公开(公告)号：US12218479B2

公开(公告)日：2025-02-04

申请号：US17379759

申请日：2021-07-19

Applicant: Apple Inc.

Inventor： SeungJae Lee ,  Brett Sawyer ,  Chia-Te Chou ,  Jerry Byrd ,  Hooman Abediasl

IPC: H01S5/0225 ,  H01S5/02 ,  H01S5/0239

Abstract: Embodiments are directed to a photonic device that includes a first substrate defining a surface and a trench forming a depression along a portion of the surface, and a second substrate coupled with the surface and extending from the surface to form a raised portion around the trench. The photonic device can also include a laser die positioned within the trench, such that the laser die is surrounded by the second substrate, and an optical material positioned within a region between the laser die and the second substrate. The photonic device can further include a third substrate coupled with the second substrate such that the second substrate is positioned between the first substrate and the third substrate such that the second substrate is configured to at least partially isolate the laser die from mechanical stress exerted on the optical device.

公开(公告)号：US11932791B2

公开(公告)日：2024-03-19

申请号：US17431438

申请日：2020-02-14

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Simon Peschke ,  Stefan Lange

IPC: C09K11/77 ,  C01B21/082 ,  H01L33/50 ,  H01S5/0225

CPC classification number: C09K11/77347 ,  C01B21/0823 ,  C09K11/77348 ,  H01L33/502 ,  H01S5/0225 ,  C01P2002/54 ,  C01P2002/76 ,  C01P2002/77

Abstract: A phosphor having the general formula EA7A2T1t1T2t2 T3t3NnOo:RE. EA is selected from the group of divalent elements. A is selected from the group of monovalent elements. T1 is selected from the group of trivalent elements. T2 is selected from the group of tetravalent elements. T3 is selected from the group of pentavalent elements. RE is an activator element. 16+3 t1+4 t2+5 t3−3n−2 o=0. t1+t2+t3=5; n+o=16; 0≤t1≤4; 0≤t2≤5; 0≤t3≤5; 0≤n≤9; 7≤o≤16.

公开(公告)号：US11824325B2

公开(公告)日：2023-11-21

申请号：US17463714

申请日：2021-09-01

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Shingo Totani

IPC: H01S5/06 ,  H01S5/0225 ,  H01S5/00

CPC classification number: H01S5/0611 ,  H01S5/0087 ,  H01S5/0225

Abstract: A multilayer wiring substrate includes a first wiring substrate including a plurality of stacked layers made of a thermo setting resin and having a wiring layer formed between each adjacent layer of the layers in a state in contact with the adjacent layers, a second wiring substrate made of a ceramic, and a joining layer disposed between a back surface of the first wiring substrate and a front surface of the second wiring substrate and configured to join the first wiring substrate and the second wiring substrate to each other, wherein at least a surface of the joining layer adjacent to the second wiring substrate is made of a thermo plastic resin.

公开(公告)号：US20230198231A1

公开(公告)日：2023-06-22

申请号：US17998635

申请日：2021-05-05

Applicant: ams-OSRAM lnternational GmbH

Inventor： Jörg Erich Sorg ,  Markus Reinhard Horn ,  Jan Seidenfaden ,  Harald König

IPC: H01S5/40 ,  H01S5/026 ,  H01S5/06 ,  H01S5/0225 ,  H01S5/10 ,  H01S5/062

CPC classification number: H01S5/4012 ,  H01S5/026 ,  H01S5/0607 ,  H01S5/4087 ,  H01S5/0225 ,  H01S5/1039 ,  H01S5/0622 ,  H01S5/06216 ,  H01S5/305

Abstract: In an embodiment a semiconductor laser component includes a plurality of semiconductor lasers, each of the semiconductor lasers configured to emit primary electromagnetic radiation of a primary spectral bandwidth in a visible wavelength range and a beam combiner configured to combine the primary electromagnetic radiations emitted from the semiconductor lasers, form secondary electromagnetic radiation from a superposition of the primary electromagnetic radiations of the semiconductor lasers and couple the secondary electromagnetic radiation out from the beam combiner, wherein the secondary electromagnetic radiation has a secondary spectral bandwidth that is at least twice as large as an average value of the primary spectral bandwidths.

公开(公告)号：US20230024581A1

公开(公告)日：2023-01-26

申请号：US17062462

申请日：2020-10-02

Applicant: Freedom Photonics LLC

Inventor： Gordon Barbour Morrison ,  Donald J. Kebort

IPC: H01S5/024 ,  H01S5/0225 ,  H01S5/068 ,  H01S5/06 ,  H01S5/40

Abstract: An optical apparatus comprising at least two optoelectronic devices fabricated on the same substrate and in thermal communication with each other. A first optoelectronic device is configured to generate optical signals and provide them to an optical system via an optical output port. A second optoelectronic device is configured to provide heat compensation for the first optoelectronic device. An electrical circuitry provides first electrical signals to the first optoelectronic device and second electrical signals to the second optoelectronic device. The electrical circuitry is configured to adjust at least the second electrical signals to controllably adjust a temperature of the first optoelectronic device.

