公开(公告)号：US08900893B2

公开(公告)日：2014-12-02

申请号：US12704381

申请日：2010-02-11

Applicant: Chung Yu Wang

Inventor： Chung Yu Wang

IPC: H01L29/72 ,  H01L33/62 ,  H01L23/00 ,  H01L33/00 ,  H01L33/54 ,  H01L23/48

CPC classification number: H01L33/647 ,  H01L23/481 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/73 ,  H01L24/94 ,  H01L24/97 ,  H01L27/15 ,  H01L33/0025 ,  H01L33/0079 ,  H01L33/06 ,  H01L33/10 ,  H01L33/32 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/83815 ,  H01L2224/83895 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01026 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/0781 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of forming a light-emitting device (LED) package component includes providing a substrate; forming an LED on the substrate; and lifting the LED off the substrate. A carrier wafer is provided, which includes a through-substrate via (TSV) configured to electrically connecting features on opposite sides of the carrier wafer. The LED is bonded onto the carrier wafer, with the LED electrically connected to the TSV.

Abstract translation: 一种形成发光器件（LED）封装部件的方法包括提供衬底; 在基板上形成LED; 并将LED从基板上提起。 提供了载体晶片，其包括被构造成电连接载体晶片的相对侧上的特征的贯通基板通孔（TSV）。 LED结合到载体晶片上，LED与TSV电连接。

公开(公告)号：US08772929B2

公开(公告)日：2014-07-08

申请号：US13297992

申请日：2011-11-16

Applicant: Chih-Hao Chen ,  Long Hua Lee ,  Chun-Hsing Su ,  Yi-Lin Tsai ,  Kung-Chen Yeh ,  Chung Yu Wang ,  Jui-Pin Hung ,  Jing-Cheng Lin

Inventor： Chih-Hao Chen ,  Long Hua Lee ,  Chun-Hsing Su ,  Yi-Lin Tsai ,  Kung-Chen Yeh ,  Chung Yu Wang ,  Jui-Pin Hung ,  Jing-Cheng Lin

IPC: H01L23/48 ,  H01L21/78

CPC classification number: H01L21/563 ,  H01L21/561 ,  H01L21/78 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/26145 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/83104 ,  H01L2224/9202 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/351 ,  H01L2224/81 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2924/014 ,  H01L2924/0665

Abstract: A wafer level package includes a semiconductor die bonded on a supporting wafer. The semiconductor die has at least a step recess at its substrate. An underfill layer is formed between the semiconductor die and the supporting wafer. Moreover, the height of the underfill layer is limited by the step recess. During a fabrication process of the wafer level package, the step recess helps to reduce the stress on the wafer level package.

Abstract translation: 晶片级封装包括结合在支撑晶片上的半导体管芯。 半导体管芯在其衬底上至少有一个台阶凹槽。 在半导体管芯和支撑晶片之间形成底部填充层。 此外，底部填充层的高度受到台阶凹槽的限制。 在晶片级封装的制造过程中，台阶凹槽有助于减小晶片级封装上的应力。

公开(公告)号：US08492263B2

公开(公告)日：2013-07-23

申请号：US11941429

申请日：2007-11-16

Applicant: Chung Yu Wang ,  Chien-Hsiun Lee ,  Pei-Haw Tsao ,  Kuo-Chin Chang ,  Chung-Yi Lin ,  Bill Kiang

Inventor： Chung Yu Wang ,  Chien-Hsiun Lee ,  Pei-Haw Tsao ,  Kuo-Chin Chang ,  Chung-Yi Lin ,  Bill Kiang

IPC: H01L21/44

CPC classification number: H01L23/49816 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/02313 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05008 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/056 ,  H01L2224/05647 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/1148 ,  H01L2224/11901 ,  H01L2224/13005 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13027 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48647 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/207 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05552

Abstract: Protection of a solder ball joint is disclosed in which the solder ball joint is located below the surface level of the encapsulating buffer layer. The buffering layer is etched to expose one or more electrode posts, each of which may be made up of a single column or multiple columns. A top layer resulting either from a top conductive cap or a plating layer around the electrode posts also lies below the buffer layer. When the solder ball is placed onto the posts, the solder/ball joint is protected in a position below the surface of the buffer layer, while still maintaining an electrical connection between the various solder balls and their associated or capping/plating material, electrode posts, wiring layers, and circuit layers. Therefore, the entire ball joint is protected from direct stress.

公开(公告)号：US20120225509A1

公开(公告)日：2012-09-06

申请号：US13474282

申请日：2012-05-17

Applicant: Chung Yu Wang

Inventor： Chung Yu Wang

IPC: H01L33/58 ,  H01L33/08

CPC classification number: H01L33/62 ,  H01L24/17 ,  H01L33/486 ,  H01L33/54 ,  H01L33/642 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light-emitting device (LED) package component includes an LED chip having a first active bond pad and a second active bond pad. A carrier chip is bonded onto the LED chip through flip-chip bonding. The carrier chip includes a first active through-substrate via (TSV) and a second active TSV connected to the first and the second active bond pads, respectively. The carrier chip further includes a dummy TSV therein, which is electrically coupled to the first active bond pad, and is configured not to conduct any current when a current flows through the LED chip.

