2），壳体主体（3），其中连接器（2）嵌入其中，散热器 4），其连接到至少一个连接器（2），其中所述壳体（3）由塑料材料形成，所述壳体（3）包括开口（30），所述散热器（4） 在地方可自由接近，至少一个光电半导体芯片（5）布置在散热器（4）上的开口（30）中，并且至少两个连接器（2）各自包括芯片端部分（2c） ），其面向所述至少一个光电半导体芯片（5），其中所述至少两个连接器（2）的所述芯片端部分（2c）布置在公共平面中。

公开(公告)号：US20110127564A1

公开(公告)日：2011-06-02

申请号：US12918364

申请日：2009-02-19

Applicant: Stephan Preuss ,  Harald Jaeger

Inventor： Stephan Preuss ,  Harald Jaeger

IPC: H01L33/52 ,  H01L21/56

CPC classification number: H01L33/52 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for producing a plurality of radiation-emitting components includes A) providing a carrier layer having a plurality of mounting regions separated from one another by separating regions; B) applying an interlayer to the separating regions; C) applying a respective radiation-emitting device to each of the plurality of mounting regions; D) applying a continuous potting layer to the radiation-emitting device and the separating regions; E) severing the potting layer and partially severing the interlayer in the separating regions of the carrier layer in a first separating step; and F) partially severing the interlayer and severing the carrier layer in a second separating step, wherein the interlayer is completely severed by the first and the second separating step.

Abstract translation: 一种用于制造多个辐射发射部件的方法，包括：A）提供具有通过分离区域彼此分离的多个安装区域的载体层; B）将中间层施加到分离区域; C）将相应的辐射发射装置施加到所述多个安装区域中的每一个; D）向辐射发射装置和分离区域施加连续灌封层; E）在第一分离步骤中切断灌封层并在载体层的分离区域中部分切断中间层; 和F）在第二分离步骤中部分切断所述中间层并切断所述载体层，其中所述中间层被所述第一和第二分离步骤完全切断。

公开(公告)号：US07076382B2

公开(公告)日：2006-07-11

申请号：US10507820

申请日：2003-02-20

Applicant: Thomas Reichel ,  Harald Jaeger

Inventor： Thomas Reichel ,  Harald Jaeger

IPC: G01R23/16 ,  G06F19/00

CPC classification number: G01R27/28 ,  G01R35/007

Abstract: To measure the effective directivity and/or the effective source port match of a test port of a system-calibrated vector network analyser, a precision air line short-circuited at the outlet is connected, and the complex reflection coefficient is measured at the inlet of this precision air line at a sequence of measuring points within a predefined frequency range. At the same time, for the effective directivity the sequence of the measured complex reflection coefficients is subjected to a discrete Fourier transformation and the baseband filtered out of the spectrum thereby formed. The sequence of effective directivity values is obtained by subsequent inverse Fourier retransformation.

Abstract translation: 为了测量系统校准矢量网络分析仪的测试端口的有效方向性和/或有效源端口匹配，在出口短路的精密空气线连接，并且复数反射系数在 该精密空气管线在预定频率范围内的一系列测量点。 同时，为了有效的方向性，测量的复数反射系数的序列经受离散的傅里叶变换，并且从其形成的频谱中滤出基带。 有效方向性值的序列通过后续的傅立叶逆变换获得。

公开(公告)号：US20050119848A1

公开(公告)日：2005-06-02

申请号：US10507820

申请日：2003-02-20

Applicant: Thomas Reichel ,  Harald Jaeger

Inventor： Thomas Reichel ,  Harald Jaeger

IPC: G01R27/28 ,  G01R35/00 ,  G06F19/00

CPC classification number: G01R27/28 ,  G01R35/007

Abstract: To measure the effective directivity and/or the effective source port match of a test port of a system-calibrated vector network analyser, a precision air line short-circuited at the outlet is connected, and the complex reflection coefficient is measured at the inlet of this precision air line at a sequence of measuring points within a predefined frequency range. At the same time, for the effective directivity the sequence of the measured complex reflection coefficients is subjected to a discrete Fourier transformation and the baseband filtered out of the spectrum thereby formed. The sequence of effective directivity values is obtained by subsequent inverse Fourier retransformation.

Abstract translation: 为了测量系统校准矢量网络分析仪的测试端口的有效方向性和/或有效源端口匹配，在出口短路的精密空气线连接，并且复数反射系数在 该精密空气管线在预定频率范围内的一系列测量点。 同时，为了有效的方向性，测量的复数反射系数的序列经受离散的傅里叶变换，并且从其形成的频谱中滤出基带。 有效方向性值的序列通过后续的傅立叶逆变换获得。

公开(公告)号：US09698282B2

公开(公告)日：2017-07-04

申请号：US12933510

申请日：2009-03-31

Applicant: Harald Jaeger ,  Michael Zitzlsperger

Inventor： Harald Jaeger ,  Michael Zitzlsperger

IPC: H01L21/60 ,  H01L23/48 ,  H01L31/0203 ,  H01L23/498 ,  H01L31/18 ,  H01L33/48 ,  H01L23/00 ,  H01L31/0232 ,  H01L33/62

CPC classification number: H01L31/0203 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/97 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2933/0066 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An optoelectronic component including a connection carrier comprising a structured carrier strip in which interspaces are filled with an electrically insulating material and an optoelectronic semiconductor chip attached and electrically connected to a top portion of the connection carrier, wherein the electrically insulating material terminates substantially flush with the carrier strip in places or the carrier strip projects beyond the electrically insulating material, and the carrier strip is not covered by the electrically insulating material on the top portion and/or on a bottom portion of the connection carrier.

公开(公告)号：US09397271B2

公开(公告)日：2016-07-19

申请号：US12922240

申请日：2009-04-20

Applicant: Harald Jaeger ,  Joerg Erich Sorg ,  Tsutomu Kashiwagi ,  Toshio Shiobara

Inventor： Harald Jaeger ,  Joerg Erich Sorg ,  Tsutomu Kashiwagi ,  Toshio Shiobara

IPC: H01L33/00 ,  H01L33/48 ,  H05K1/03

CPC classification number: H01L33/483 ,  H01L2224/48091 ,  H01L2924/12044 ,  H01L2924/181 ,  H05K1/0366 ,  H05K2201/0162 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An optoelectronic semiconductor component includes a connection carrier with at least two connection points and a carrier top that in a main side of the connection carrier, wherein the connection carrier configured with a silicone matrix with a fiber reinforcement, at least one optoelectronic semiconductor chip mounted on the connection carrier and in direct contact therewith, an annular potting body includes a soft silicone on the carrier top and in direct contact with the carrier top, but not in direct contact with the semiconductor chip, and a glass body comprising a glass sheet applied over the semiconductor chip and over sides of the potting body remote from the connection carrier, thereby forming a space between the semiconductor chip and the potting body.

Abstract translation: 光电子半导体部件包括具有至少两个连接点的连接载体和在连接载体的主侧中的载体顶部，其中连接载体配置有具有纤维增强的硅树脂基体，至少一个光电子半导体芯片安装在 连接承载件并且与其直接接触，环形灌封体包括载体顶部上的软硅胶，并且与载体顶部直接接触，但不与半导体芯片直接接触;以及玻璃体，其包括施加在玻璃片上的玻璃体 半导体芯片和灌封体的上侧远离连接载体，从而在半导体芯片和灌封体之间形成空间。