公开(公告)号：US11355899B2

公开(公告)日：2022-06-07

申请号：US17004955

申请日：2020-08-27

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Bassem Tossoun ,  Di Liang ,  John Paul Strachan

IPC: H01S5/026 ,  H01L45/00 ,  H01S5/042 ,  H01S5/0225 ,  H01S5/30 ,  H01S5/10

Abstract: An optical device includes a light-emitting device integrated with a memory device. The memory device include a first electrode and a second electrode, and the light-emitting device includes a third electrode and the second electrode. In such configuration, a first voltage between the second electrode and the third electrode causes the light-emitting device to emit light of a first wavelength, and a second voltage between the first electrode and the second electrode while the memory device is at OFF state causes the light-emitting device to emit light of a second wavelength shorter than the first wavelength or while the memory device is at ON state causes the light-emitting device to emit light of a third wavelength longer than the first wavelength.

公开(公告)号：US20220158416A1

公开(公告)日：2022-05-19

申请号：US17590773

申请日：2022-02-01

Applicant: NICHIA CORPORATION

Inventor： Soichiro MIURA ,  Kazuma KOZURU

IPC: H01S5/40 ,  H01S5/0225 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/02257

Abstract: A light emitting device includes a base, a lid portion, a plurality of semiconductor laser elements, and a collimate lens. The lid portion is fixed to the base to define a hermetically sealed space by the lid portion and the base. The semiconductor laser elements are provided in the hermetically sealed space. The collimate lens has a non-lens portion fixed to the lid portion, and a plurality of lens portions connected and aligned along one direction and surrounded by the non-lens portion when viewed from a light extracting surface side of the collimate lens.

公开(公告)号：US11336077B2

公开(公告)日：2022-05-17

申请号：US15979694

申请日：2018-05-15

Applicant: Vixar Inc.

Inventor： William Hogan ,  Mary Brenner

IPC: H01S5/183 ,  H01S5/42 ,  H01S5/0225 ,  H01S5/023 ,  H01S5/0233 ,  H01S5/0235 ,  H01S5/02253 ,  H01S5/02325 ,  H01L33/48 ,  H01S5/00 ,  H01S5/02208 ,  H01S5/0237 ,  H01S5/02257 ,  H01S5/02326

Abstract: An optical package having a patterned submount, an optoelectronic device mounted to the patterned submount, a spacer affixed on one side to the patterned submount, the spacer having a bore hole therethrough wherein the optoelectronic device is positioned, and an optical element affixed to the spacer on a side opposite the patterned submount and covering the spacer bore hole. The patterned submount may be a circuit board. The optoelectronic device may be a VCSEL. The spacer may be affixed to the circuit board, for example, using an epoxy preform or an adhesive laminate. The spacer may, for example, be manufactured from a sheet of stainless steel or from a circuit board. The optical element may be, for example, a diffuser, a concave lens, a convex lens, a holographic element, polarizers, or diffraction gratings. The optical element may be affixed to the spacer using an epoxy preform or an adhesive laminate.

公开(公告)号：US20220077652A1

公开(公告)日：2022-03-10

申请号：US17463714

申请日：2021-09-01

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Shingo TOTANI

IPC: H01S5/06 ,  H01S5/0225

Abstract: A multilayer wiring substrate includes a first wiring substrate including a plurality of stacked layers made of a thermo setting resin and having a wiring layer formed between each adjacent layer of the layers in a state in contact with the adjacent layers, a second wiring substrate made of a ceramic, and a joining layer disposed between a back surface of the first wiring substrate and a front surface of the second wiring substrate and configured to join the first wiring substrate and the second wiring substrate to each other, wherein at least a surface of the joining layer adjacent to the second wiring substrate is made of a thermo plastic resin.

公开(公告)号：US11224937B2

公开(公告)日：2022-01-18

申请号：US16065858

申请日：2016-07-21

Applicant: HON HAI PRECISION INDUSTRY CO., LTD

Inventor： Katsuhiko Kishimoto

IPC: B23K26/00 ,  B23K26/57 ,  B23K26/03 ,  B23K26/073 ,  H01S5/062 ,  H01S5/40 ,  H01S5/0225 ,  H01S5/00

Abstract: A line beam irradiation apparatus (1000) includes a work stage (200), a line beam source (100) for irradiating a work (300) placed on the work stage (200) with a line beam; and a transporting device (250) for moving at least one of the work stage (200) and the line beam source (100) such that an irradiation position of the line beam on the work moves in a direction transverse to the line beam. The line beam source includes a plurality of semiconductor laser devices and a support for supporting the plurality of semiconductor laser devices. The plurality of semiconductor laser devices are arranged along a same line extending in a fast axis direction, and the laser light emitted from emission regions of respective ones of the semiconductor laser devices diverge parallel to the same line to form the line beam.