Abstract translation: 发光器件（LED）封装部件包括具有第一有源接合焊盘和第二有源接合焊盘的LED芯片。 载体芯片通过倒装芯片接合结合到LED芯片上。 载体芯片包括分别连接到第一和第二有源接合焊盘的第一有源通过衬底通孔（TSV）和第二有源TSV。 载体芯片还包括其中的虚拟TSV，其电耦合到第一有源接合焊盘，并且被配置为在电流流过LED芯片时不导通任何电流。

公开(公告)号：US08183579B2

公开(公告)日：2012-05-22

申请号：US12715838

申请日：2010-03-02

Applicant: Chung Yu Wang

Inventor： Chung Yu Wang

IPC: H01L27/15 ,  H01L31/12 ,  H01L33/00

CPC classification number: H01L33/62 ,  H01L24/17 ,  H01L33/486 ,  H01L33/54 ,  H01L33/642 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light-emitting device (LED) package component includes an LED chip having a first active bond pad and a second active bond pad. A carrier chip is bonded onto the LED chip through flip-chip bonding. The carrier chip includes a first active through-substrate via (TSV) and a second active TSV connected to the first and the second active bond pads, respectively. The carrier chip further includes a dummy TSV therein, which is electrically coupled to the first active bond pad, and is configured not to conduct any current when a current flows through the LED chip.

Abstract translation: 发光器件（LED）封装部件包括具有第一有源接合焊盘和第二有源接合焊盘的LED芯片。 载体芯片通过倒装芯片接合结合到LED芯片上。 载体芯片包括分别连接到第一和第二有源接合焊盘的第一有源通过衬底通孔（TSV）和第二有源TSV。 载体芯片还包括其中的虚拟TSV，其电耦合到第一有源接合焊盘，并且被配置为在电流流过LED芯片时不导通任何电流。

公开(公告)号：US20110317409A1

公开(公告)日：2011-12-29

申请号：US12801729

申请日：2010-06-23

Applicant: Chih-Hsien Wu ,  Chung-Yu Wang ,  Meng-Chieh Chou

Inventor： Chih-Hsien Wu ,  Chung-Yu Wang ,  Meng-Chieh Chou

IPC: F21V29/00

CPC classification number: F21K9/27 ,  F21Y2103/10 ,  F21Y2115/10

Abstract: A structure of lighting device includes a heat dissipater having opposite edges respectively forming a guide slot and a groove. A substrate board has an edge received and retained in the guide slot and an opposite edge forming a mounting hole. A fastener is received through the mounting hole to tightly engage the groove so as to fix the substrate board to the heat dissipater. No pre-machining of thread tapping is needed to form inner-threaded holes first. The structure of lighting device offers advantages in respect of simple structural arrangement, efficient manufacturing and production, reduced labor and material used, and lowering of costs.

Abstract translation: 照明装置的结构包括具有分别形成引导槽和凹槽的相对边缘的散热器。 基板具有接收并保持在引导槽中的边缘和形成安装孔的相对边缘。 紧固件通过安装孔被接收以紧密地接合槽，以将基板固定到散热器上。 首先需要进行螺纹孔的预加工，以形成内螺纹孔。 照明装置的结构在简单的结构布置，高效的制造和生产，减少劳动力和使用的材料以及降低成本方面提供了优点。

公开(公告)号：US20110230043A1

公开(公告)日：2011-09-22

申请号：US12726317

申请日：2010-03-17

Applicant: Chung Yu WANG ,  Jiann-Jong WANG

Inventor： Chung Yu WANG ,  Jiann-Jong WANG

IPC: H01L21/60

CPC classification number: H01L21/6836 ,  H01L23/3114 ,  H01L24/13 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05655 ,  H01L2224/0568 ,  H01L2224/1132 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Organic-adhesive tapes are often used to secure and protect the bumps during wafer processing after bump formation. While residual organic-adhesive tape may remain on the wafer after tape de-lamination, applying a bump template layer on the bumps before laminating the tape allows any residue to be removed afterwards and results in a residue-free wafer.

Abstract translation: 有机胶带通常用于在凸块形成后的晶片加工过程中固定和保护凸块。 虽然残留的有机粘合带可能在胶带去层压之后残留在晶片上，但是在层压胶带之前在凸块上施加凸块模板层可以使之后去除任何残留物，并产生无残留的晶片。

公开(公告)号：US20110215361A1

公开(公告)日：2011-09-08

申请号：US12715872

申请日：2010-03-02

Applicant: Chung Yu Wang

Inventor： Chung Yu Wang

IPC: H01L33/62

CPC classification number: H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A light-emitting device (LED) package component includes an LED chip and a carrier chip. The carrier chip includes a first bond pad and a second bond pad on a surface of the carrier chip and bonded onto the LED chip through flip-chip bonding, and a third bond pad and a fourth bond pad on the surface of the carrier chip and electrically connected to the first bond pad and the second bond pad, respectively. The first bond pad and the second bond pad are on a same side of the carrier chip facing the LED chip. The carrier chip further includes at least one through substrate via (TSV) connected to the first and second bond pads.

Abstract translation: 发光器件（LED）封装部件包括LED芯片和载体芯片。 载体芯片包括在载体芯片的表面上的第一接合焊盘和第二接合焊盘，并通过倒装芯片接合结合到LED芯片上，以及在载体芯片的表面上的第三接合焊盘和第四接合焊盘， 电连接到第一接合焊盘和第二接合焊盘。 第一接合焊盘和第二接合焊盘位于与芯片相对的载体芯片的同一侧。 载体芯片还包括连接到第一和第二接合焊盘的至少一个贯穿衬底通孔（TSV）。

公开(公告)号：US20110215354A1

公开(公告)日：2011-09-08

申请号：US12715795

申请日：2010-03-02

Applicant: Chung Yu Wang

Inventor： Chung Yu Wang

IPC: H01L33/58

CPC classification number: H01L33/58 ,  H01L2224/13 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light-emitting device (LED) package component includes an LED chip and a carrier chip. The carrier chip includes a first and a second bond pad on a surface of the carrier chip; and a third and a fourth bond pad on the surface of the carrier chip and electrically connected to the first and the second bond pads, respectively. The first, the second, the third, and the fourth bond pads are on a same surface of the carrier chip. The LED package component further includes a first and a second metal bump bonding the first and the second bond pads, respectively, onto the LED chip through flip-chip bonding; and a window-type module substrate bonded onto the third and the fourth bond pads through flip-chip bonding. The window-type module substrate includes a window, with the LED chip configured to emit light toward the window.

Abstract translation: 发光器件（LED）封装部件包括LED芯片和载体芯片。 载体芯片包括在载体芯片的表面上的第一和第二接合焊盘; 以及在载体芯片的表面上分别电连接到第一和第二接合焊盘的第三和第四接合焊盘。 第一，第二，第三和第四接合焊盘位于载体芯片的相同表面上。 LED封装部件还包括通过倒装芯片焊接将第一和第二接合焊盘分别结合到LED芯片上的第一和第二金属凸块; 以及通过倒装芯片接合键合到第三和第四接合焊盘上的窗型模块衬底。 窗型模块基板包括窗口，其中LED芯片配置成向窗口发射光。

公开(公告)号：US20090130840A1

公开(公告)日：2009-05-21

申请号：US11941429

申请日：2007-11-16

Applicant: Chung Yu Wang ,  Chien-Hsiun Lee ,  Pei-Haw Tsao ,  Kuo-Chin Chang ,  Chung-Yi Lin ,  Bill Kiang

Inventor： Chung Yu Wang ,  Chien-Hsiun Lee ,  Pei-Haw Tsao ,  Kuo-Chin Chang ,  Chung-Yi Lin ,  Bill Kiang

IPC: H01L21/441

CPC classification number: H01L23/49816 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/02313 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05008 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/056 ,  H01L2224/05647 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/1148 ,  H01L2224/11901 ,  H01L2224/13005 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13027 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48647 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/207 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05552

Abstract: Protection of a solder ball joint is disclosed in which the solder ball joint is located below the surface level of the encapsulating buffer layer. The buffering layer is etched to expose one or more electrode posts, each of which may be made up of a single column or multiple columns. A top layer resulting either from a top conductive cap or a plating layer around the electrode posts also lies below the buffer layer. When the solder ball is placed onto the posts, the solder/ball joint is protected in a position below the surface of the buffer layer, while still maintaining an electrical connection between the various solder balls and their associated or capping/plating material, electrode posts, wiring layers, and circuit layers. Therefore, the entire ball joint is protected from direct stress.

Abstract translation: 公开了焊球接头的保护，其中焊球接头位于封装缓冲层的表面水平以下。 蚀刻缓冲层以露出一个或多个电极柱，每个电极柱可以由单个柱或多个柱组成。 由顶部导电盖或电极柱周围的镀层产生的顶层也位于缓冲层的下方。 当焊球放置在柱上时，焊料/球窝接头被保护在缓冲层表面下方的位置，同时仍然保持各种焊球之间的电连接及其相关或封盖/电镀材料，电极柱 ，布线层和电路层。 因此，保护​​整个球窝接头免受直接的压力。